Diptrace Pattern
Diptrace Pattern
Diptrace Pattern
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7/22/2014
How to use?!
Pattern name carries information about pattern type and number of various parameters like
pitch, width, number of pads e.t.c., divided by columns. Each column has a number which links
to corresponding item in description. Look at the example below:
PDFN
Type
10
1
R
2
4x4
3
0.8
4
Description:
1) Number of pads, excluding the central pad
2) Special pad parameters:
P - Package w ith peg leads*
NP - no central pad*
R - rectangular pad*
L - oblong pad*
V - similar package of the same name*
3) Size of the package, (x;y), (mm)
4) Pitch, (mm).
*Letters in pattern's type description show all possible variants of packages of this type.
According to the table and description above, we can say that this is 4 by 4 mm Pullback Dual
Flat No-Lead (PDFN)** package with 10 rectangular (R) pads (except center pad) and 0.8 mm
pitch. It belongs to DFN library. This information is all you need in order to decide if this
package fits.
**Meaning of abbreviation is indicated in library description. For example,
DFN library consists of DFN and PDFN pattern types.
General
General
Description:
Special library with most basic and popular components of different types and libraries.
1.1
HDR
HDR
Type
1
1
10
2
H
3
1.2
IDC
IDC
Type
10
1
F
2
Batteries
Description:
Names of the packages completely or partially match the names of components.
BGA
Ball Grid Array
3.1
BGA
BGA - 100 /
Type
1
10x10
2
_ 7x7
0.65
3
BGA
Type
Novarm Limited 2014
60
1
9x12
2
0.8x1
3
8x13
4
BQFP
Bumper Quard Flat Packages
4.1
BQFP
BQFP
Type
- 100
1
V
2
22.4x22.4
3
0.635
4
1) Number of pads
2) V - Variant of the package
3) Size of the package, with leads, (x;y), (mm)
4) Pitch, (mm).
CAP
Capacitors
CAPD - Diagonal
CAPO - Oval
CAPP - Polar
CAPPR - P - polar, R - round
CAPR - Round
CAPT - Tantalum
5.1
CAP
CAP - 17.8 / 13x21
Type
1
2
1) Pad spacing, (mm)
2) Size of the package, (x;y), (mm). These packages are round, so "y" is, actually, a
diameter.
5.2
CAPD
CAPD Type
10 x 1.3 /
1
2
7x4
3
CAP
5.3
CAPO
CAPO
Type
- 2.54 / 3.05x1.78
1
2
5.4
CAPP
CAPP - 0.76 / 1.27x1.02
Type
1
2
1) Pad spacing, X-axis, (mm)
2) Size of the package, (x;y), (mm).
5.5
CAPP3
CAPP3 Type
2.54
1
7.1x6.85
2
5.6
CAPPR
CAPPR - 0.76 /
Type
1
1.45 h 2.54
2
3
CAPPR Type
10
1
d2.3
2
22.5
3
42
4
5.7
CAPR
CAPR Type
2.5
1
6.3
2
11
3
5.8
CAPT
CAPT
Type
- 10.6 / 14x3.5
1
2
CAP_SMD
SMD Capacitors
CAPA - Array
CAPAE - A - aluminum, E - electrolytic
TC - Tantalum capacitor
6.1
CAP
CAP _
Type
04
1
02
2
18
1
25
2
CAP _
Type
6.2
CAPA
CAPA
Type
10
1
3.1x6.4
2
1.27
3
1) Number of pads
V - variant of the package
2) Size of the package, (x;y), (mm)
3) Pitch, (mm).
Novarm Limited 2014
CAP_SMD
6.3
CAPAE
CAPAE Type
5.3x5.3
1
h 6.1
2
6.4
TC
TC
Type
08
1
05
2
29
1
17
2
TC
Type
CFP
Ceramic Flat Packages
7.1
CFP
CFP - 10 /
Type
1
6
2
x 1.27
3
1) Number of pads
2) Size of the package, X-axis, (mm)
3) Pitch, (mm).
Con Backplane
Backplane Connectors
8.1
PCI
PCI
Type
1) Pitch (X-axis), (mm)
2.54
1
2
2
H
3
56
4
Con Batteries
Battery connectors
Description:
Names of the packages completely or partially match the names of components.
