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ORCIDITC 2011: Anaheim, CA, USA
- Bill Eklow, R. D. (Shawn) Blanton:
2011 IEEE International Test Conference, ITC 2011, Anaheim, CA, USA, September 20-22, 2011. IEEE Computer Society 2011, ISBN 978-1-4577-0153-5 - Bram Kruseman, Bratislav Tasic, Camelia Hora, Jos Dohmen, Hamidreza Hashempour, Maikel van Beurden, Yizi Xing:
Defect Oriented Testing for analog/mixed-signal devices. 1-10 - Rajesh Mittal, Lakshmanan Balasubramanian, Adesh Sontakke, Harikrishna Parthasarathy, Prakash Narayanan, Puneet Sabbarwal, Rubin A. Parekhji:
DFT for extremely low cost test of mixed signal SOCs with integrated RF and power management. 1-10 - Hsiu-Ming Chang, Kwang-Ting Cheng
, Wangyang Zhang, Xin Li, Kenneth M. Butler:
Test cost reduction through performance prediction using virtual probe. 1-9 - Abdullah Mumtaz, Michael E. Imhof, Hans-Joachim Wunderlich:
P-PET: Partial pseudo-exhaustive test for high defect coverage. 1-8 - Tomokazu Yoneda, Keigo Hori, Michiko Inoue, Hideo Fujiwara:
Faster-than-at-speed test for increased test quality and in-field reliability. 1-9 - Yi-Tsung Lin, Jiun-Lang Huang, Xiaoqing Wen:
Clock-gating-aware low launch WSA test pattern generation for at-speed scan testing. 1-7 - Dhruva Acharyya, Kosuke Miyao, David Ting, Daniel Lam, Robert Smith, Pete Fitzpatrick, Brian Buras, John Williamson:
Architecture and implementation of a truly parallel ATE capable of measuring pico ampere level current. 1-10 - Jose Moreira:
Development of an ATE test cell for at-speed characterization and production testing. 1-10 - Yasuhiro Takahashi, Akinori Maeda, Mitsuhiro Ogura:
Actual implementation of multi domain test: Further reduction of cost of test. 1-8 - Guihai Yan, Xiaowei Li:
Online timing variation tolerance for digital integrated circuits. 1-10 - Wing Chiu Tam, R. D. (Shawn) Blanton:
Physically-aware analysis of systematic defects in integrated circuits. 1-10 - Urban Ingelsson, Bashir M. Al-Hashimi:
Investigation into voltage and process variation-aware manufacturing test. 1-10 - Zhaobo Zhang, Krishnendu Chakrabarty, Zhanglei Wang, Zhiyuan Wang, Xinli Gu:
Smart diagnosis: Efficient board-level diagnosis and repair using artificial neural networks. 1-9 - Kenneth P. Parker, Shuichi Kameyama, David Dubberke:
Surviving state disruptions caused by test: A case study. 1-8 - Heiko Ehrenberg, Bob Russell:
IEEE Std 1581 - A standardized test access methodology for memory devices. 1-9 - Ivo Koren, Ben Schuffenhauer, Frank Demmerle, Frank Neugebauer, Gert Pfahl, Dirk Rautmann:
Multi-site test of RF transceivers on low-cost digital ATE. 1-10 - Dragoljub Gagi Drmanac, Michael Laisne:
Wafer probe test cost reduction of an RF/A device by automatic testset minimization - A case study. 1-10 - Aritra Banerjee, Shreyas Sen, Shyam Kumar Devarakond, Abhijit Chatterjee:
Accurate signature driven power conscious tuning of RF systems using hierarchical performance models. 1-9 - Janusz Rajski, Elham K. Moghaddam, Sudhakar M. Reddy:
Low power compression utilizing clock-gating. 1-8 - Yiwen Shi, Kantapon Kaewtip, Wan-Chan Hu, Jennifer Dworak:
Partial state monitoring for fault detection estimation. 1-10 - M. Enamul Amyeen, Andal Jayalakshmi, Srikanth Venkataraman, Sundar V. Pathy, Ewe C. Tan:
Logic BIST silicon debug and volume diagnosis methodology. 1-10 - Ad J. van de Goor, Said Hamdioui, Halil Kukner:
Generic, orthogonal and low-cost March Element based memory BIST. 1-10 - Renan Alves Fonseca, Luigi Dilillo, Alberto Bosio, Patrick Girard, Serge Pravossoudovitch, Arnaud Virazel, Nabil Badereddine:
On using address scrambling to implement defect tolerance in SRAMs. 1-8 - Yi-Chung Chang, Shi-Yu Huang, Chao-Wen Tzeng, Jack T. Yao:
A fully cell-based design for timing measurement of memory. 1-10 - Friedrich Hapke, Jürgen Schlöffel, Wilfried Redemund, Andreas Glowatz, Janusz Rajski, Michael Reese, J. Rearick, Jason Rivers:
Cell-aware analysis for small-delay effects and production test results from different fault models. 1-8 - Priyamvada Vijayakumar, Vikram B. Suresh, Sandip Kundu:
Lithography aware critical area estimation and yield analysis. 1-8 - Anne E. Gattiker, Phil Nigh:
Using well/substrate bias manipulation to enhance voltage-test-based defect detection. 1-6 - George Theodorou, Nektarios Kranitis, Antonis M. Paschalis, Dimitris Gizopoulos:
A Software-Based Self-Test methodology for on-line testing of processor caches. 1-10 - Kuo-An Chen, Tsung-Wei Chang, Meng-Chen Wu, Mango Chia-Tso Chao, Jing-Yang Jou, Sonair Chen:
