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Thomas Strach
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2020 – today
- 2022
- [c6]Ofer Geva, Christopher J. Berry, Robert J. Sonnelitter, David Wolpert, Adam Collura, Thomas Strach, Di Phan, Cédric Lichtenau, Alper Buyuktosunoglu, Hubert Harrer, Jeffrey A. Zitz, Chad Marquart, Douglas Malone, Tobias Webel, Adam Jatkowski, John Isakson, Dina Hamid, Mark Cichanowski, Michael Romain, Faisal Hasan, Kevin Williams, Jesse Surprise, Chris Cavitt, Mark Cohen:
IBM Telum: a 16-Core 5+ GHz DCM. ISSCC 2022: 46-48 - 2020
- [j10]Tobias Webel, Preetham M. Lobo, Thomas Strach, Pradeep Bhadravati Parashurama, Srinivas Purushotham, Ramon Bertran, Alper Buyuktosunoglu:
Proactive power management in IBM z15. IBM J. Res. Dev. 64(5/6): 15:1-15:12 (2020)
2010 – 2019
- 2019
- [j9]Christopher J. Berry, David Wolpert, Christos Vezyrtzis, Richard F. Rizzolo, Sean M. Carey, Yaniv Maroz, Hunter F. Shi, Dureseti Chidambarrao, Christian Jacobi, Anthony Saporito, Thomas Strach, Alper Buyuktosunoglu, Preetham Lobo, Pierce Chuang, Pawel Owczarczyk, Ramon Bertran, Tobias Webel, Phillip J. Restle:
IBM z14: Processor Characterization and Power Management for High-Reliability Mainframe Systems. IEEE J. Solid State Circuits 54(1): 121-132 (2019) - 2018
- [j8]Christopher J. Berry, James D. Warnock, John Badar, Dean G. Bair, Erwin Behnen, Brian Bell, Alper Buyuktosunoglu, Chris Cavitt, Pierce Chuang, Ofer Geva, Dina Hamid, John Isakson, Preetham Lobo, Frank Malgioglio, Guenter Mayer, José Luis Neves, Thomas Strach, Jesse Surprise, Christos Vezyrtzis, Tobias Webel, David Wolpert:
IBM z14 design methodology enhancements in the 14-nm technology node. IBM J. Res. Dev. 62(2/3): 9:1-9:12 (2018) - [c5]Christos Vezyrtzis, Thomas Strach, Pierce I-Jen Chuang, Preetham Lobo, Richard F. Rizzolo, Tobias Webel, Pawel Owczarczyk, Alper Buyuktosunoglu, Ramon Bertran, David T. Hui, Susan M. Eickhoff, Michael S. Floyd, Gerard Salem, Sean M. Carey, Stelios G. Tsapepas, Phillip J. Restle:
Droop mitigation using critical-path sensors and an on-chip distributed power supply estimation engine in the z14™ enterprise processor. ISSCC 2018: 300-302 - 2017
- [c4]Pierce I-Jen Chuang, Christos Vezyrtzis, Divya Pathak, Richard F. Rizzolo, Tobias Webel, Thomas Strach, Otto A. Torreiter, Preetham Lobo, Alper Buyuktosunoglu, Ramon Bertran, Michael S. Floyd, Malcolm S. Ware, Gerard Salem, Sean M. Carey, Phillip J. Restle:
26.2 Power supply noise in a 22nm z13™ microprocessor. ISSCC 2017: 438-439 - 2015
- [j7]Wiren Dale Becker, Hubert Harrer, Andreas Huber, W. L. Brodsky, R. Krabbenhoft, M. A. Cracraft, Dierk Kaller, Gregory R. Edlund, Thomas Strach:
Electronic packaging of the IBM z13 processor drawer. IBM J. Res. Dev. 59(4/5) (2015) - [j6]James D. Warnock, Christopher J. Berry, Michael H. Wood, Leon J. Sigal, Yun-Chan Myung, Guenter Mayer, Mark D. Mayo, Y. Chan, Frank Malgioglio, Gerald Strevig, Charudhattan Nagarajan, Sean M. Carey, Gerard Salem, Friedrich Schroeder, Howard H. Smith, Di Phan, Ricardo Nigaglioni, Thomas Strach, Matthew M. Ziegler, Niels Fricke, K. Lind, José Neves, Sridhar H. Rangarajan, J. P. Surprise, John Isakson, John Badar, Doug Malone, Donald W. Plass, A. Aipperspach, Dieter F. Wendel, Robert M. Averill III, Ruchir Puri:
