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This paper presents an electrical circuit model of an entire structure in through silicon via (TSV) based 3-D ICs with a new equation for on-chip interconnect ...
An automation tool is developed to effectively construct SPICE compatible equivalent circuit models of target PDNs using three equation-based algorithms, ...
Dec 12, 2015 · In this paper, we propose an effective model for eval- uating signal propagation delay in vertically stacked chips. The complicated structure of ...
This paper proposes an effective model for evaluating vertical signal propagation delay in through silicon via (TSV) based three-dimensional integrated circuits ...
Signal Propagation Delay Model in Vertically Stacked Chips. Nanako Niioka. ,. Masayuki Watanabe. ,. Masa-aki Fukase. et al. Help me understand this report.
Signal propagation speed among the stacked chips is very important for 3D IC systems. We propose a simple model for analyzing the vertical signal propagation in ...
This paper proposes an effective model for evaluating vertical signal propagation delay in through silicon via (TSV) based three-dimensional integrated ...
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We proposed a new model for analyzing vertical signal propagation delay in 3D ICs. In ten- and several-nm technology, multi-layer interconnects around the ...
To mitigate propagation delay, long interconnects are broken down into shorter segments driven by repeaters (static inverters, see Fig. 4A) [7]. a) Interconnect ...
A simple model for analyzing the vertical signal propagation in through-silicon-via-based 3D ICs is proposed and the impact of physical parameter variations ...