Data Sheet: 74HC14 74HCT14
Data Sheet: 74HC14 74HCT14
DATA SHEET
Philips Semiconductors
Product specication
74HC14; 74HCT14
The 74HC14 and 74HCT14 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC14 and 74HCT14 provide six inverting buffers with Schmitt-trigger action. They are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
TYPICAL SYMBOL tPHL/tPLH CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL VCC2 fo) = sum of the outputs. 2. For type 74HC14 the condition is VI = GND to VCC. For type 74HCT14 the condition is VI = GND to VCC 1.5 V. PARAMETER propagation delay nA to nY input capacitance power dissipation capacitance per gate notes 1 and 2 CONDITIONS HC CL = 15 pF; VCC = 5 V 12 3.5 7 17 3.5 8 HCT ns pF pF UNIT
2003 Oct 30
Philips Semiconductors
Product specication
74HC14; 74HCT14
OUTPUT nY H L
MATERIAL plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic
CODE SOT108-1 SOT108-1 SOT337-1 SOT337-1 SOT27-1 SOT27-1 SOT402-1 SOT402-1 SOT762-1 SOT762-1
DESCRIPTION
2003 Oct 30
Philips Semiconductors
Product specication
74HC14; 74HCT14
handbook, halfpage
handbook, halfpage
1A 1
VCC 14 13 12 6A 6Y 5A 5Y 4A
1A 1Y 2A 2Y 3A 3Y GND
1 2 3 4 5 6 7
MNA839
14 VCC 13 6A 12 6Y
1Y 2A 2Y 2 3 4 5 6
14
11 5A 10 5Y 9 4A
3A 3Y
GND(1)
11 10 9
8 4Y
8 4Y
MBL760
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.
1A
1Y
2 3 4 5 6 4
2A
2Y
3A
3Y
4A
4Y
11
5A
5Y
10
11
10
13
6A
6Y
12 13 12
MNA841
MNA840
2003 Oct 30
Philips Semiconductors
Product specication
74HC14; 74HCT14
handbook, halfpage
1A
1Y
2A
2Y
3A
3Y
6
handbook, halfpage
4A
4Y
Y
MNA843
11
5A
5Y
10
13
6A
6Y
12
MNA842
2003 Oct 30
Philips Semiconductors
Product specication
74HC14; 74HCT14
74HCT14 UNIT MIN. 4.5 0 0 40 40 TYP. 5.0 +25 MAX. 5.5 VCC VCC +85 +125 V V V C C
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK IO ICC; IGND Tstg Ptot PARAMETER supply voltage input diode current output diode current output source or sink current VCC or GND current storage temperature power dissipation Tamb = 40 to +125 C DIP14 packages; note 1 Other packages; note 2 Notes 1. For DIP14 packages: above 70 C the value of PD derates linearly with 12 mW/K. 2. For SO14 packages: above 70 C the value of PD derates linearly with 8 mW/K. For (T)SSOP14 packages: above 60 C the value of PD derates linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 C the value of PD derates linearly with 4.5 mW/K. 750 500 mW mW VI < 0.5 V or VI > VCC + 0.5 V VO < 0.5 V or VO > VCC + 0.5 V 0.5 V < VO < VCC + 0.5 V CONDITIONS MIN. 0.5 65 MAX. +7 20 20 25 50 +150 UNIT V mA mA mA mA C
2003 Oct 30
Philips Semiconductors
Product specication
74HC14; 74HCT14
TYP.(1)
MAX.
UNIT
V V V V V V V V V V A A
0.15 0.16
Tamb = 40 to +85 C VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A IO = 20 A IO = 20 A IO = 4.0 mA IO = 5.2 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 20 A IO = 20 A IO = 4.0 mA IO = 5.2 mA ILI ICC input leakage current quiescent supply current VI = VCC or GND 2.0 4.5 6.0 4.5 6.0 6.0 0.1 0.1 0.1 0.33 0.33 1.0 20 V V V V V A A 2.0 4.5 6.0 4.5 6.0 1.9 4.4 5.9 3.84 5.34 V V V V V
2003 Oct 30
Philips Semiconductors
Product specication
74HC14; 74HCT14
TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = 40 to +125 C VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A IO = 20 A IO = 20 A IO = 4.0 mA IO = 5.2 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 20 A IO = 20 A IO = 4.0 mA IO = 5.2 mA ILI ICC Note 1. All typical values are measured at Tamb = 25 C. input leakage current quiescent supply current VI = VCC or GND 2.0 4.5 6.0 4.5 6.0 6.0 2.0 4.5 6.0 4.5 6.0 1.9 4.4 5.9 3.7 5.2 VCC (V) MIN.
TYP.(1)
MAX.
UNIT
V V V V V V V V V V A A
2003 Oct 30
Philips Semiconductors
Product specication
74HC14; 74HCT14
TYP.(1)
MAX.
