"High-performance FCBGA based on multi-layer thin-substrate packaging ..."

Tadanori Shimoto et al. (2004)

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DOI: 10.1016/S0026-2714(03)00164-1

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata:
High-performance FCBGA based on multi-layer thin-substrate packaging technology. Microelectron. Reliab. 44(3): 515-520 (2004)

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