A dual-chiplet Chip-on-Wafer-on-Substrate (CoWoS) was implemented in 7nm 15M process. Each SoC chiplet has four Arm Cortex-A72 processors operating at 4GHz.

Feb 26, 2020 · We present a dual-chiplet interposer-based system-in-package (SiP) octo-core processor using Chip-on-Wafer-on-Substrate (CoWoS) technology.

The built-in eye-scan feature shows the inter-chiplet connection achieves 244mV eye-height and 69% UI eye-width, and Silicon test-chip measurements validate ...

This article presents a clock-forwarded, inverter-based short-reach simultaneous bi-directional (ISR-SBD) physical layer (PHY) targeted for die-to-die ...

The on-die interconnect mesh bus operates above 4 GHz at a 2 mm distance and the inter-chiplet connection features a scalable, power-efficient, high-bandwidth ...

Sep 27, 2019 · Each chiplet features four Arm Cortex-A72 cores running at a whopping 4 GHz (this core was designed to run at <2 GHz frequencies inside mobile ...

Each of the two identical chiplets is implemented in 7-nm CMOS with 15 metal layers and has four Arm Cortex-A72 processor cores operating at 4.0 GHz. A ...

Sep 26, 2019 · Arm and TSMC today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm® cores and leveraging TSMC's Chip-on-Wafer-on-Substrate ...

Sep 26, 2019 · This single proof-of-concept chiplet system successfully demonstrates the key technologies for building an HPC System-On-Chip (SoC) with Arm-based cores ...

Jun 22, 2019 · The chip itself uses TSMC CoWoS (chip on wafer on substrate) 2.5D packaging technology. This means a silicon interposer serves as a substrate ...