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+"balls"; wikilinks, punctuation, and better wording; partially undid revision 890515893 by Ira Leviton (talk): the abbreviations are much more recognizable and easy-to-read for anyone familiar with the subject, so better to keep them
Deleted jargon abbreviations again - reminder: Wikipedia is for general audiences, not just those familiar with the subject. They serve no purpose. (I don't know how to contact somebody with a redlinked user name.) Also moved a wikilink to the first mention of the word, added a wikilink and deleted an incorrect use of uniquely applied to several alloys.
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[[Image:Lead wires.jpg|300px|thumb|right|Several kinds of lead wires. A lead wire is a metal wire connected from the electric pole of an electronics part or an electronic component. The lead wire is a coated copper wire, a tinned copper wire or another electrically conductive wire used to connect two locations electrically.]]
[[Image:Lead wires.jpg|300px|thumb|right|Several kinds of lead wires. A lead wire is a metal wire connected from the electric pole of an electronics part or an electronic component. The lead wire is a coated copper wire, a tinned copper wire or another electrically conductive wire used to connect two locations electrically.]]
In [[electronics]], a '''lead''' ({{IPAc-en|ˈ|l|iː|d}}) is an electrical connection consisting of a length of [[wire]] or a metal pad ([[surface-mount technology]]) that is designed to connect two locations [[electricity|electrically]]. Leads are used for many purposes, including: transfer of power; testing of an electrical [[Circuit (electronics)|circuit]] to see if it is working, using a test light or a [[multimeter]]; transmitting information, as when the leads from an [[Electrocardiography|electrocardiograph]] are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a [[heatsink]]. The tiny leads coming off [[Through-hole technology|through-hole]] [[electronic component]]s are also often called "pins"; in [[ball grid array]] (BGA) packages, they are in form of small spheres, and are therefore called [[Solder ball|"balls"]].
In [[electronics]], a '''lead''' ({{IPAc-en|ˈ|l|iː|d}}) is an electrical connection consisting of a length of [[wire]] or a metal pad ([[surface-mount technology]]) that is designed to connect two locations [[electricity|electrically]]. Leads are used for many purposes, including: transfer of power; testing of an electrical [[Circuit (electronics)|circuit]] to see if it is working, using a test light or a [[multimeter]]; transmitting information, as when the leads from an [[Electrocardiography|electrocardiograph]] are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a [[heatsink]]. The tiny leads coming off [[Through-hole technology|through-hole]] [[electronic component]]s are also often called "pins"; in [[ball grid array]] packages, they are in form of small spheres, and are therefore called [[Solder ball|"balls"]].


Many electrical components such as [[capacitors]], [[resistor]]s, and [[inductor]]s have only two leads, while some [[integrated circuit]]s (ICs) can have several hundred or even more than a thousand for the largest [[ball grid array|BGA]] packages. IC pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead).
Many electrical components such as [[capacitors]], [[resistor]]s, and [[inductor]]s have only two leads, while some [[integrated circuit]]s can have several hundred or even more than a thousand for the largest [[ball grid array]] packages. Integrated circuit pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead).


[[File:CSP(lead-frame) package sideview.PNG|thumb|Lead frame of an SMD package]]
[[File:CSP(lead-frame) package sideview.PNG|thumb|Lead frame of an surface-mount technology package]]
Most kinds of [[integrated circuit packaging]] are made by placing the silicon chip on a '''lead frame''', [[wire bonding]] the chip to the metal leads of that lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins, or "cut short" and bent to form surface-mount leads. Such lead frames are used for surface mount packages with leads&nbsp;– such as [[Small Outline Integrated Circuit]] (SOIC), [[Quad Flat Package]] (QFP)&nbsp;– and for through-hole packages such as [[dual in-line package]] (DIP)&nbsp;– and even for so-called [[Plastic leaded chip carrier#Leadless|"leadless"]] or "no{{nbhyph}}lead" packages<ref>Freescale. [http://www.freescale.com/webapp/sps/site/overview.jsp?code=TM_RD_PKG_LEADFRAME "Lead Frame Packaging Technology"]</ref><ref>Shinko. [http://www.shinko.co.jp/english/product/leadframe/ "IC Package Lead Frame"]</ref>&nbsp;– such as [[Quad Flat No-leads package|Quad Flat No{{nbhyph}}leads package]] (QFN).
Most kinds of [[integrated circuit packaging]] are made by placing a silicon chip on a '''lead frame''', [[wire bonding]] the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins, or "cut short" and bent to form surface-mount leads. Such lead frames are used for surface mount packages with leads&nbsp;– such as [[Small Outline Integrated Circuit]] [[Quad Flat Package]] &nbsp;– and for through-hole packages such as [[dual in-line package]] &nbsp;– and even for so-called [[Plastic leaded chip carrier#Leadless|"leadless"]] or "no{{nbhyph}}lead" packages<ref>Freescale. [http://www.freescale.com/webapp/sps/site/overview.jsp?code=TM_RD_PKG_LEADFRAME "Lead Frame Packaging Technology"]</ref><ref>Shinko. [http://www.shinko.co.jp/english/product/leadframe/ "IC Package Lead Frame"]</ref>&nbsp;– such as [[Quad Flat No-leads package|Quad Flat No{{nbhyph}}leads package]].


