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ORCIDMicroelectronics Reliability, Volume 73
Volume 73, June 2017
- K. R. Suresh Kumar, Dinesh Rajan
, A. Ameelia Roseline, S. Kalaiselvam:
Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling. 1-13 - Olivér Krammer, Balázs Illés, Réka Bátorfi, Karel Dusek:
Automatic characterisation method for statistical evaluation of tin whisker growth. 14-21 - Thales E. Becker, Alisson J. C. Lanot, Guilherme Schwanke Cardoso, Tiago R. Balen:
Single event transient effects on charge redistribution SAR ADCs. 22-35 - Ryouhei Tsurumaki, Naohiro Noda, Kazushige Horio:
Similarities of lag phenomena and current collapse in field-plate AlGaN/GaN HEMTs with different types of buffer layers. 36-41 - Jing Wang, Ruiyang Liu, Dapeng Liu, Seungbae Park:
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions. 42-53 - Marcin Kaluza, Boguslaw Wiecek, Gilbert De Mey, Alkis A. Hatzopoulos, Vasilis Chatziathanasiou:
Thermal impedance measurement of integrated inductors on bulk silicon substrate. 54-59 - Ari Laor, Depayne Athia, Alireza Rezvani, Horst Clauberg, Michael Mayer:
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding. 60-68 - Mingna Wang, Jianqiu Wang, Wei Ke:
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints. 69-75 - Alfred C. T. Quah, Dayanand Nagalingam, Seung Je Moon, Edy Susanto, Ghim Boon Ang, Soh Ping Neo, Jeffrey Lam, Zhihong Mai:
Static fault localization of subtle metallization defects using near infrared photon emission microscopy. 76-91 - Shanshan Liu, Pedro Reviriego, Liyi Xiao, Juan Antonio Maestro:
A method to recover critical bits under a double error in SEC-DED protected memories. 92-96 - Seyed Ebrahim Ghasemi, A. A. Ranjbar, M. J. Hosseini:
Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application. 97-105 - Fengjiang Wang, Dongyang Li, Shuang Tian, Zhijie Zhang, Jiheng Wang, Chao Yan:
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration. 106-115 - Qifeng Zhao, Guoqing Yang, YongJie Sun, PeiFu Yu, Jianjun Chen, Bin Liang:
Research on the effect of single-event transient of an on-chip linear voltage regulator fabricated on 130 nm commercial CMOS technology. 116-121 - Jizhi Liu, Yaohui Zeng, Zhiwei Liu, Jianming Zhao, Cheng Hui, Liu Nie:
Low-voltage triggering SCRs for ESD protection in a 0.35 μm SiGe BiCMOS process. 122-128 - Ramin Rajaei:
Highly reliable and low-power magnetic full-adder designs for nanoscale technologies. 129-135 - Cheolgyu Kim, Tae-Ik Lee, Min Sung Kim, Taek-Soo Kim:
Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing. 136-145 - C. Mukherjee, Thomas Jacquet, Anjan Chakravorty, Thomas Zimmer, Josef Boeck, Klaus Aufinger, Cristell Maneux:
Random telegraph noise in SiGe HBTs: Reliability analysis close to SOA limit. 146-152 - Andreas Kerber:
Assessment of sense measurement duration on BTI degradation in MG/HK CMOS technologies using a novel stacked transistor test structure. 153-157 - Vadimas Verdingovas, Morten Stendahl Jellesen, Rajan Ambat:
Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards. 158-166
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