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Ran Wang 0002
Person information
- affiliation: Nanjing University of Aeronautics and Astronautics, China
- affiliation (former): Duke University, Department of Electrical and Computer Engineering, Durham, NC, USA
Other persons with the same name
- Ran Wang — disambiguation page
- Ran Wang 0001 — Shenzhen University, College of Mathematics and Statistics, China (and 1 more)
- Ran Wang 0003 — University of Alberta, Department of Earth and Atmospheric Sciences, Edmonton, AB, Canada
- Ran Wang 0004 — Nanjing University of Aeronautics and Astronautics, College of Computer Science and Technology, China (and 1 more)
- Ran Wang 0005 — Huazhong University of Science & Technology, Wuhan, Hubei, China
- Ran Wang 0006 — Beijing University of Posts and Telecommunications, Beijing, China (and 1 more)
- Ran Wang 0007 — Xi'an Jiaotong University, Xi'an, China
- Ran Wang 0008 — East China Normal University, Shanghai, China
- Ran Wang 0009 — Texas A&M University, Department of Aerospace Engineering, College Station, TX, USA
- Ran Wang 0010 — Nanjing University, National Key Laboratory for Novel Software Technology, China
- Ran Wang 0011 — Shanghai Maritime University, College of Logistics Engineering, China (and 1 more)
- Ran Wang 0012 — Communication University of China, School of Data Science and Media Intelligence, China (and 2 more)
- Ran Wang 0013 — Kyoto University, Graduate School of Informatics, Japan
- Ran Wang 0014 — University of Science and Technology Beijing, USTB, School of Computer and Communication Engineering, Shunde Innovation School, China (and 1 more)
- Ran Wang 0015 — Waseda University, Department of Computer Science and Communication Engineering, Tokyo, Japan
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2020 – today
- 2022
- [j14]Qiang Wu, Ran Wang, Xincheng Yan, Chunming Wu, Rongxing Lu:
Intrinsic Security: A Robust Framework for Cloud-Native Network Slicing via a Proactive Defense Paradigm. IEEE Wirel. Commun. 29(2): 146-153 (2022) - 2021
- [j13]Qi Zhu, Haizhou Ye, Liang Sun, Zhongnian Li, Ran Wang, Feng Shi, Dinggang Shen, Daoqiang Zhang:
GACDN: generative adversarial feature completion and diagnosis network for COVID-19. BMC Medical Imaging 21(1): 154 (2021) - 2020
- [j12]Qi Zhu, Nuoya Xu, Zheng Zhang, Donghai Guan, Ran Wang, Daoqiang Zhang:
Cross-spectral palmprint recognition with low-rank canonical correlation analysis. Multim. Tools Appl. 79(45-46): 33771-33792 (2020)
2010 – 2019
- 2018
- [j11]Jie Hao, Xiaoming Yuan, Yanbing Yang, Ran Wang, Yi Zhuang, Jun Luo:
Visible Light Based Occupancy Inference Using Ensemble Learning. IEEE Access 6: 16377-16385 (2018) - [j10]Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori:
Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design and Test Scheduling. ACM Trans. Design Autom. Electr. Syst. 23(3): 35:1-35:25 (2018) - [c13]Jie Hao, Ran Wang, Yi Zhuang, Baoxian Zhang:
A Flexible Network Utility Optimization Approach for Energy Harvesting Sensor Networks. GLOBECOM 2018: 206-212 - [c12]Yang Li, Yunlong Zhao, Zhenhua Zhang, Qian Geng, Ran Wang:
A Collective Computing Architecture Supporting Heterogeneous Tasks and Computing Devices. ICCCS (1) 2018: 13-25 - 2017
- [j9]Ran Wang, Krishnendu Chakrabarty:
