05153

Only One Name Means ProTekTion

LC0408FC3.3C - LC0408FC36C

200w low capacitance flip chip tvs array Description

The LC0408FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20s waveform. In addition, the LC0408FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.

Features
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns ESD Protection > 25 kilovolts Available in Voltages Ranging from 3.3V to 36V 200 Watts Peak Pulse Power per Line (tp = 8/20s) Protection for 4 to 7 Lines Bidirectional and Monolithic Structure Low Clamping Voltage Low Capacitance RoHS Compliant REACH Compliant

applications
Cellular Phones MCM Boards Wireless Communication Circuits IR LEDs SMART & PCMCIA Cards

Mechanical characteristics
Standard EIA Chip Size: 0408 Approximate Weight: 0.73 milligrams Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Flammability Rating UL 94V-0 8mm Tape per EIA Standard 481 Top Contacts: Solder Bump 0.004 in Height (Nominal)

PIN CONFIGURATION

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typical device characteristics

MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature

SYMBOL
PPP TA TSTG

VALUE
200 -55 to 150 -55 to 150

UNITS
Watts C C

ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified

PART NUMBER (Note 1) RATED STAND-OFF VOLTAGE V WM VOLTS
LC0408FC3.3C LC0408FC05C LC0408FC08C LC0408FC12C LC0408FC15C LC0408FC24C LC0408FC36C notes 3.3 5.9 8.0 12.0 15.0 24.0 36.0

MINIMUM BREAKDOWN VOLTAGE @ 1mA V(BR) VOLTS

4.0 6.0 8.5 13.3 16.7 26.7 40.0

MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ I P = 1A VC VOLTS

7.0 11.0 13.2 19.8 25.4 37.2 70.0

MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ 8/20s VC @ I PP

12.5V @ 16A 13.0 @ 15A 18.0V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 80.0V @ 2.5A

MAXIMUM LEAKAGE CURRENT (Note 2) @VWM ID A

75* 10** 1 1 1 1 1

TYPICAL CAPACITANCE @0V, 1MHz C pF

70 35 32 30 25 20 18

1. All devices are bidirectional. Electrical characteristics apply in both directions. 2. *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current < 500nA @ 3.3V.

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LC0408FC3.3C - LC0408FC36C

typical device characteristics

figure 1 peak pulse power vs pulse time

10,000

PPP - Peak Pulse Power - Watts

1,000
200W, 8/20s Waveform

100

10

0.1

10 100 td - Pulse Duration - s

1,000

10,000

120
IPP - Peak Pulse Current - % of IPP

figure 2 pulse wave form

tf Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s

100 80
% Of Rated Power

figure 3 power derating curve

Peak Pulse Power 8/20s

100 80 60 40 20 0
0 5

e-t

60 40 20 0
Average Power

td = t/(IPP/2)

10

15 t - Time - s

20

25

30

25 50 75 100 125 TA - Ambient Temperature - C

150

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LC0408FC3.3C - LC0408FC36C

typical device characteristics

figure 4 overshoot & clamping voltage for LC0408fc05c 35

25
5 Volts per Division

15

5 -5
ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape)

figure 5 typical clamping voltage vs peak pulse current LC0408fc05c

12
VC - Clamping Voltage - Volts

10 IPP - Peak Pulse Current - Amps

15

20

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LC0408FC3.3C - LC0408FC36C

SOLDER REFLOW INFORMATION

printed circuit board recommendations
parameter
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP (Entek Cu Plus 106A) 50m 20m 60 seconds 270C

value

Requirements
Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating.

recommended non-solder mask defined pad illustration

Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA.

Solder Stencil Opening 0.330mm DIA.

Maximum Solder Reflow (35-53C Above Maximum Solder Melt Temp)

TP
Temperature - C

Ramp-Up

Solder Melt (Maximum Temp)

Ramp-Down

Preheat (Stay Below Flux Activation Temp) 30-60 seconds Ramp-Up 15 seconds (Minimize)
Page 5

Solder-Time 15-20 seconds

Ramp-Down

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LC0408FC3.3C - LC0408FC36C

0408 package information

outline dimensions
dim
A B C E F G H I Notes 0.076 0.406 1.97 0.15 0.127 0.003 0.016 0.98 0.15 SQ 2.03

millimeters min
0.56 0.86 1.02

inches min
0.022 0.034 0.038 0.078 0.006 0.005 0.040 0.080 0.006 SQ

max

max

1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx 0.05mm (0.002).

TOP

B C G

SIDE

END

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LC0408FC3.3C - LC0408FC36C

0408 package information

Option 1 - layout dimensions
dim
A C D E F G H I Notes
C A D

millimeters nominal
0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51

inches nominal
0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020
SOLDER PRINT 0.010 - 0.012 DIA. SOLDER PADS SOLDER MASK F H G I DIE SOLDER BUMP E

1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx 0.05mm (0.002). 3. Preferred: Usign 0.1mm (0.004) stencil.

Option 2 - layout dimensions

dim
A F G H I Notes

COPPER CONTACT 0.009[0.23] DIA.

millimeters nominal
0.51 0.15 SQ 0.71 0.99 0.51

inches nominal
0.020 0.006 SQ 0.028 0.039 0.020
H G I DIE SOLDER BUMP

1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx 0.05mm (0.002). 3. Preferred: Usign 0.1mm (0.004) stencil.

F SOLDER PRINT 0.014 [0.36] DIA. SOLDER MASK

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LC0408FC3.3C - LC0408FC36C

TAPE AND REEL information

10 Pitches Cumulative Tolerance on tape 0.2 E

P2

P0

Top Cover Tape K0

A0 B0

P User Direction of Feed

specifications
Reel Dia.
178(7)
1. 2. 3. 4. 5. 1.

Tape Width
8

A0

B0

K0

P0

P2

tmax
0.25

0.80 0.10 1.20 0.10 0.70 0.10 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.20 4.00 0.12 2.00 0.05 2.00 0.10

Notes

Dimensions in millimeters. Top view of tape. Solder bumps are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7 Reels - 5,000. Marking on reel: part number, date code and lot number.

tape & reel orientation

Quad Die - 0408

Package outline, pad layout and tape specifications per document number 06021.R5 9/09.

ORDERING INFORMATION
base PART NUMBER (xx = voltage)
LC0408FCxxC

LEADFREE SUFFIX
-LF

TAPE SUFFIX
-T75-1

QTY/REEL
5,000

REEL SIZE
7

TUBE qty
n/a

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LC0408FC3.3C - LC0408FC36C

company information
COMPANY PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: [email protected] Customer Service: [email protected] Technical Support: [email protected] Web www.protekdevices.com www.protekanalog.com

COPYRIGHT ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyers and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. D456,367S.

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