“The said lands will also be used to support the Gopeng plant in providing for additional car park space and hostels for employees of the company,” said Unisem, adding the acquisition will ...

KUALA LUMPUR: The dearth of orders for electronics chips is continuing to weigh on Unisem (M ... of its Phase 3 plant in Chengdu and the construction of a new plant in Gopeng that is expected ...

CIMB Research projects Unisem’s wafer bumping production capacity to increase from 30k to 38k wafers/month, following Phase 2B expansion of its Chengdu plant in ... of a new management team ...