The paper describes the attempts to gain deformation data on ultra small solder joints. It compares creep data that was experimentally gained on bulky samples ...
The paper describes the attempts to gain deformation data on ultra small solder joints. It compares creep data that was experimentally gained on bulky samples ...
The paper describes the attempts to gain deformation data on ultra small solder joints. It compares creep data that was experimentally gained on bulky samples ...
The paper describes the attempts to gain deformation data on ultra small solder joints. It compares creep data that was experimentally gained on bulky samples ...
The effect of downscaling the dimensions of solder interconnects on their creep properties. https://doi.org/10.1016/j.microrel.2008.03.026. Journal ...
TL;DR: The paper describes the attempts to gain deformation data on ultra small solder joints and compares creep data that was experimentally gained on ...
The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties. Wiese S., Roellig M., Mueller M., Wolter K.-.
The paper describes the strategies of characterizing the creep behaviour of SnAg-and SnAgCu-solders through experiments on bulk specimens and on very tiny ...
The effect of downscaling the dimensions of solder interconnects on their creep properties. Autores: S. Wiese, M. Roellig, M. Mueller, K.-J. Wolter ...
Mar 6, 2012 · (2008) The effect of downscaling the dimensions of solder interconnects on their creep properties. Microelectron. Reliab., 48, 843–850 ...