"The influence of residual stress induced by anodic wafer bonding on MEMS ..."

Cezary Maj et al. (2014)

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DOI: 10.1109/MIXDES.2014.6872162

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

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Cezary Maj, Piotr Zajac, Michal Szermer, Andrzej Napieralski:
The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties. MIXDES 2014: 93-96

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