The chip starts out as a thin wafer of P-type silicon. This is then coated with a layer of silicon dioxide -- kind of a silicon rust, which doesn't conduct electricity. On top of this is placed a ...

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

A recent analysis sheds light on the increasing wafer prices and the diminishing transistor density gains Apple faces. Let's rewind to 2013 and the A7, Apple's first 64-bit chip built on TSMC's ...

Cerebras Systems is challenging Nvidia’s AI computing dominance with its Wafer Scale Engine chip, which it said enables superior performance-per-watt and “unprecedented scalability.

One fab was largely converted to manufacture MEMS-based microfluidic products (e.g., inkjet heads, lab-on-chip devices, etc.) and other fabs were upgraded to process 200mm wafers. As the industry has ...

The U.S. Department of Commerce has finalized up to $406M in funding for Taiwanese company GlobalWafers as part of the U.S. CHIPs Act to ramp up domestic silicon wafer production. The company had ...

SOI wafers are widely used in the aerospace, defense industries, and for low-power chips. There is a thing to note though: for now, no U.S. chipmaker processes SOI wafers in high volumes.

The collaboration also includes mainland integrated circuit (IC) packaging firms Jiangsu ... the advanced packaging ...