"Thermal Performance Analysis and Prediction of Printed Circuit Boards."

Yi Wan, Hailong Huang (2023)

> Home

Details and statistics

DOI: 10.1142/S0218126623502250

access: closed

type: Journal Article

metadata version: 2023-09-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/jcsc/WanH23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jcsc/WanH23
Yi Wan, Hailong Huang:
Thermal Performance Analysis and Prediction of Printed Circuit Boards. J. Circuits Syst. Comput. 32(13): 2350225:1-2350225:13 (2023)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.