"Design and manufacturing enablement for three-dimensional (3D) integrated ..."

Arifur Rahman et al. (2012)

> Home

Details and statistics

DOI: 10.1109/CICC.2012.6330588

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/cicc/RahmanSLIR12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/cicc/RahmanSLIR12
Arifur Rahman, Hong Shi, Zhe Li, Dale Ibbotson, Sesh Ramaswami:
Design and manufacturing enablement for three-dimensional (3D) integrated circuits (ICs). CICC 2012: 1-8

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.