Microstructure local effect for electromigration reliability improvement and Cu damascene lines design rules relaxation

F Bana, D Ney, L Arnaud… - 2013 IEEE International …, 2013 - ieeexplore.ieee.org
Implication of microstructure during electromigration void formation process is studied in this
paper. Dual damascene Cu lines with cathode end width variations are characterized. The …
Save Cite Cited by 5 Related articles

Microstructure local effect for electromigration reliability improvement and Cu damascene lines design rules relaxation

F Bana, D Ney, L Arnaud, Y Wouters - 2013 IEEE International Reliability Physics … - infona.pl
Implication of microstructure during electromigration void formation process is studied in this
paper. Dual damascene Cu lines with cathode end width variations are characterized. The …
Cite