tag: TSMC

Universities Augment Engineering Curricula To Boost Employability
By Liz Allan - 05 Feb, 2025 - Comments: 0

Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Global IC Fabs And Facilities Report: 2024
By Liz Allan - 21 Jan, 2025 - Comments: 0

The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments... » read more

Chip Industry Technical Paper Roundup: Jan. 20
By Linda Christensen - 20 Jan, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=398 /] Find all technical papers here. » read more

Chip Industry Week In Review
By The SE Staff - 17 Jan, 2025 - Comments: 0

GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

Design Space for the Device-Circuit Codesign of NVM-Based CIM Accelerators (TSMC)
By Technical Paper Link - 15 Jan, 2025 - Comments: 0

A new technical paper/mini-review titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by researchers at TSMC and National Tsing Hua University. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devi... » read more

Screening For Known Good Interposers
By Anne Meixner - 14 Jan, 2025 - Comments: 0

Ensuring the quality of silicon and organic interposers is becoming harder as the number of signals passing through them continues to grow, fueled by more chiplets, higher processing demands, and more layers of devices assembled in a package. Interposers initially were viewed as relatively simple conduits. That perception has changed rather dramatically in recent years with the growing focus... » read more

Chip Industry Week In Review
By The SE Staff - 10 Jan, 2025 - Comments: 0

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. In U.S. government news: The U.S. Department of Commerce finalized up to $325 million in CHIPS Act funding for Hemlock Semiconductor, which will support construction of a new semiconductor-grade polysilicon manufac... » read more

Chip Industry Week in Review
By The SE Staff - 03 Jan, 2025 - Comments: 0

Lawrence Livermore National Laboratory is ramping up R&D for next-gen EUV and plasma-based particle sources, aiming to increase the EUV laser source power by an order of magnitude while also making it more energy-efficient. Specifically, the goal is to replace today's CO2-based laser with a solid-state laser, using a thulium-doped yttrium lithium fluoride medium to increase the laser's powe... » read more

Chip Industry Week In Review
By The SE Staff - 20 Dec, 2024 - Comments: 0

Updated for 12/20 government fundings and 12/23 for China trade investigation announcements. President Biden announced a trade investigation into "China's unfair trade practices in the semiconductor sector."  The announcement stated "PRC semiconductors often enter the U.S. market as a component of finished goods. This Section 301 investigation will examine a broad range of the PRC’s non-m... » read more

Chip Industry Week In Review
By The SE Staff - 13 Dec, 2024 - Comments: 0

The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

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