Tackling Test Challenges for Interposer-Based 2.5-D Integrated Circuits. IEEE Des. Test 34(5): 72-79 (2017) - [j8]Ran Wang, Guoliang Li, Rui Li, Jun Qian, Krishnendu Chakrabarty:
ExTest Scheduling and Optimization for 2.5-D SoCs With Wrapped Tiles. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(6): 1030-1042 (2017) - [j7]Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty:
Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(8): 1406-1419 (2017) - 2016
- [b1]Ran Wang:
Testing of Interposer-Based 2.5D Integrated Circuits. Duke University, Durham, NC, USA, 2016 - [c11]Ran Wang, Krishnendu Chakrabarty:
Testing of Interposer-Based 2.5D Integrated Circuits: Challenges and Solutions. ATS 2016: 74-79 - [c10]Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori:
Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICs. ATS 2016: 86-91 - [c9]Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty:
Pre-bond testing of the silicon interposer in 2.5D ICs. DATE 2016: 978-983 - [c8]Ran Wang, Krishnendu Chakrabarty:
A design-for-test solution for monolithic 3D integrated circuits. ETS 2016: 1-6 - [c7]Ran Wang, Sergej Deutsch, Mukesh Agrawal, Krishnendu Chakrabarty:
The hype, myths, and realities of testing 3D integrated circuits. ICCAD 2016: 58 - [c6]Ran Wang, Krishnendu Chakrabarty:
Testing of interposer-based 2.5D integrated circuits. ITC 2016: 1-10 - [c5]Ran Wang, Bonita Bhaskaran, Karthikeyan Natarajan, Ayub Abdollahian, Kaushik Narayanun, Krishnendu Chakrabarty, Amit Sanghani:
A programmable method for low-power scan shift in SoC integrated circuits. VTS 2016: 1-6 - 2015
- [j6]Ran Wang, Krishnendu Chakrabarty, Sudipta Bhawmik:
Interconnect Testing and Test-Path Scheduling for Interposer-Based 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(1): 136-149 (2015) - [j5]Ran Wang, Krishnendu Chakrabarty, Sudipta Bhawmik:
Built-In Self-Test and Test Scheduling for Interposer-Based 2.5D IC. ACM Trans. Design Autom. Electr. Syst. 20(4): 58:1-58:24 (2015) - [c4]Ran Wang, Guoliang Li, Rui Li, Jun Qian, Krishnendu Chakrabarty:
ExTest scheduling for 2.5D system-on-chip integrated circuits. VTS 2015: 1-6 - 2014
- [j4]Krishnendu Chakrabarty, Mukesh Agrawal, Sergej Deutsch, Brandon Noia, Ran Wang, Fangming Ye:
Test and Design-for-Testability Solutions for 3D Integrated Circuits. Inf. Media Technol. 9(4): 386-403 (2014) - [j3]Krishnendu Chakrabarty, Mukesh Agrawal, Sergej Deutsch, Brandon Noia, Ran Wang, Fangming Ye:
Test and Design-for-Testability Solutions for 3D Integrated Circuits. IPSJ Trans. Syst. LSI Des. Methodol. 7: 56-73 (2014) - [j2]Ran Wang, Zhaobo Zhang, Xrysovalantis Kavousianos, Yiorgos Tsiatouhas, Krishnendu Chakrabarty:
Built-In Self-Test, Diagnosis, and Repair of MultiMode Power Switches. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(8): 1231-1244 (2014) - [j1]Ran Wang, Krishnendu Chakrabarty, Bill Eklow:
Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(9): 1410-1423 (2014) - [c3]Ran Wang, Krishnendu Chakrabarty, Sudipta Bhawmik:
Built-in self-test for interposer-based 2.5D ICs. ICCD 2014: 181-188 - [c2]Ran Wang, Krishnendu Chakrabarty, Sudipta Bhawmik:
At-speed interconnect testing and test-path optimization for 2.5D ICs. VTS 2014: 1-6 - 2013
- [c1]Ran Wang, Krishnendu Chakrabarty, Bill Eklow:
Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs. Asian Test Symposium 2013: 147-152
Coauthor Index
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