A digital image correlation (DIC) algorithm was employed to measure microscopic strain-field evolution in shear-loaded model solder interconnections made ...
The changeover from eutectic Sn-Pb solders to lead-free solders has been driven by environmental concerns and market accessibility in the last few years.
Correlation between localized strain and damage in shear-loaded ...
colab.ws › j.microrel.2006.09.025
The measured strain fields were correlated with damage observed at the scale of the sample, and at microscopic length scales. Local strain differs significantly ...
A digital image correlation (DIC) algorithm was employed to measure microscopic strain-field evolution in shear-loaded model solder interconnections made ...
Correlation between localized strain and damage in shear-loaded Pb-free solders. M. A. Martin ; J.G.A. Theeven ; W.P. Vellinga ; M.G.D. Geers.
As shown in Figs. 2 and 3, it is clear that much stronger strain hardening occurs at higher strain rates for both Sn- Pb eutectic and Pb-free SAC 387 alloys ...
The most common mode of failure is ductile fracture due to creep strain. Several methods of predicting the overall life of the solder joint are the Coffin- ...
Sep 8, 2015 · This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia.
Strain field localization and its evolution were measured in a number of Sn-based Pb-free solder interconnections which were mechanically shear loaded. The ...
The deformation behavior of lead free solder joints was characterized under shear loading. The test vehicle was a 0.5mm pitch wafer level chip scale package ...