This paper describes the limitations and challenges involved in designing gigabit DRAM chips in terms of high-density devices, high-performance circuits, ...

Abstract—This paper describes the limitations and challenges involved in designing gigabit DRAM chips in terms of high- density devices, high-performance ...

A stacked-capacitor (STC) cell concept for 16-Mb DRAMs is introduced. The STC cell features a storage capacitor placed on a bit line and a diagonal active area.

6 days ago · Yet memory-interface designs must overcome significant challenges so product performance and quality can be attained. Newer-generation DDR3 DRAM ...

Mar 25, 2024 · Disadvantages of DRAM · Complex manufacturing process · Data requires refreshing · More complex external circuitry is required (read and refresh ...

Feb 20, 2016 · Watanabe, "Limitations and. Challenges of Multigigabit DRAM Chip Design," IEEE Journal of Solid-. State Circuits, vol. 32, pp. 624-634, May ...

The drawbacks — no gain and the existence of leakage currents in the cell — have been overcome by successive developments in high signal-to-noise (S/N) ratio ...

Nov 20, 2020 · The complexity of today's DRAM technology is driven by many of the same development challenges that impact CPUs, including multi-patterning and ...

Apr 9, 2020 · Signal integrity is now an important issue for signals inside and outside the memory. In addition, that data rate also poses a power challenge.

As AL-DRAM does not determine latency dynamically and instead relies on static latency parameters, it is vulnerable to dynamic changes in latency.