Published July 22, 2019 | Version 2.0
Dataset Open

Dataset: An Open-hardware Platform for MPSoC Thermal Modeling

  • 1. Politecnico di Milano, DEIB

Description

This repository contains the experimental data for the paper

"An Open-hardware Platform for MPSoC Thermal Modeling"

published at 2019 samos conference

http://samos-conference.com

The data is released under a CC-BY Creative Commons license.
If you use this dataset, cite the following paper:
Federico Terraneo, Alberto Leva, William Fornaciari, "An Open-hardware Platform for MPSoC Thermal Modeling", 2019 IEEE International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation (SAMOS)

Files

Files (37.4 MB)

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md5:d399debadf28ed5ed494ea3bae887581
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Additional details

Funding

RECIPE – REliable power and time-ConstraInts-aware Predictive management of heterogeneous Exascale systems 801137
European Commission