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Di Wu 0060
Person information
- affiliation: Shenzhen University, College of Electronics and Information Engineering, Guangdong, China
- affiliation (2018-2019): Hong Kong Applied Science and Technology Research Institute, ASTRI, Hong Kong
- affiliation (PhD 2018): University of Hong Kong, Hong Kong
- affiliation (2017): University of Wisconsin-Madison, Madison, WI, USA
- affiliation (2010-2012): MediaTek.Inc, MTK
Other persons with the same name
- Di Wu — disambiguation page
- Di Wu 0001 — Sun Yat-Sen University, School of Data and Computer Science, Guangzhou, China (and 3 more)
- Di Wu 0002 — Hunan University, Department of Computer Engineering, Changsha, China (and 2 more)
- Di Wu 0003 — Linköping University, Sweden
- Di Wu 0004 — Chinese Academy of Sciences, Institute of Information Engineering, Beijing, China (and 1 more)
- Di Wu 0005 — Huazhong University of Science and Technology, Wuhan, China
- Di Wu 0006 — MIT Media Lab, Cambridge, MA, USA (and 2 more)
- Di Wu 0007 — Dalian University of Technology, School of Computer Science and Technology, China
- Di Wu 0008 — The Chinese University of Hong Kong, Department of Systems Engineering and Engineering Management, Hong Kong
- Di Wu 0009 — PingAn Insurance Group Company of China Ltd., Shenzhen, China (and 2 more)
- Di Wu 0010 — Falcon Computing Solutions, Inc., Los Angeles, CA, USA (and 1 more)
- Di Wu 0011 — Jilin University, State Key Laboratory of Theoretical and Computational Chemistry, Changchun, China
- Di Wu 0012 — Zhejiang University, College of Biosystems Engineering and Food Science, Hangzhou, China
- Di Wu 0013 — Tsinghua University, Beijing, China
- Di Wu 0014 — Nanjing University, State Key Laboratory for Novel Software Technology, Nanjing, China
- Di Wu 0015 — Nanjing University of Aeronautics and Astronautics, Nanjing, China
- Di Wu 0016 — University of Central Florida, FL, USA (and 2 more)
- Di Wu 0017 — Texas A&M University, College Station, TX, USA
- Di Wu 0018 — Central China Normal University, National Engineering Research Center for E-Learning, Wuhan, China
- Di Wu 0019 — Rutgers University, Winlab, Piscataway, NJ, USA
- Di Wu 0020 — Shanghai University of Engineering Science, Shanghai Collaborative Innovation Center of Laser Advanced Manufacturing Technology, Shanghai, China (and 1 more)
- Di Wu 0021 — Pacific Northwest National Laboratory, Richland, WA, USA
- Di Wu 0022 — CAS, Insitute of Computing Technology, Beijing, China (and 1 more)
- Di Wu 0023 — Beihang University, Robotics Institute, Beijing, China
- Di Wu 0024 — Chinese Academy of Sciences, Beijing Key Laboratory of Space Environment Exploration, Beijing, China
- Di Wu 0025 — Harbin Engineering University, College of Automation, China
- Di Wu 0026 — University of Oklahoma, School of Electrical and Computer Engineering, USA
- Di Wu 0027 — Shaanxi Normal University, Xi'an, China (and 2 more)
- Di Wu 0028 — Harbin Institute of Technology, School of Electronics and Information Engineering, China
- Di Wu 0029 — University of Melbourne, Australia
- Di Wu 0030 — Tongji University, School of Electronics and Information Engineering, Institute of Machine Learning and Systems Biology, Shanghai, China
- Di Wu 0031 — University of Edinburgh, Institute for Digital Communications, Edinburgh, UK
- Di Wu 0032 — Xi'an Jiaotong University, School of Managemen, Xi'an, China
- Di Wu 0033 — Hebei University of Engineering, Department of Information and Electronic Engineering, Handan, China (and 1 more)
- Di Wu 0034 — Georgia Institute of Technology, Atlanta, GA, USA
- Di Wu 0035 — Norwegian University of Science and Technology, Ålesund, Norway (and 2 more)
- Di Wu 0036 — Nankai University, Lianjin, China
- Di Wu 0037 — University of Southern California, Los Angeles, CA, USA
- Di Wu 0038 — Dalian University of Technology, School of Control Science and Engineering, Dalian, China (and 2 more)
- Di Wu 0039 — Dalian University of Technology, School of Software, Dalian, China
