"Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint."

Lijuan Liu et al. (2010)

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DOI: 10.1016/J.MICROREL.2009.09.018

access: closed

type: Journal Article

metadata version: 2020-02-22

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Lijuan Liu, Wei Zhou, Hongbo Zhang, Baoling Li, Ping Wu:
Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint. Microelectron. Reliab. 50(2): 251-257 (2010)

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