Polyamide resin

Ink Types. There are 10 gravure ink types categorized by the binders or solvents used A, aUphatic hydrocarbon B, aromatic hydrocarbon C, nitrocellulose D, polyamide resins E, SS nitrocellulose M, polystyrene T, chlorinated mbber V, vinyls W, water-based and X, miscellaneous. [Pg.251]

Other. 2-Nitro-1-butanol is an excellent solvent for many polyamide resins, cellulose acetate butyrate, and ethylceUulose. It can be utilized in paint removers for epoxy-based coatings. 2-Hydroxymethyl-2-nitro-l,3-propanediol is usebil for control of odors in chemical toilets. Its slow release of formaldehyde ensures prolonged action to control odor, and there is no reodorant problem which sometimes is associated with the use of free formaldehyde. 2-Hydroxymethyl-2-nitro-l,3-propanediol solutions are effective preservative and embalming fluids. The slow Uberation of formaldehyde permits thorough penetration of the tissues before hardening. [Pg.62]

Printing Inks. Printing ink preparation is similar to many coating systems. The resin is dissolved in the solvent, followed by pigment dispersion to produce the ink. In most printing operations, the solvent must evaporate fast for best production speed. Alcohol—hydrocarbon solvent combinations are used with polyamide resins for some printing processes (see Inks). [Pg.280]

Polyamides. Coating powders based on polyamide resins have been used in fusion-coating processes for along time (1). Nylon-11 [25587-80-8] h.2LS been used almost exclusively however, more recently, coating powders also have been sold based on nylon-12 [24937-16-4]. The properties of these two resins are quite similar. Nylon-6 [25038-54-4] and nylon-6,6 [32131 -17-2] are not used because the melt viscosities are too high. [Pg.318]

Melamine cyanurate is useful in preparation of flame retardant polyamide resins and compositions (133). It also is useful as a soHd lubricant (134). [Pg.422]

Polyamide Resins. Another class of polyamide resins, in addition to the Hquid resins used as epoxy hardeners, are the thermoplastic type, prepared generaHy by the condensation reaction of polyamines with polybasic fatty acids. These resins find use in certain hot-melt adhesives, coatings, and inks. Diamines, typicaHy EDA (233), are the principal amine reactant however, tri- and tetramines are sometimes used at low levels to achieve specific performance. [Pg.47]

The most important coating appHcation for the nonreactive polyamide resins is in producing thixotropy. Typical coating resins such as alkyds, modified alkyds, natural and synthetic ester oils, varnishes, and natural vegetable oils can be made thixotropic by the addition of dimer acid-based polyamide resins (see Alkyd resins). Specialty high performance coating appHcations often requite the properties imparted by dimer acid components. [Pg.117]

Reactive Polyamide Resins. Another significant commercial appHcation of dimer acids is in reactive polyamide resins. These are formed by the reaction of dimer acids with polyamines such as diethylenetriamine to form polyamides containing reactive secondary amine groups (see DiAMlNES AND HIGHER AMINES, aliphatic). In contrast to nonreactive polyamides, these materials are generally Hquids at 25°C. [Pg.117]

D. E. Floyd, Polyamide Resins, 2nd ed., Reinhold Pubhshing Corp., New York, 1966, p. 11. [Pg.118]

Seb cic Acid. Sebacic acid [111-20-6] C QH gO, is an important intermediate in the manufacture of polyamide resins (see Polyamides). It has an estimated demand worldwide of approximately 20,000 t/yr. The alkaline hydrolysis of castor oil (qv), which historically has shown some wide fluctuations in price, is the conventional method of preparation. Because of these price fluctuations, there have been years of considerable interest in an electrochemical route to sebacic acid based on adipic acid [124-04-9] (qv) as the starting material. The electrochemical step involves the Kolbn-type or Brown-Walker reaction where anodic coupling of the monomethyl ester of adipic acid forms dimethyl sebacate [106-79-6]. The three steps in the reaction sequence from adipic acid to sebacic acid are as follows ... [Pg.102]

Other Polyimide Resins. The polyimide category, which includes both the polyetherimide and the polyamide resins discussed eadier, can be broken down into three subdivisions. [Pg.276]

Fig. 5. Examples of ihe correlation between measured adhesive strength and (l+cos6). (a) Plot of data from Raraty and Tabor [171J for adhesion of ice to various solids, (b) Plot of data of Barbaris [172] for adhesion of a mixture of epoxy and polyamide resin to low density poly(ethylene) treated in various ways. Both figures from ref. [31], by permission.