10
Con D-Sub
DSUB Connectors
10.1
CHAMP
CHAMP - 1.27 /
Type
1
2
2
H
3
100
4
1) Pitch, (mm)
2) Number of mounting holes
3) Direction of the package:
H - horizontal,
V - vertical
4) Number of pads, except mounting holes.
10.2
DB
DB
Type
15
1
1.385
1
F
2
10.3
DSUB
DSUB
Type
2
2
H
3
15
4
1) Pitch, (mm)
2) Number of mounting holes
3) Direction of the package:
H - horizontal
V- vertical
4) Number of pads, except mounting holes
Con D-Sub
DSUB
Type
- 1.385
1
2
2
H
3
15
4
A
5
1) Pitch, (mm)
2) Number of mounting holes
3) Direction of the package:
H - horizontal
V- vertical
4) Number of pads, except mounting holes
5) A, B, C - style of the package.
11
11.1
ECON
ECON
Type
20
1
100
2
11.2
SCARD
SCARD
Type
1.27
1
2
2
V
3
120
4
2.54
5
x 2.54 / Sh 95x19
6
7
8
1) Pitch, (mm)
2) Number of mounting holes
3) Direction of the package:
V - vertical
H - horizontal
4) Number of pads, except mounting holes.
12
Con Headers
Header Connectors
HDR - Male contact
HDRF - Female contact
12.1
HDR
HDR
Type
3
1
x 30
2
T
3
H
4
HDR
Type
1
1
3
2
S
3
Z
4
2
5
6x6
6
12.2
HDRF
HDRF
Type
2
1
2
2
T
3
/ 1.27
4
1.27
5
3x3
6
13
Con Jacks
Jack Connectors
Description:
Names of the packages completely or partially match the names of components.
Novarm Limited 2014
14
14.1
DIMM
DIMM
Type
- 1.27 /
1
2
2
V
3
168
4
A
5
2
2
H
3
80
4
1) Pitch, (mm)
2) Number of mounting holes
3) Direction of the package :
H - horizontal
V - vertical
4) Number of pads, except mounting holes
5) Style of the package: (A, B, C).
14.2
SIMM
SIMM
Type
1.27
1
1) Pitch, (mm)
2) Number of mounting holes
3) Direction of the package:
V - vertical
H - horizontal
4) Total number of pads, except mounting holes.
15
Con Power
Power Connectors, DC Jacks
Description:
Names of the packages completely or partially match the names of components.
16
17
10
11
17.1
MCX
MCX
Type
5.08
1
H
2
5
3
18
Con TB Headers
Terminal Block Connectors, Headers
18.1
TBH
TBH -
Type
24
/ 3.81 15.24
4
Sh
93x22
TBH -
x 19
Type
/ 5.08 x 15.24 /
5
2
7
Sh 99x22
8
Con TB Headers
12
Z - zig-zag
Regular - if empty
5) Pitch by X-axis, (mm)
6) Pitch by Y-axis, (mm)
7) Number of shrouded sides
8) Package design type:
Sh - shrouded
Regular - if empty
9) Size of the package, (x;y), (mm).
18.2
TBHF
TBHF
Type
1
1
2
2
H
3
3.5
4
7x15
5
/ 30x31 /
Sc _
19
19.1
TB
TB
Type
2
1
4
2
/ 15 12.5
3
H
7
13
TB
Type
1
1
9
2
Z
3
3.5
3
9.52
4
x 7.62
5
/ 86x16
6
TB
Type
1
1
8
2
29x8
4
/ Sc _
5
V
6
20
Con USB
Universal Serial Bus (USB) Connectors
Description:
Names of the packages completely or partially match the names of components.
20.1
USB
USB
Type
2.0
1
4
1
H
2
4
3
1)Pitch, (mm)
2)Number of mounting holes
3)Direction of the package
4)Number of pads.
A, B, C, D, E, F-model
CQFP
21
CQFP
Ceramic quad flat pack
21.1
CQFP
CQFP
Type
22
Crystals
Crystal Oscillators
Description:
Names of the packages completely or partially match the names of components.
