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2020 – today
- 2022
[c6]Heimanu Niebojewski, Benoit Bertrand, Etienne Nowak
, Thomas Bedecarrats, Bruna Cardoso Paz, Lauriane Contamin, Pierre-André Mortemousque, V. Labracherie, L. Brevard, H. Sahin, Jean Charbonnier, C. Thomas, Myriam Assous, Mikaël Cassé, Matias Urdampilleta, Yann-Michel Niquet, François Perruchot, Fred Gaillard, Silvano De Franceschi, Tristan Meunier, Maud Vinet:
Specificities of linear Si QD arrays integration and characterization. VLSI Technology and Circuits 2022: 415-416- 2020
- [c5]Yvain Thonnart, Stéphane Bernabé, Jean Charbonnier, Christian Bernard, David Coriat, César Fuguet Tortolero, Pierre Tissier, Benoît Charbonnier, Stéphane Malhouitre, Damien Saint-Patrice, Myriam Assous, Aditya Narayan, Ayse K. Coskun, Denis Dutoit, Pascal Vivet:
POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems. DATE 2020: 1456-1461
2010 – 2019
- 2010
- [c4]Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon:
A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. 3DIC 2010: 1-4
2000 – 2009
- 2009
- [c3]Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey:
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC 2009: 1-7 - [c2]Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier:
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 3DIC 2009: 1-4 - [c1]Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon:
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC 2009: 1-5 - 2007
- [j1]Olga Cueto, Myriam Assous, François de Crecy, A. Toffoli, David Bouchu, M. Fayolle, Frédéric Boulanger:
Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects. Microelectron. Reliab. 47(4-5): 769-772 (2007)
Coauthor Index
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