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ORCIDMohd Faizul Mohd Sabri
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2010 – 2019
- 2018
[j8]Bakhtiar Ali
, Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said, Nazatul Liana Sukiman, Iswadi Jauhari, Mohammad Hossein Mahdavifard:
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectron. Reliab. 82: 171-178 (2018)- 2016
- [j7]Bakhtiar Ali, Mohd Faizul Mohd Sabri, Iswadi Jauhari, Nazatul Liana Sukiman:
Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. Microelectron. Reliab. 63: 224-230 (2016) - 2015
- [j6]Mohd Faizul Mohd Sabri, Nor Ilyana Muhd Nordin, Suhana Mohd Said, Nur Aishah Aminah Mohd Amin, Hamzah Arof, Iswadi Jauhari, Roziana Ramli, Kirsten Weide-Zaage:
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. Microelectron. Reliab. 55(9-10): 1882-1885 (2015) - [j5]Mohammad Hossein Mahdavifard, Mohd Faizul Mohd Sabri, Dhafer Abdulameer Shnawah, Suhana Mohd Said, Irfan Anjum Badruddin, S. Rozali:
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy. Microelectron. Reliab. 55(9-10): 1886-1890 (2015) - 2014
- [j4]Nor Ilyana Muhd Nordin, Suhana Mohd Said, Roziana Ramli, Mohd Faizul Mohd Sabri, N. M. Sharif, N. A. F. N. M. Arifin, N. N. S. Ibrahim:
Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test. Microelectron. Reliab. 54(9-10): 2044-2047 (2014) - [j3]T. Tharsika, A. S. M. A. Haseeb, Sheikh A. Akbar, Mohd Faizul Mohd Sabri, Wong Yew Hoong:
Enhanced Ethanol Gas Sensing Properties of SnO2-Core/ZnO-Shell Nanostructures. Sensors 14(8): 14586-14600 (2014) - 2012
- [j2]Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin:
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. Microelectron. Reliab. 52(1): 90-99 (2012) - [j1]Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che:
Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. Microelectron. Reliab. 52(11): 2701-2708 (2012)
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