The lead frame (and therefore the pins, if any, formed from that lead frame) are occasionally made from [[Invar]] or similar alloys, due to their uniquely low [[coefficient of thermal expansion]].
The lead frame (and therefore the pins, if any, formed from that lead frame) are occasionally made from [[Invar]] or similar alloys, due to their low [[coefficient of thermal expansion]].


==Electrical effects==
==Electrical effects==
For many circuit designs it can be assumed that the leads do not contribute to the electrical effects of individual components. However, this assumption begins to break down at higher [[frequency|frequencies]] and at very small scales. These effects come from the physical construction of the leads. The leads are often metal connections that run from the rest of the circuit to the materials that each component is made of. This design results in a very small capacitance between the ends of the leads where they connect to the device and very small inductances and resistances along each lead. Because the [[electrical impedance|impedance]] of each component is a function of the frequency of the signals being passed through the device and the [[inductance]] and [[capacitance]] of the device the leads can cause substantial variation in the properties of components in [[radio frequency|RF]] circuits.
For many circuit designs it can be assumed that the leads do not contribute to the electrical effects of individual components. However, this assumption begins to break down at higher [[frequency|frequencies]] and at very small scales. These effects come from the physical construction of the leads. The leads are often metal connections that run from the rest of the circuit to the materials that each component is made of. This design results in a very small [[capacitance]] between the ends of the leads where they connect to the device and very small [[inductance]]s and [[electrical resistance|resistances]] along each lead. Because the [[electrical impedance|impedance]] of each component is a function of the frequency of the signals being passed through the device and the inductance and capacitance of the device the leads can cause substantial variation in the properties of components in [[radio frequency]] circuits.


== See also ==
== See also ==

Revision as of 13:39, 13 May 2019

Several kinds of lead wires. A lead wire is a metal wire connected from the electric pole of an electronics part or an electronic component. The lead wire is a coated copper wire, a tinned copper wire or another electrically conductive wire used to connect two locations electrically.

In electronics, a lead (/ˈld/) is an electrical connection consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole electronic components are also often called "pins"; in ball grid array packages, they are in form of small spheres, and are therefore called "balls".

Many electrical components such as capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array packages. Integrated circuit pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead).

Lead frame of an surface-mount technology package

Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins, or "cut short" and bent to form surface-mount leads. Such lead frames are used for surface mount packages with leads – such as Small Outline Integrated Circuit Quad Flat Package  – and for through-hole packages such as dual in-line package  – and even for so-called "leadless" or "no‑lead" packages[1][2] – such as Quad Flat No‑leads package.

The lead frame (and therefore the pins, if any, formed from that lead frame) are occasionally made from Invar or similar alloys, due to their low coefficient of thermal expansion.

Electrical effects

For many circuit designs it can be assumed that the leads do not contribute to the electrical effects of individual components. However, this assumption begins to break down at higher frequencies and at very small scales. These effects come from the physical construction of the leads. The leads are often metal connections that run from the rest of the circuit to the materials that each component is made of. This design results in a very small capacitance between the ends of the leads where they connect to the device and very small inductances and resistances along each lead. Because the impedance of each component is a function of the frequency of the signals being passed through the device and the inductance and capacitance of the device the leads can cause substantial variation in the properties of components in radio frequency circuits.

See also

References