"A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave ..."

Meng-Fan Chang et al. (2013)

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DOI: 10.1109/JSSC.2013.2253413

access: closed

type: Journal Article

metadata version: 2024-08-04

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Meng-Fan Chang, Chih-Sheng Lin, Wei-Cheng Wu, Ming-Pin Chen, Yen-Huei Chen, Zhe-Hui Lin, Shyh-Shyuan Sheu, Tzu-Kun Ku, Cha-Hsin Lin, Hiroyuki Yamauchi:
A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave Structure and Self-Timed Differential-TSV for High-Performance Universal-Memory-Capacity-Platforms. IEEE J. Solid State Circuits 48(6): 1521-1529 (2013)

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