- Di Wu 0040 — Chinese Academy of Sciences, CAS Key Laboratory of FAST, National Astronomical Observatories, Beijing, China
- Di Wu 0041 — Harbin Engineering University, College of Computer Science and Technology, Harbin, China (and 1 more)
- Di Wu 0042 — New Jersey Institute of Technology, Advanced Networking Laboratory, Newark, NJ, USA
- Di Wu 0043 — Beihang University, School of Electronic and Information Engineering, Beijing, China
- Di Wu 0044 — McGill University, School of Computer Science, Montreal, Canada
- Di Wu 0045 — University of California at Los Angeles, Electrical Engineering Department, Los Angeles, CA, USA
- Di Wu 0046 — Hunan Institute of Engineering, College of Electrical and Information Engineering, Xiangtan, China
- Di Wu 0047 — Fourth Military Medical University, Department of Psychology, Shaanxi, China
- Di Wu 0048 — Hefei University of Technology, School of Electrical Engineering and Automation, Hefei, China
- Di Wu 0049 — Chinese Academy of Sciences, Changchun Institute of Optics, Fine Mechanics and Physics (CIOMP), Changchun, China
- Di Wu 0050 — University of Southern Queensland, Australia (and 2 more)
- Di Wu 0051 — University of Technology Sydney, School of Civil and Environmental Engineering, Sydney, Australia (and 1 more)
- Di Wu 0052 — Southeast University, School of Automation, Nanjing, China (and 1 more)
- Di Wu 0053 — Johns Hopkins University, Laboratory for Computational Sensing and Robotics, Baltimore, MD, USA (and 1 more)
- Di Wu 0054 — University of California, Los Angeles, CA, USA
- Di Wu 0055 — Hainan Century Frontier Asset Management Co. Ltd, China
- Di Wu 0056 — Southwest University, College of Computer and Information Science, Chongqing, China (and 1 more)
- Di Wu 0057 — Westlake University, Institute of Advanced Technology, CenBRAIN Neurotech, AI Lab, Research Center for Industries of the Future, Hangzhou, China
- Di Wu 0058 — Hainan University, School of Information and Communication Engineering, Haikou, China (and 1 more)
- Di Wu 0059 — Northwestern Polytechnical University, Xi'an, Shaanxi, China (and 2 more)
- Di Wu 0061 — Horizon Robotics, Beijing, China (and 2 more)
- Di Wu 0062 — Xi'an Jiaotong University, School of Computer Science and Technology, Shaanxi, China
- Di Wu 0063 — Harbin Engineering University, Department of Intelligent Systems Science and Engineering, China
- Di Wu 0064 — Beijing University of Technology, Faculty of Information Technology, China
- Di Wu 0065 — University of St Andrews, UK
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2020 – today
- 2023
- [j6]Yu-Xiang Sun, Di Wu, Xiao Sheng Fang, Jian Ren:
On-Glass Grid Structure and Its Application in Highly-Transparent Antenna for Internet of Vehicles. IEEE Trans. Veh. Technol. 72(1): 93-101 (2023) - 2022
- [j5]Min Li, Yujie Zhang, Fan Jiang, Di Wu, Kwan Lawrence Yeung, Lijun Jiang, Ross D. Murch:
Improvement for MIMO Systems by Increasing Antenna Isolation and Shaping Radiation Pattern Using Hybrid Network. IEEE Trans. Ind. Electron. 69(12): 13891-13901 (2022) - 2021
- [j4]Yu-Xiang Sun, Di Wu, Jian Ren:
Millimeter-Wave Dual-Polarized Dielectric Resonator Reflectarray Fabricated by 3D Printing With High Relative Permittivity Material. IEEE Access 9: 103795-103803 (2021) - [j3]Bing Xiao, Hang Wong, Di Wu, Kwan L. Yeung:
Design of Small Multiband Full-Screen Smartwatch Antenna for IoT Applications. IEEE Internet Things J. 8(24): 17724-17733 (2021) - 2020
- [j2]Min Li, Di Wu, Bing Xiao, Kwan Lawrence Yeung, Lijun Jiang:
A Novel Calculation Method to Design Parasitic Decoupling Technique for Two Antennas. IEEE Access 8: 116041-116051 (2020)
2010 – 2019
- 2019
- [j1]Bing Xiao, Hang Wong, Di Wu, Kwan L. Yeung:
Metal-Frame Antenna for Big-Screen Smartphones Using Characteristic Mode Analysis. IEEE Access 7: 122224-122231 (2019)
Coauthor Index
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last updated on 2024-11-21 21:25 CET by the dblp team
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