23
DBS
DIL- bent packages
23.1
DBS
DBS
Type
27
1
HR
2
29
3
2.54
4
24
DFN
Dual flat no-lead packages
PDFN - Pullback packages
24.1
DFN
DFN
Type
14
1
RL
2
5x6
3
0.8
4
1
5
14
15
24.2
PDFN
PDFN
Type
10
1
R
2
4x4
3
0.8
4
25
Diodes
25.1
DIO
DIO
Type
04
1
02
2
DIO
Type
18
1
12
2
25.2
DO
DO
Type
13
1
1) Model.
Diodes
25.3
SOD
SOD
Type
100
1
1) Model
SOD
Type
3.6
1
2.2
2
1) Pitch, (mm)
2) Size of the package, X-axis, (mm).
25.4
SM
SM
Type
A
Model*
* A, B, C - model identifiers.
26
Diodes Bridge
Diode Bridges
Description:
Names of the packages completely or partially match the names of components.
27
DIP
Dual in-line packages
27.1
DIP
DIP
Type
18
1
1) Number of pads.
Standard package with 2.54 mm pitch and 300 mil distance between rows of pads.
DIP
Type
14
1
(16)
2
TP
3
16
17
DIP
Type
11
1
(26)
2
900mil
3
DIP
Type
14
1
L22.6
2
DIP
Type
28
1
600mil
2
/x
1.778
3
28
28.1
DIP
DIP
Type
10
1
(16)
2
S
3
DIP
Type
40
1
S
2
600mil
3
DIP
Type
6
1
S
2
1600mil
3
56x56
4
29
DIP_SMD
Dual in-line packages with SMD Pads
SDIP - Footprint for DIP packages with bent and cut leads
SDIP- ___V - Footprint for packages with cut leads
29.1
SDIP
SDIP
Type
48
1
600mil
2
1) Number of pads
2) Distance between axes of pad lines
V - variant of the package
30
Displays
Display packages
30.1
DIP
DIP
Type
13
1
(18)
2
D
3
600mil
4
20
5
18
19
31
Inductors
31.1
IND
IND
Type
04
1
02
2
IND
Type
12
1
10
2
IND
Type
400
1
32
LCC
Leaded and leadless chip carriers
CLCC - Ceramic
RLCC - Rectangular package (number of vertical pads always isn't equal to horizontal
pads)
32.1
LCC
LCC
Type
- 24 / 10.2x10.2 x 1.27
1
2
3
32.2
CLCC
CLCC - 16 / 17.3 x 1.27
Type
1
2
3
1) Total number of pads
2) Distance between edges of leads, (mm)
3) Pitch, (mm).
LCC
32.3
20
RLCC
RLCC Type
10
1
REP
2
3.2x5
3
1.27
3
1.27
3
33
LGA
Land grid array
33.1
LGA
LGA
Type
118
1
12x12
2
15x15
4
34
Misc
MISC - Miscellaneous
Description:
Names of the some packages completely or partially match the names of components.
Lots of packages of different types are stored in this library.
34.1
QIP
QIP
Type
80
1
S
2
1100mil
3
1500mil
4
21
34.2
RSFM
RSFM Type
10
1
(12)
2
1) Number of pads
2) Imaginary number of pads
RSFM Type
3
1
L38
2
19
3
x 23.8
4
1) Number of pads
2) L - length of the package, (mm).
34.3
SMS
SMS
Type
9
1
R
2
2.54
5
35
35.1
MH
MH
Type
#2-48
1
2.45
2
7.4
3
MH
Type
M2x0.4
1
2.3
2
6
3
22
35.2
PAD
Pad
Type
#2-48
1
(PH)
2
2.45
3
5
4
Pad
Type
M2x0.4
1
(PH)
2
2.3
3
4.8
4
36
PGA
Pin grid array
36.1
PGA
PGA
Type
- 100
1
10
2
x 10
3
x 2.54 _ 27x27
4
5
37
PLCC
Plastic leaded chip carriers
RPLLC - Rectangular package (number of vertical pads always isn't equal to horizontal
pads)
23
37.1
PLCC
PLCC
Type
20
1
8.97x8.97
2
1.27
3
37.2
RPLCC
RPLCC
Type
32
1
11.45x14
2
1.27
3
1) Number of pads
2) Size of the package, (x;y), (mm)
3) Pitch, (mm).
