"Thermal Stress Analysis of Liquid-Cooled 3D-ICs."

Sakib Islam, Ibrahim M. Abdel-Motaleb (2020)

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DOI: 10.1109/EIT48999.2020.9208317

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-03

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Sakib Islam, Ibrahim M. Abdel-Motaleb:
Thermal Stress Analysis of Liquid-Cooled 3D-ICs. EIT 2020: 132-135

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