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2020 – today
- 2021
[j1]Gregory Houzet
, Thierry Lacrevaz, Cédric Bermond, Philippe Artillan, David Auchère, Laurent Schwarz, Bernard Fléchet:
In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. Microelectron. J. 108: 104990 (2021)
2010 – 2019
- 2014
- [c5]Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet:
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. 3DIC 2014: 1-8 - 2013
- [c4]Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet:
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. 3DIC 2013: 1-8
2000 – 2009
- 2009
- [c3]Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey:
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC 2009: 1-7 - [c2]Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Françis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey:
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking. 3DIC 2009: 1-6 - [c1]Julie Roullard, Stéphane Capraro, Thierry Lacrevaz, Lionel Cadix, Elie Eid, Alexis Farcy, Bernard Fléchet:
Influence of 3D integration on 2D interconnections and 2D self inductors HF properties. 3DIC 2009: 1-6
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