This study examined the effects of SR dissolution on the solder joint reliability and electroless Ni plating properties.
This study examined the effects of SR dissolution on the solder joint reliability and electroless Ni plating properties. Electroless Ni plating was performed by ...
The electroless nickel immersion gold (ENIG) process results in surface defects, such as pinholes and black pads, which weaken the solder joint and ...
Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere.
Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder. Author(s). Lee, H; Kim, C; Heo, C; Kim, C; Lee, JaeHo; ...
Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder. H. Lee, C. Kim, C. Heo, C. Kim, J. Lee, and Y. Kim.
The principal benefit of ENIG as a surface finish re- lates to the role of the nickel layer, which functions as a barrier to limit the dissolution of underlying ...
化学镀镍浸金（ENIG）工艺会导致表面缺陷，如针孔和黑焊盘，削弱焊点，最终降低PCB的可靠性。电镀溶液的污染，包括阻焊剂（SR）的溶解，可能是针孔和黑焊盘的原因。本研究 ...
In the current study, the results showed that ENIG surface finish had the highest thermal cycling reliability for all solder joint configurations, while ImAg, ...
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Adding alloying elements such as Ni, Mn, and Bi to the low-silver SnAgCu alloy solder can also improve the thermal reliability of the solder joint [51]. Figure ...