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2020 – today
- 2024
[c12]Pratik B. Vyas, Ashish Pal, Gregory Costrini, Benjamin Colombeau, Bala Haran, Subi Kengeri, El Mehdi Bazizi:
Gate-All-Around SRAM: Performance Investigation and Optimization Towards Vccmin Scaling. IMW 2024: 1-4- [c11]Leitao Liu, Jingtian Fang, Ashish Pal, Plamen Asenov, Mohit Bajaj, Bei Deng, Xi-Wei Lin, Souvik Mahapatra, Subi Kengeri, El Mehdi Bazizi:
Modeling of Negative Bias Temperature Instability (NBTI) for Gate-All-Around (GAA) Stacked Nanosheet Technology. IRPS 2024: 7 - [c10]Ashish Pal, Sefa Dag, Pratik B. Vyas, Gregory Costrini, Vinod Reddy, Veeraraghavan Basker, Allen Yeong, Benjamin Colombeau, Bala Haran, Subi Kengeri, El Mehdi Bazizi:
Material, Process and System Level Analysis for Parasitic Reduction of Next Generation Logic Technology in Conjunction with Backside Power Delivery. VLSI Technology and Circuits 2024: 1-2 - [c9]Pratik B. Vyas, Ludovico Megalini, Ashish Pal, Joshua Holt, Archana Kumar, Stephen Weeks, Charisse Zhao, Lucien Date, Hansel Lo, Michel Khoury, Safdar Muhammad, Fabian Piallat, Ricky Fang, William Charles, Pratim Palit, Jinghe Yang, Qintao Zhang, Jang Seok Oh, Bryan Turner, Samphy Hong, Aswin Prathap Pitchiya, Benjamin Briggs, Jiao Yang, Dae Yang, Fengshou Wang, Joseph Lee, Gopal Prabhu, Dustin Ho, Carlos Caballero, Durga Chaturvedula, Zheng Yuan, Yi Zheng, David A. Britz, Stephen Krause, Raghav Sreenivasan, Michael Chudzik, Subi Kengeri, Siddarth A. Krishnan, El Mehdi Bazizi:
Novel Material, Process and Device Innovations for Next Generation Silicon Carbide (SiC) Trench MOSFET Technology. VLSI Technology and Circuits 2024: 1-2 - 2023
- [j1]Ashish Pal
, Wei Meng, Satish Nagarajaiah:
Deep Learning-Based Subsurface Damage Localization Using Full-Field Surface Strains. Sensors 23(17): 7445 (2023) - [c8]N. Breil, B.-C. Lee, J. Avila Avendano, J. Jewell, M. Vellaikal, E. Newman, E. M. Bazizi, Ashish Pal, L. Liu, Oleg Gluschenkov, A. Greene, S. Mochizuki, Nicolas Loubet, Benjamin Colombeau, Bala Haran:
Contact Cavity Shaping and Selective SiGe: B Low-Temperature Epitaxy Process Solution for sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs. VLSI Technology and Circuits 2023: 1-2 - [c7]Gaurav Thareja, Ashish Pal, Xingye Wang, Sefa Dag, Shi You, Shashank Sharma, Qing Zhu, Carmen L. Cervantes, Shinjae Hwang, Matthew Spuller, Ben Ng, Pradeep S. Kumar, Norman Tam, Max Gage, Sameer Deshpande, Zhiyuan Wu, Alexander Jansen, Liton Dey, Feng Chen, Xianjin Xie, Keyvan Kashefizadeh, Vinod Reddy, Andy Lo, Zhebo Chen, Sidney Huey, Jianshe Tang, He Ren, Mehul Naik, Brian Brown, Sree Kesapragada, Buvna Ayyagari-Sangamalli, El Mehdi Bazizi, Xianmin Tang:
BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond. VLSI Technology and Circuits 2023: 1-2 - 2021
- [c6]Ashish Pal, Preeti Malakar:
An Integrated Job Monitor, Analyzer and Predictor. CLUSTER 2021: 609-617 - [c5]Liu Jiang, Chang Seok Kang, Ashish Pal, El Mehdi Bazizi, Tomohiko Kitajima, Nancy Fung, Gabriela Alva, Amy Child, Bhaskar Bhuyan, Takehito Koshizawa, Sung-Kwan Kang, Gill Lee, David Hwang, Blessy Alexander, Buvna Ayyagari:
Integration scheme for 3D NAND with nonreplacement word line and its cell characteristics investigation. IMW 2021: 1-4 - 2020
- [c4]Ashish Pal, Preeti Malakar:
MAP: A Visual Analytics System for Job Monitoring and Analysis. CLUSTER 2020: 442-448 - [c3]Mehdi Saremi, Ashish Pal, Liu Jiang, El Mehdi Bazizi, Helen Lee, Xi-Wei Lin, Blessy Alexander, Buvna Ayyagari-Sangamalli:
Modeling and Optimization of Advanced 3D NAND Memory. DRC 2020: 1-2
2010 – 2019
- 2019
- [c2]Sushant Mittal, Ashish Pal, Mehdi Saremi, J. Ferrell, M. Haverty, T. Miyashita, N. Kim, El Mehdi Bazizi, Blessy Alexander, A. B. Sachid, Buvna Ayyagari:
Highly-Doped Through-Contact Silicon Epi Design at 3 nm node. DRC 2019: 55-56 - 2017
- [c1]Ashish Pal, Prateek Parhi, Manuj Aggarwal:
An improved content based collaborative filtering algorithm for movie recommendations. IC3 2017: 1-3
Coauthor Index
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