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Co-authors
- Xiuqiang HeHKUST, TencentVerified email at tencent.com
- Dugang LiuGuangdong Laboratory of Artificial Intelligence and Digital Economy (SZ), Shenzhen UniversityVerified email at email.szu.edu.cn
- Fuyuan LyuMcGill University / Mila - Quebec AI InstituteVerified email at mail.mcgill.ca
- qiguang miaoprofessor of xidian university,xi'an, ChinaVerified email at mail.xidian.edu.cn
- Ruiming TangHuaweiVerified email at huawei.com
- Yining Quan Visit scholar of computer science, Wayne State UniversityVerified email at wayne.edu
- Xue (Steve) LiuFellow CAE; Fellow IEEE; Prof@McGill Univ.; VP R&D@Samsung AI; Chair ACM SIGBED; MilaVerified email at cs.mcgill.ca
- Huifeng GuoHuawei, Harbin Institute of TechnologyVerified email at huawei.com
- Shiwei LiHuazhong University of Science and TechnologyVerified email at hust.edu.cn
- zhong ming深圳大学计算机与软件学院教授Verified email at szu.edu.cn
- Hong Zhu (祝宏)HuaweiVerified email at huawei.com
- Yunpeng WengTencentVerified email at tencent.com
- Chen MaAssistant Professor, City University of Hong KongVerified email at cityu.edu.hk
- Zexu SunRenmin University of ChinaVerified email at ruc.edu.cn
- Weike PanProfessor, Shenzhen UniversityVerified email at szu.edu.cn
- Ying ShanDistinguished Scientist at Tencent, Director of ARC Lab & AI Lab CVCVerified email at tencent.com
- Chih-Jen LinDistinguished professor, National Taiwan University and affiliated professor, MBZUAIVerified email at csie.ntu.edu.tw
- Tang JieWeBank Chair Professor, Tsinghua UniversityVerified email at tsinghua.edu.cn