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2010 – 2019
- 2015
[j54]Dao-Long Chen, Tei-Chen Chen, Ping-Feng Yang, Yi-Shao Lai:
Thermal resistance of side by side multi-chip package: Thermal mode analysis. Microelectron. Reliab. 55(5): 822-831 (2015)- [j53]Ee-Hua Wong
, Jarrod Cook, M. Dreno, Dao-Long Chen, Yi-Shao Lai:
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption. Microelectron. Reliab. 55(11): 2331-2335 (2015) - [j52]Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai:
Power electronics packaging. Microelectron. Reliab. 55(12): 2523 (2015) - 2014
- [j51]Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu:
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. Microelectron. Reliab. 54(11): 2471-2478 (2014) - [j50]Wun-Kai Wang, Hua-Chiang Wen, Chun-Hu Cheng, Ching-Hua Hung, Wu-Ching Chou, Wei-Hung Yau, Ping-Feng Yang, Yi-Shao Lai:
Nanotribological properties of ALD-processed bilayer TiO2/ZnO films. Microelectron. Reliab. 54(12): 2754-2759 (2014) - 2013
- [j49]C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai:
Reliability of micro-interconnects in 3D IC packages. Microelectron. Reliab. 53(1): 1 (2013) - [j48]Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai:
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectron. Reliab. 53(2): 297-302 (2013) - 2012
- [j47]Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee:
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectron. Reliab. 52(1): 180-189 (2012) - [j46]Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai:
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. Microelectron. Reliab. 52(2): 301 (2012) - [j45]Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai:
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation. Microelectron. Reliab. 52(3): 541-558 (2012) - [j44]Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai:
Reliability of high-power LED packaging and assembly. Microelectron. Reliab. 52(5): 761 (2012) - [j43]Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao Lai:
The performance and fracture mechanism of solder joints under mechanical reliability test. Microelectron. Reliab. 52(7): 1428-1434 (2012) - [j42]Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang:
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectron. Reliab. 52(11): 2851-2855 (2012) - 2011
- [j41]Michael Mayer, Yi-Shao Lai:
Copper Wire Bonding. Microelectron. Reliab. 51(1): 1-2 (2011) - [j40]Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai:
Fine pitch copper wire bonding in high volume production. Microelectron. Reliab. 51(1): 13-20 (2011) - [j39]Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. Robert Kao:
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. Microelectron. Reliab. 51(1): 125-129 (2011) - [j38]Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai:
Characteristic of copper wire and transient analysis on wirebonding process. Microelectron. Reliab. 51(1): 179-186 (2011) - [j37]Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai:
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectron. Reliab. 51(3): 642-648 (2011) - [j36]Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai:
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectron. Reliab. 51(8): 1372-1376 (2011) - [j35]Ming-Jhang Wu, Hua-Chiang Wen, Shyh-Chi Wu, Ping-Feng Yang, Yi-Shao Lai, Wen-Kuang Hsu, Wen-Fa Wu, Chang-Pin Chou:
Evaluating nanotribological behavior of annealing Si0.8Ge0.2/Si films. Microelectron. Reliab. 51(12): 2223-2227 (2011) - [j34]Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai:
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. Microelectron. Reliab. 51(12): 2263-2273 (2011) - 2010
- [j33]Bo-Ching He, Chun-Hu Cheng, Hua-Chiang Wen, Yi-Shao Lai, Ping-Feng Yang, Meng-Hung Lin, Wen-Fa Wu, Chang-Pin Chou:
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate. Microelectron. Reliab. 50(1): 63-69 (2010) - [j32]Tong Yan Tee, Xuejun Fan, Yi-Shao Lai:
Advances in Wafer Level Packaging (WLP). Microelectron. Reliab. 50(4): 479-480 (2010) - [j31]Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere:
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectron. Reliab. 50(4): 498-506 (2010) - [j30]Jiunn Chen, Yi-Shao Lai, Chueh-An Hsieh, Chia Yi Hu:
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations. Microelectron. Reliab. 50(4): 522-527 (2010) - [j29]Hao-Yuan Chang, Wen-Fung Pan, Meng-Kai Shih, Yi-Shao Lai:
Geometric design for ultra-long needle probe card for digital light processing wafer testing. Microelectron. Reliab. 50(4): 556-563 (2010) - [j28]Bo-Ching He, Hua-Chiang Wen, Meng-Hung Lin, Yi-Shao Lai, Wen-Fa Wu, Chang-Pin Chou:
Effect of annealing treatment and nanomechanical properties for multilayer Si0.8Ge0.2-Si films. Microelectron. Reliab. 50(6): 851-856 (2010)
2000 – 2009
- 2009
- [j27]Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu:
Recent research advances in Pb-free solders. Microelectron. Reliab. 49(3): 221-222 (2009) - [j26]Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan:
Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectron. Reliab. 49(3): 235-241 (2009) - [j25]Jiunn Chen, Yi-Shao Lai:
Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases. Microelectron. Reliab. 49(3): 264-268 (2009) - [j24]S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai:
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. Microelectron. Reliab. 49(3): 310-317 (2009) - [j23]Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai:
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. Microelectron. Reliab. 49(7): 734-745 (2009) - 2008
- [j22]Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin:
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. Microelectron. Reliab. 48(1): 132-139 (2008) - [j21]Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh:
Effects of different drop test conditions on board-level reliability of chip-scale packages. Microelectron. Reliab. 48(2): 274-281 (2008) - [j20]Chang-Lin Yeh, Yi-Shao Lai:
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. Microelectron. Reliab. 48(2): 282-292 (2008) - [j19]Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen:
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. Microelectron. Reliab. 48(3): 389-394 (2008) - [j18]Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen:
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectron. Reliab. 48(5): 757-762 (2008) - [j17]Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen:
Finite element model verification for packaged printed circuit board by experimental modal analysis. Microelectron. Reliab. 48(11-12): 1837-1846 (2008) - 2007
- [j16]Yi-Shao Lai, Tong Hong Wang:
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47(1): 104-110 (2007) - [j15]Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen:
Cyclic bending reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47(1): 111-117 (2007) - [j14]Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen:
Empirical correlation between package-level ball impact test and board-level drop reliability. Microelectron. Reliab. 47(7): 1127-1134 (2007) - [j13]Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen:
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectron. Reliab. 47(8): 1239-1245 (2007) - [j12]Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu:
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47(8): 1273-1279 (2007) - [j11]Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh:
Evaluation of solder joint strengths under ball impact test. Microelectron. Reliab. 47(12): 2179-2187 (2007) - [j10]Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai:
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectron. Reliab. 47(12): 2188-2196 (2007) - 2006
- [j9]Chang-Lin Yeh, Yi-Shao Lai:
Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectron. Reliab. 46(2-4): 626-636 (2006) - [j8]Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh:
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46(2-4): 645-650 (2006) - [j7]Yi-Shao Lai:
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials. Microelectron. Reliab. 46(5-6): 859-863 (2006) - [j6]Chang-Lin Yeh, Yi-Shao Lai:
Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectron. Reliab. 46(5-6): 885-895 (2006) - [j5]Yi-Shao Lai, Chin-Li Kao:
Characteristics of current crowding in flip-chip solder bumps. Microelectron. Reliab. 46(5-6): 915-922 (2006) - [j4]Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao:
Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectron. Reliab. 46(7): 1172-1182 (2006) - [j3]Yi-Shao Lai, Chin-Li Kao:
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectron. Reliab. 46(8): 1357-1368 (2006) - 2005
- [j2]Chang-Lin Yeh, Yi-Shao Lai:
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectron. Reliab. 45(2): 371-378 (2005) - [j1]Yi-Shao Lai, Tong Hong Wang:
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectron. Reliab. 45(3-4): 575-582 (2005)
1990 – 1999
- 1993
- [c1]Ray-Shyan Wu, Yi-Shao Lai:
An Observation on Fractal Characteristics of Individual River Plan Forms. Fractals in the Natural and Applied Sciences 1993: 441-451
Coauthor Index
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