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2020 – today
- 2024
[j7]Xiaopei Zhu
, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu:
Hiding from thermal imaging pedestrian detectors in the physical world. Neurocomputing 564: 126923 (2024)- 2023
- [j6]Xiaopei Zhu, Zhanhao Hu, Siyuan Huang, Jianmin Li, Xiaolin Hu, Zheyao Wang:
Hiding from infrared detectors in real world with adversarial clothes. Appl. Intell. 53(23): 29537-29555 (2023) - 2021
- [c6]Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu:
Fooling Thermal Infrared Pedestrian Detectors in Real World Using Small Bulbs. AAAI 2021: 3616-3624 - [i1]Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu:
Fooling thermal infrared pedestrian detectors in real world using small bulbs. CoRR abs/2101.08154 (2021)
2010 – 2019
- 2018
- [j5]Ya Mou, Zhanqing Yu, Kaitian Huang, Qing Ma, Rong Zeng, Zheyao Wang:
Research on a Novel MEMS Sensor for Spatial DC Electric Field Measurements in an Ion Flows Field. Sensors 18(6): 1740 (2018) - [c5]Hao Xiong, Zheyao Wang:
Fabrication of Chalcogenide Microlens Array Using Hot Embossing Method. IEEE SENSORS 2018: 1-3 - 2017
- [c4]Kun Zhou, Zhida Zhao, Zheyao Wang:
Fabrication of silicon nanowire pH sensors using high output, low cost sidewall mask technology. IEEE SENSORS 2017: 1-3 - 2016
- [j4]Fan Bu, Qing Ma, Zheyao Wang:
Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride. Microelectron. Reliab. 65: 225-233 (2016) - [c3]Xingjun Xue, Shujie Yang, Dong Wu, Liyang Pan, Zheyao Wang:
Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive. IEEE SENSORS 2016: 1-3 - 2015
- [c2]Cui Huang, Dong Wu, Liyang Pan, Zheyao Wang:
Air-gap/SiO2 liner TSVs with improved electrical performance. 3DIC 2015: TS8.7.1-TS8.7.5 - 2013
- [j3]Qianwen Chen, Wuyang Yu, Cui Huang, Zhimin Tan, Zheyao Wang:
Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners. Microelectron. Reliab. 53(5): 725-732 (2013) - [c1]Mengyun Yue, Dong Wu, Zheyao Wang:
A 15-bit two-step sigma-delta ADC with embedded compression for image sensor array. ISCAS 2013: 2038-2041 - 2012
- [j2]Qianwen Chen, Cui Huang, Zheyao Wang:
Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs). Microelectron. Reliab. 52(11): 2670-2676 (2012)
2000 – 2009
- 2006
- [j1]Zheyao Wang, Jianshe Liu, Litian Liu:
Permittivity measurement of Ba0.5Sr0.5TiO3 ferroelectric thin films on multilayered silicon substrates. IEEE Trans. Instrum. Meas. 55(1): 350-356 (2006)
Coauthor Index
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