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PCB Cti Values

The document provides information on materials used for rigid, flexible, metal core, and high frequency printed circuit boards including their glass transition temperatures, coefficient of thermal expansion, dielectric constants, electric strength, surface resistivity, tracking resistance, and peel strengths.

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madslayers
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© © All Rights Reserved
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383 views

PCB Cti Values

The document provides information on materials used for rigid, flexible, metal core, and high frequency printed circuit boards including their glass transition temperatures, coefficient of thermal expansion, dielectric constants, electric strength, surface resistivity, tracking resistance, and peel strengths.

Uploaded by

madslayers
Copyright
© © All Rights Reserved
Available Formats
Download as XLSX, PDF, TXT or read online on Scribd
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http://www.multi-circuit-boards.

eu/en/pcb-design-aid/pc
Materials for rigid circuit boards
Materials for rigid circuit boards

ISOLA Duraver-E-Cu 104i

TG

CTE-z(<Tg)

er

C
135

ppm/C
53

at 1MHz
4,6 - 4,9

135

45

4,6 - 4,9

150

45

4,6 - 4,9

170

55

4.8

170

40

4.9

260

54

4.4

185

140

4.1

180

45

4.4

Standard FR4
ISOLA Duraver-E-Cu 104 KF

FR4 tracking resistant


ISOLA Duraver-E-Cu 156

FR4 halogen-free
ISOLA IS410

High-Tg, CAF-Enhanced
ISOLA IS420

High-Tg, CAF-Enhanced
ISOLA P97

Based on polyimide
ISOLA G200

BT-Epoxy
ITEQ IT-180A

RCC (Resin Coated Copper)

Unless otherwise noted, the CTI (Comparative Tracking Index) which indicates the tracking resistance, is for rigid PCBs: PLC3 (175V - 25
(>600V).

Materials for flexible circuit boards

Materials for flexible circuit boards

DuPont Pyralux AP

TG

CTE-z(<Tg)

er

C
105

ppm/C
25

at 1MHz
3.4

105

3.4

105

3.2

210

55

4.2

TG

CTE-z(<Tg)

er

C
130

ppm/C
-

at 1MHz
4.7

4.2

4.2

Polyimide material
DuPont Pyralux FR

Coverlay
DuPont Pyralux LF

Adhesive
ARLON 85N

Polyimide High-Tg
Materials for metal core boards
Materials for metal core boards
KL Thermal E

Metal Core 1L
Chaoshun CCAF-01

Metal Core 2L
Chaoshun CCAF-04

Metal Core 2L

Chaoshun CCAF-05

4.24

TG

CTE-z(<Tg)

er

C
280

ppm/C
50

3,7@10GHz

220

55

4,5@1MHz

315

64

3,5@1,9GHz

135

2,5@10GHz

70

3,2@10GHz

160

2.28

25

3,0@10GHz

24

6,15@10GHz

16

10,2@10GHz

Metal Core 2L
Materials for high frequency boards
Materials for high frequency boards
Rogers 4350B

Rogers 4350B
ISOLA IS620

E- fibre glass
Taconic RF-35

Ceramic (such as for microwave applications)


Taconic TLX

PTFE
Taconic TLC

PTFE
Rogers RO3001

Bonding Film fr PTFE


Rogers RO3003

PTFE ceramic-filled
Rogers RO3006

PTFE ceramic-filled
Rogers RO3010

PTFE ceramic-filled

rds.eu/en/pcb-design-aid/pcb-materials.html

Electric
Strength

Surface
Resistivity

Tracking
Resistance

Td260

Td288

Td Value

Peel Strength

KV/mm
45

M
1,3 x 10^6

V
>175

min
60

min
-

C
310

N/mm
1.2

4,1 x 10^6

>400

1.6

50

4 x 10^4

60

2 x 10^7

60

30

360

1.3

40

1,1 x 10^6

60

15

340

1.1

53

2,1 x 10^8

>175

18

46

1 x 10^7

>175

20

45

3 x 10^10

60

30

350

ce, is for rigid PCBs: PLC3 (175V - 250V). On request, we are able to produce PCBs with PLC1 (> 400V) or PLC0

Electric
Strength

Surface
Resistivity

Tracking
Resistance

Td260

Td288

Td Value

Peel Strength

KV/mm
150

M
-

V
-

min
60

min
-

C
-

N/mm
1.8

126

1 x 10^7

1.6

120

1 x 10^7

126

1,6 x 10^6

60

60

1.2

Electric
Strength

Surface
Resistivity

Tracking
Resistance

Td260

Td288

Td Value

Peel Strength

KV/mm
-

M
1,1 x 10^6

W/m*K
0.66

min
13

min
3

C
-

N/mm
-

31

5 x 10^7

31

5 x 10^7

1.5

60

3,68 x 10^7

2.2

1.1

Electric
Strength

Surface
Resistivity

Tracking
Resistance

Td260

Td288

Td Value

Peel Strength

KV/mm
31

M
5,7 x 10^9

W/m*K
-

min
-

min

C
390

N/mm
0.9

37

7,3 x 10^6

1.2

1,46 x 10^8

0.24

1.8

1 x 10^7

0.19

2.1

1 x 10^7

0.24

2.1

98

1 x 10^9

0.22

2.1

1 x 10^7

0.5

500

2.2

1 x 10^5

0.79

500

1.2

1 x 10^5

0.95

500

1.6

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