This proposed output buffer realizes a new SIP test flow containing a high frequency wafer test and a reduction of the total test cost of embedded DRAM chips by ...
A new variable drivability (VD) output buffer provides the optimum driving ability for both the SIP intra-connection and the high frequency wafer test. This.
A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer Test. ITC 2002: 170-177. [+][–]. Coauthor network.
A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer Test pp. 170. On-Chip Repair and an ATE Independent ...
A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer Test · Author Picture Shigeki Tomishima,; Author Picture ...
This paper makes these incompatible load problems clear and proposes a new output buffer to overcome them. A new variable drivability (VD) output buffer can ...
A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer Test.S. Tomishima, H. Tanizaki, M. Niiro, M. Maruta, H ...
May 8, 2024 · A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer Test. ITC 2002: 170-177; 2001. [j1]. view.
... buffer for the system in a package (SIP) and high frequency wafer test · S ... A new variable drivability (VD) output buffer can provide the optimum driving ...
The sources must be capable of providing up to 6GHz with low phase noise and a power output between -120dBm to 13dBm in .1dB steps. This chapter describes ...
Missing: Drivability (VD)