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Paul Hundt

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2000 – 2009

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2001
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Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen:
Wafer level packaging of a tape flip-chip chip scale packages. Microelectron. Reliab. 41(5): 705-713 (2001)

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