"A Throughput Study for Channel Bonding in IEEE 802.11ac Networks."

Mun-Suk Kim et al. (2017)

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DOI: 10.1109/LCOMM.2017.2747511

access: closed

type: Journal Article

metadata version: 2020-08-20

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Mun-Suk Kim, Tanguy Ropitault, SuKyoung Lee, Nada Golmie:
A Throughput Study for Channel Bonding in IEEE 802.11ac Networks. IEEE Commun. Lett. 21(12): 2682-2685 (2017)

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