Three-dimensional integrated circuits (3D ICs) offer a significant opportunity to enhance the performance of emerging chip multiprocessors (CMPs) using high density stacked device integration and shorter through silicon via (TSV) interconnects that can alleviate some of the problems associated with interconnect scaling. In this paper we propose and explore a novel multi-layer hybrid photonic NoC fabric (OPAL) for 3D ICs. Our proposed hybrid photonic 3D NoC combines low cost photonic rings on multiple photonic layers with a 3D mesh NoC in active layers to significantly reduce on-chip communication power dissipation and packet latency. OPAL also supports dynamic reconfiguration to adapt to changing runtime traffic requirements, and uncover further opportunities for reduction in power dissipation. Our experimental results and comparisons with traditional 2D NoCs, 3D NoCs, and previously proposed hybrid photonic NoCs (photonic Torus, Corona, Firefly) indicate a strong motivation for considering OPAL for future 3D ICs as it can provide orders of magnitude reduction in power dissipation and packet latencies.