"Non-contact wafer-level TSV connectivity test methodology using magnetic ..."

Jonghoon J. Kim et al. (2013)

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DOI: 10.1109/3DIC.2013.6702328

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC 2013: 1-4

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