Epoxy-polyamide resin with a powdered oxide filler... [Pg.119]

Thermally nonconductive Polyamides Resin modifier for plastic thrust chamber... [Pg.119]

When the -OH of a carboxylic acid is replaced by an -NH2, the compound produced is an amide. Amides are neutral to mildly basic compounds. They can be made from acids, acid chlorides, acid anhydrides, and esters by reaction with ammonia or primary and secondary amines. The amide linkage is found in polyamide resins such as nylon. [Pg.72]

The Schoeller Superwash 2000 process [132] (i) so-called black box pretreatment (ii) enzyme treatment (iii) application of a low-AOX polyamide resin. [Pg.87]

Figure 6.45 Microbore LC-NMR layout. A Microbore HPLC system with a 0.5 mm X 150 mm C18 column is interfaced to a solenoidal microcoil probe. The transfer capfllary is connected to the NMR flow cell with a polyamide resin. Reproduced from [85] with permission. Copyright 1999 American Chemical Society.

Modacrylic staple fibers Polyamide resins Polyester thermoplastic Co-extruded film Polymelitimide Nylon-12 PVC PS... [Pg.686]

High-performance ahybrid resins were prepared by Yamada et al. (1) having excellent heat resistance and thermal properties. These consisted of hyper-branched polyamide resins derived from the pyromellitic dianhydride with triamines such as 1,3,5-triamino benzene that were postreacted with... [Pg.203]

HMX HMX HMX HMX HMX HMX HMX HMX HMX HMX HMX HMX HNS NTO NTO/HMX NTO/HMX NTO/HMX PETN PETN PETN PETN PETN PETN PETN PETN PETN PETN RDX RDX RDX RDX RDX RDX RDX RDX RDX RDX RDX RDX RDX TATB/HMX Cariflex (thermoplastic elastomer) Hydroxy-terminated polybutadiene (polyurethane) Hydroxy-terminated polyester Kraton (block copolymer of styrene and ethylene-butylene) Nylon (polyamide) Polyester resin-styrene Polyethylene Polyurethane Poly(vinyl) alcohol Poly(vinyl) butyral resin Teflon (polytetrafluoroethylene) Viton (fluoroelastomer) Teflon (polytetrafluoroethylene) Cariflex (block copolymer of butadiene-styrene) Cariflex (block copolymer of butadiene-styrene) Estane (polyester polyurethane copolymer) Hytemp (thermoplastic elastomer) Butyl rubber with acetyl tributylcitrate Epoxy resin-diethylenetriamine Kraton (block copolymer of styrene and ethylene-butylene) Latex with bis-(2-ethylhexyl adipate) Nylon (polyamide) Polyester and styrene copolymer Poly(ethyl acrylate) with dibutyl phthalate Silicone rubber Viton (fluoroelastomer) Teflon (polytetrafluoroethylene) Epoxy ether Exon (polychlorotrifluoroethylene/vinylidine chloride) Hydroxy-terminated polybutadiene (polyurethane) Kel-F (polychlorotrifluoroethylene) Nylon (polyamide) Nylon and aluminium Nitro-fluoroalkyl epoxides Polyacrylate and paraffin Polyamide resin Polyisobutylene/Teflon (polytetrafluoroethylene) Polyester Polystyrene Teflon (polytetrafluoroethylene) Kraton (block copolymer of styrene and ethylene-butylene)... [Pg.12]

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