In order to give a better reflow process window of assembled printed circuit board, process optimization was carried out to satisfy a favourable reflow time for ...
In order to give a better reflow process window of assembled printed circuit board, process optimization was carried out to satisfy a favourable reflow time ...
May 1, 2024 · In order to give a better reflow process window of assembled printed circuit board, process optimization was carried out to satisfy a favourable ...
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading. https://doi.org/10.1016/j.mejo.2022.105383.
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading · S. Cong · W.W. Zhang · P. Liu · Y.N. Han · Y.H. ...
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading · Author Picture S. Cong,; Author Picture W.W. ...
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading. Microelectron. J. 121: 105383 (2022). [j2].
Publications (28). Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading · Article. January 2022. ·.
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading · Engineering, Materials Science.
This study investigates the potential for using rubber anti-vibration standoffs to replace metal standoffs as an effective mitigation for enhancing the shock ...
Missing: Process loading.