IBM z13 circuit design and methodology. IBM J. Res. Dev. 59(4/5) (2015) - [j5]Tobias Webel, Preetham M. Lobo, Ramon Bertran, Gerard Salem, Malcolm Allen-Ware, Richard F. Rizzolo, Sean M. Carey, Thomas Strach, Alper Buyuktosunoglu, Charles Lefurgy, Pradip Bose, Ricardo Nigaglioni, Timothy J. Slegel, Michael S. Floyd, Brian W. Curran:
Robust power management in the IBM z13. IBM J. Res. Dev. 59(4/5) (2015) - 2014
- [j4]James D. Warnock, Yuen H. Chan, Hubert Harrer, Sean M. Carey, Gerard Salem, Doug Malone, Ruchir Puri, Jeffrey A. Zitz, Adam Jatkowski, Gerald Strevig, Ayan Datta, Anne Gattiker, Aditya Bansal, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, David L. Rude, Leon J. Sigal, Thomas Strach, Howard H. Smith, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb:
Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module. IEEE J. Solid State Circuits 49(1): 9-18 (2014) - [c3]Ramon Bertran, Alper Buyuktosunoglu, Pradip Bose, Timothy J. Slegel, Gerard Salem, Sean M. Carey, Richard F. Rizzolo, Thomas Strach:
Voltage Noise in Multi-Core Processors: Empirical Characterization and Optimization Opportunities. MICRO 2014: 368-380 - 2013
- [c2]James D. Warnock, Yuen H. Chan, Hubert Harrer, David L. Rude, Ruchir Puri, Sean M. Carey, Gerard Salem, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, Adam Jatkowski, Gerald Strevig, Leon J. Sigal, Ayan Datta, Anne Gattiker, Aditya Bansal, Doug Malone, Thomas Strach, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb:
5.5GHz system z microprocessor and multi-chip module. ISSCC 2013: 46-47 - 2012
- [j3]Thomas Strach, Frank E. Bosco, Kenneth L. Christian, Kevin R. Covi, Martin Eckert, Gregory R. Edlund, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller, Martin Kindscher, A. Z. Muszynski, G. A. Peterson, Claudio Siviero, Jochen Supper, Otto A. Torreiter, Thomas-Michael Winkel:
Electronic packaging of the IBM System z196 enterprise-class server processor cage. IBM J. Res. Dev. 56(1): 2 (2012) - [j2]James D. Warnock, Yiu-Hing Chan, Sean M. Carey, Huajun Wen, Patrick J. Meaney, Guenter Gerwig, Howard H. Smith, Yuen H. Chan, John Davis, Paul Bunce, Antonio Pelella, Daniel Rodko, Pradip Patel, Thomas Strach, Doug Malone, Frank Malgioglio, José Neves, David L. Rude, William V. Huott:
Circuit and Physical Design Implementation of the Microprocessor Chip for the zEnterprise System. IEEE J. Solid State Circuits 47(1): 151-163 (2012) - 2011
- [c1]James D. Warnock, Y. Chan, William V. Huott, Sean M. Carey, Michael F. Fee, Huajun Wen, Mary Jo Saccamango, Frank Malgioglio, Patrick J. Meaney, Donald W. Plass, Yuen H. Chan, Mark D. Mayo, Guenter Mayer, Leon J. Sigal, David L. Rude, Robert M. Averill III, Michael H. Wood, Thomas Strach, Howard H. Smith, Brian W. Curran, Eric M. Schwarz, Lee Eisen, Doug Malone, Steve Weitzel, Pak-kin Mak, Thomas J. McPherson, Charles F. Webb:
A 5.2GHz microprocessor chip for the IBM zEnterprise™ system. ISSCC 2011: 70-72
2000 – 2009
- 2009
- [j1]Thomas-Michael Winkel, Hubert Harrer, Dierk Kaller, Jochen Supper, Daniel M. Dreps, Kenneth L. Christian, D. Cosmadelis, Tingdong Zhou, Thomas Strach, J. Ludwig, David L. Edwards:
Packaging design challenges of the IBM System z10 Enterprise Class server. IBM J. Res. Dev. 53(1): 10 (2009)
Coauthor Index
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