"Condition Monitoring of IGBT Modules Based on Changes of Thermal ..."

Kexin Wei et al. (2019)

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DOI: 10.1109/ACCESS.2019.2909928

access: open

type: Journal Article

metadata version: 2025-01-19

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Kexin Wei, Wenbai Wang, Zhen Hu, Mingxing Du:
Condition Monitoring of IGBT Modules Based on Changes of Thermal Characteristics. IEEE Access 7: 47525-47534 (2019)

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