Experimental results indicate that creep rate of the SAC was greatly affected by electromigration (EM) and its linear dependence on current density and stress ...
Experimental results indicate that creep rate of the SAC was greatly affected by electromigration (EM) and its linear dependence on current density and stress ...
Experimental results indicate that creep rate of the SAC was greatly affected by electromigration (EM) and its linear dependence on current density and stress ...
The creep tests were conducted to investigate the effect of the heat treatments on the mechanical properties of Sn-5wt%Sb lead-free solders. Samples were heat ...
Creep of lead-free Sn-3.8Ag and Sn-3.8Ag-0.7Cu solder alloy as ...
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Oct 22, 2024 · Creep behavior of the tin-based lead-free Sn-3.8Ag and Sn-3.8Ag-0.7Cu alloys together with Sn-37Pb, as the material for comparison, ...
Electromigration (EM), creep, and thermal fatigue (TF) are the most important aspects of the reliability of electronic solder joints, the failure mechanisms ...
Jun 1, 2010 · It was found that the stress relaxation rate was enhanced for the Sn–3.8Ag–0.7Cu solder joints subjected to a current density of 2 × 104 A/cm2.
Nov 11, 2014 · In this study, a series of experiments were carried out on the simple shear lap joint to investigate the effects of current density magnitude on ...
Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling · Materials Science, Engineering. Microelectron. Reliab. · 2011.
In this study, we report an enhanced stress relaxation behavior in the Sn–3.8Ag–0.7Cu solder inter- connection after electromigration. The enhancement ef- fect ...