| Application: | Electronics, Industrial |
|---|---|
| Standard: | GB, ASTM |
| Purity: | >99.95% |
|
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| Material | Wt% Molybdenum Content |
Wt% Copper Content |
g/ Density at 20ºC |
W/M.K Thermal conductivity at 25ºC |
(/k) Coefficient of thermal expansion at 20ºC |
| Mo85Cu15 | 851 | Balance | 10 | 160-180 | 6.8 |
| Mo80Cu20 | 801 | Balance | 9.9 | 170-190 | 7.7 |
| Mo70Cu30 | 701 | Balance | 9.8 | 180-200 | 9.1 |
| Mo60Cu40 | 601 | Balance | 9.66 | 210-250 | 10.3 |
| Mo50Cu50 | 500.2 | Balance | 9.54 | 230-270 | 11.5 |
| Thickness (mm) |
Width(mm) | Length(mm) | Surface | Rolled condition | |
| Molybdenum Plate |
8.0-16.0 | 10-1000 | 10-1000 | Alkali washed |
Hot rolled |
| 3.0-8.0 | 10-1000 | 10-1000 | Hot rolled | ||
| Molybdenum sheet |
1.5-3.0 | 10-1000 | 10-2500 | Acid cleaning |
Coled rolled |
| 0.5-1.5 | 10-1000 | 10-2500 | Cold rolled | ||
| 0.2-0.5 | 10-1000 | 10-2500 | Cold rolled |
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