Design-for-debug layout adjustment for FIB probing and circuit editing. 1-9 - Saeed Shamshiri, Amirali Ghofrani, Kwang-Ting Cheng:
End-to-end error correction and online diagnosis for on-chip networks. 1-10 - Kanad Basu, Prabhat Mishra, Priyadarsan Patra:
Efficient combination of trace and scan signals for post silicon validation and debug. 1-8 - Mitchell Lin, Tyler Tolman:
Analyzing ATE interconnect performance for serial links of 10 Gbps and above. 1-8 - Hideo Okawara:
Elegant construction of SSC implemented signal by AWG and organized under-sampling of wideband signal. 1-8 - Masahiro Ishida, Kiyotaka Ichiyama, Daisuke Watanabe, Masayuki Kawabata, Toshiyuki Okayasu:
Real-time testing method for 16 Gbps 4-PAM signal interface. 1-10 - A. M. Majid, David C. Keezer:
Multi-function multi-GHz ATE extension using state-of-the-art FPGAs. 1-10 - Yuta Yamato, Xiaoqing Wen, Michael A. Kochte, Kohei Miyase, Seiji Kajihara, Laung-Terng Wang:
A novel scan segmentation design method for avoiding shift timing failure in scan testing. 1-8 - Jen-Yang Wen, Yu-Chuan Huang, Min-Hong Tsai, Kuan-Yu Liao, James Chien-Mo Li, Ming-Tung Chang, Min-Hsiu Tsai, Chih-Mou Tseng, Hung-Chun Li:
Test clock domain optimization for peak power supply noise reduction during scan. 1-8 - Swapnil Bahl, Roberto Mattiuzzo, Shray Khullar, Akhil Garg, S. Graniello, Khader S. Abdel-Hafez, Salvatore Talluto:
State of the art low capture power methodology. 1-10 - Stephen K. Sunter, Aubin Roy:
Adaptive parametric BIST of high-speed parallel I/Os via standard boundary scan. 1-9 - Pankaj Pant, Eric Skeels:
Hardware hooks for transition scan characterization. 1-8 - Liang-Chi Chen, Peter Dahlgren, Paul Dickinson, Scott Davidson:
Transition test bring-up and diagnosis on UltraSPARCTM processors. 1-10 - Dilip K. Bhavsar, Steve Poehlman:
Test access and the testability features of the Poulson multi-core Intel Itanium® processor. 1-8 - Sreejit Chakravarty, Binh Dang, Darcy Escovedo, A. J. Haas:
Optimal manufacturing flow to determine minumum operating voltage. 1-10 - Jakub Janicki, Jerzy Tyszer, Avijit Dutta, Mark Kassab, Grzegorz Mrugalski, Nilanjan Mukherjee, Janusz Rajski:
EDT channel bandwidth management in SoC designs with pattern-independent test access mechanism. 1-9 - Manish Sharma, Avijit Dutta, Wu-Tung Cheng, Brady Benware, Mark Kassab:
A novel Test Access Mechanism for failure diagnosis of multiple isolated identical cores. 1-9 - V. R. Devanathan, Srinivas Kumar Vooka:
Techniques to improve memory interface test quality for complex SoCs. 1-10 - Kapil R. Gotkhindikar, W. Robert Daasch, Kenneth M. Butler, John M. Carulli Jr., Amit Nahar:
Die-level adaptive test: Real-time test reordering and elimination. 1-10 - Nik Sumikawa, Dragoljub Gagi Drmanac, Li-C. Wang, LeRoy Winemberg, Magdy S. Abadir:
Forward prediction based on wafer sort data - A case study. 1-10 - Andras Kun, Ralf Arnold, Peter Heinrich, Gwenolé Maugard, Huaxing Tang, Wu-Tung Cheng:
Deterministic IDDQ diagnosis using a net activation based model. 1-10 - Siva Sudani, Minshun Wu, Degang Chen:
A novel robust and accurate spectral testing method for non-coherent sampling. 1-10 - Takahiro J. Yamaguchi, Mani Soma, Takafumi Aoki, Yasuo Furukawa, Katsuhiko Degawa, Kunihiro Asada, Mohamed Abbas, Satoshi Komatsu:
Application of a continuous-time level crossing quantization method for timing noise measurements. 1-10 - Ender Yilmaz, Sule Ozev, Kenneth M. Butler:
Adaptive multidimensional outlier analysis for analog and mixed signal circuits. 1-8 - Brandon Noia, Krishnendu Chakrabarty:
Pre-bond probing of TSVs in 3D stacked ICs. 1-10 - Ken Smith, Peter Hanaway, Mike Jolley, Reed Gleason, Eric Strid, Tom Daenen, Luc Dupas, Bruno Knuts, Erik Jan Marinissen, Marc Van Dievel:
Evaluation of TSV and micro-bump probing for wide I/O testing. 1-10 - Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu:
Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base. 1-10 - Bill Dally:
Power, programmability, and granularity: The challenges of ExaScale computing. 12 - Jyuo-Min Shyu:
A systems perspective on the R&D of industrial technology. 13 - Phil Nigh:
Industry leaders panel - How will testing change in the next 10 years? 1 - Jing Zeng:
Challenges and best practices in advanced silicon debug. 1 - Bailarico Balangue:
In circuit test (ICT): The king is dead; long live the king! 1 - Xinli Gu:
The gap: Test challenges in Asia manufacturing field. 1
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