UNIT
V V V V A A A
Tamb = 40 to +85 C VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 4.0 mA ILI ICC ICC input leakage current quiescent supply current additional supply current per input VI = VCC or GND VI = VCC or GND; IO = 0 4.5 4.5 5.5 5.5 0.1 0.33 1.0 20 135 V V A A A 4.5 4.5 4.4 3.84 V V
Tamb = 40 to +125 C VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 4.0 mA ILI ICC ICC Note 1. All typical values are measured at Tamb = 25 C. 2003 Oct 30 9 input leakage current quiescent supply current additional supply current per input VI = VCC or GND VI = VCC or GND; IO = 0 4.5 4.5 5.5 5.5 0.1 0.4 1.0 40 147 V V A A A 4.5 4.5 4.4 3.7 V V
Philips Semiconductors
Product specication
74HC14; 74HCT14
TYP.
MAX.
UNIT
V V V V V V V V V
V V V V V V V V V
V V V V V V V V V
2003 Oct 30
10
Philips Semiconductors
Product specication
74HC14; 74HCT14
MIN.
TYP.
MAX.
UNIT
V V V V V V
V V V V V V
V V V V V V
2003 Oct 30
11
Philips Semiconductors
Product specication
74HC14; 74HCT14
TYP.
MAX.
UNIT
41 15 12 19 7 6
125 25 21 75 15 13
ns ns ns ns ns ns
155 31 26 95 19 15
ns ns ns ns ns ns
190 38 32 110 22 19
ns ns ns ns ns ns
2003 Oct 30
12
Philips Semiconductors
Product specication
74HC14; 74HCT14
TYP.
MAX.
UNIT
20 7
34 15
ns ns
Tamb = 40 to +85 C tPHL/tPLH tTHL/tTLH propagation delay nA to nY output transition time see Fig.9 see Fig.9 4.5 4.5 43 19 ns ns
Tamb = 40 to +125 C tPHL/tPLH tTHL/tTLH Note 1. All typical values are measured at Tamb = 25 C. TRANSFER CHARACTERISTIC WAVEFORMS propagation delay nA to nY output transition time see Fig.9 see Fig.9 4.5 4.5 51 22 ns ns
VO
handbook, halfpage
VI
VT+ VT
VH
VH VT VT+
VI
MNA844
VO
MNA845
2003 Oct 30
13
Philips Semiconductors
Product specication
74HC14; 74HCT14
handbook, halfpage
50
MNA846
ICC (A) 40
handbook, halfpage
MNA847
30
0.6
20
0.4
10
0.2
0 0 1 2 3 4 VI (V) 5
VCC = 2 V.
VCC = 4.5 V.
handbook, halfpage
1.0
MNA848
handbook, halfpage
1.5
MNA849
0.6
0.9
0.4
0.6
0.2
0.3
0 0 1 2 3 4 VI (V) 5
VCC = 6 V.
VCC = 4.5 V.
2003 Oct 30
14
Philips Semiconductors
Product specication
74HC14; 74HCT14
handbook, halfpage I
MNA850
1.2
0.9
0.6
0.3
0 0 1 2 3 4 5 VI (V) 6
VCC = 5.5 V.
AC WAVEFORMS
VM
VM
t PLH
90%
t TLH
MNA722
Fig.14 The input (nA) to output (nY) propagation delays and output transitions times.
2003 Oct 30
15
Philips Semiconductors
Product specication
74HC14; 74HCT14
RL = VO 1 k
S1
Definitions for test circuit: RL = Load resistor. CL = load capacitance including jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
2003 Oct 30
16
Philips Semiconductors
Product specication
74HC14; 74HCT14
400
MNA852
handbook, halfpage
400
MNA853
handbook, halfpage
0 0 2 4 VCC (V) 6 1 1 74HC14 : f = -- -----------------T 0.8 RC Linear change of VI between 0.1VCC to 0.9VCC. 1 1 74HCT14 : f = -- --------------------T 0.67 RC
2003 Oct 30
17
Philips Semiconductors
Product specication
74HC14; 74HCT14
SOT108-1
A X
c y HE v M A
Z 14 8
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
8 0o
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
2003 Oct 30
18
Philips Semiconductors
Product specication
74HC14; 74HCT14
SOT27-1
D seating plane
ME
A2
A1
c Z e b1 b 14 8 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001 JEITA SC-501-14 EUROPEAN PROJECTION
2003 Oct 30
19
Philips Semiconductors
Product specication
74HC14; 74HCT14
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
c y HE v M A
14
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
w M detail X
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
2003 Oct 30
20
Philips Semiconductors
Product specication
74HC14; 74HCT14
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm
A A1 E c
detail X
e1 b 6 v M C A B w M C y1 C
C y
1 Eh 14
7 e 8
13 Dh 0
9 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.1 2.9 Dh 1.65 1.35 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT762-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
2003 Oct 30
21
Philips Semiconductors
Product specication
74HC14; 74HCT14
DEFINITION This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).
II
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Oct 30
22
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: [email protected].
SCA75
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613508/03/pp23
Oct 30