Parasitic effects on nanoassembly processes
T Wich, C Stolle, C Edeler… - 2009 IEEE/RSJ …, 2009 - ieeexplore.ieee.org
T Wich, C Stolle, C Edeler, S Fatikow
2009 IEEE/RSJ International Conference on Intelligent Robots and …, 2009•ieeexplore.ieee.orgThis paper analyzes the disturbance sources acting on nano-assembly systems inside the
scanning electron microscope, which complicate the automation of assembly processes in
the scanning electron microscope. The influence of intrinsic sources, ie thermal drift, actuator
offset and end effector vibrations due to actuator movements are examined and approaches
are suggested. The electron-beam interaction with the assembly system has been identified
as another disturbance source and its impact on automated assembly processes is qualified …
scanning electron microscope, which complicate the automation of assembly processes in
the scanning electron microscope. The influence of intrinsic sources, ie thermal drift, actuator
offset and end effector vibrations due to actuator movements are examined and approaches
are suggested. The electron-beam interaction with the assembly system has been identified
as another disturbance source and its impact on automated assembly processes is qualified …
This paper analyzes the disturbance sources acting on nano-assembly systems inside the scanning electron microscope, which complicate the automation of assembly processes in the scanning electron microscope. The influence of intrinsic sources, i.e. thermal drift, actuator offset and end effector vibrations due to actuator movements are examined and approaches are suggested. The electron-beam interaction with the assembly system has been identified as another disturbance source and its impact on automated assembly processes is qualified and quantified. Solutions for disturbance-resistant assembly processes are suggested.
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