38
Potentiometers
Potentiometers
Description:
Names of the packages completely or partially match the names of components.
39
QFN
Quad flat no-lead
PQFN - Pullback packages
RQFN - Rectangular packages (number of vertical pads always isn't equal to horizontal
pads)
PRQFN - Pullback Rectangular packages
39.1
QFN
QFN
Type
100
1
L /
2
12x12
3
0.4
4
QFN
39.2
24
PQFN
PQFN
Type
68
1
R
2
10x10
3
0.5
4
39.3
RQFN
RQFN
Type
10
1
NP
2
1.8x1.4
3
0.4
4
5x6
3
39.4
PRQFN
PRQFN
Type
32
1
R
2
0.5
4
40
QFP
Quad flat pack
RQFP - Rectangular (number of vertical pads always isn't equal to horizontal pads)
40.1
QFP
QFP
Type
144
1
EP /
2
22x22
3
0.5
4
25
40.2
RQFP
RQFP
Type
160
1
EP
2
/ 31.2x31.2 x
3
0.65
4
41
Relays
Relay packages
Description:
Names of the packages completely or partially match the names of components.
42
Resistors
Axial resistors
RESA - Resistor Array
RESCA - Chip resistor array
RESCAV - Chip resistor array, Pads with concave termination
RESCAX - Chip resistor array, Pads with convex termination
42.1
RES
RES
Type
10.55
1
7x2.8
2
42.2
RES (SMD)
RES
Type
04
1
02
2
Resistors
RES
Type
20
1
10
2
42.3
RESA
RESA
Type
12
1
16.9x2
2
1.27
3
1) Number of pads
2) Overall sizes of the package. (x;y), (mm)
3) Pitch, (mm).
43
44
SIP
Single in-line packages
44.1
SIP
SIP
Type
13
1
(19)
2
62.4x7.87
3
2.54
4
1) Number of pads
2) Imaginary number of pads
3) Size of the package, (x;y), (mm)
4) Pitch, (mm).
45
SOJ
Small outline J-leads packages
45.1
SOJ
SOJ
Type
20
1
(26)
2
8.65
3
x 1.27
4
26
27
46
SOP
Small outline packages
MSOP - Mini Small Outline Packages
SSOP - Shrink Small Outline Packages
TSOP - Thin Small Outline Packages
QSOP - Quad Small Outline Packages
TSSOP - Thin Shrink Small Outline Packages
46.1
SOP
SOP
Type
12
1
(14)
2
6.6
3
1.27
4
9
3
0.8
4
SOP
Type
16
1
EP
2
SOP
46.2
MSOP
Default dimensions for
MSOP-packages
Pitch, (Y-axis)
Distance between lead edges
of the package
MSOP
Type
mm
mil
0.5/0.65
4.9
19.7/25.6
193
10
1
EP
2
46.3
SSOP
Default dimensions for SSOPpackages
Pitch for SSOP
Width of the package (X-axis)
Width of the package
SSOP
Type
mm
mil
0.65
5.3
7.8
25.6
209
307
14
1
1) Number of pads.
46.4
QSOP
Default dimensions for QSOPpackages
Pitch (Y-axis)
Distance between lead edges of
the package
QSOP
Type
Novarm Limited 2014
16
1
mm
mil
0.635
6
25
237
EP
2
28
29
46.5
TSOP
TSOP
Type
16
1
6
2
14
3
0.65
4
46.6
TSSOP
Default dimensions for
TSSOP-packages
Pitch for TSSOP
Package width, (X-axis)
Distance between edges of
leads
TSSOP
Type
mm
mil
0.65
4.4
6.4
25.6
173
252
14
1
EP
2
46.7
SOIC
SOIC
Type
12
1
(28)
2
300mil
3
mm
1.27
mil
50
SOT
47
SOT
Small outline transistors
47.1
SOT
SOT
Type
89
1
1) Model
V - variant of the package
SOT
Type
23
1
5
2
1) Model
2) Number of pads
SOT
Type
343
1
R
2
1) Model
2) Style of the package:
R - mirror.
48
Sound
Speakers, Buzzers, Microphones
Description:
Names of the packages completely or partially match the names of components.
49
Switches
Description:
Names of the packages completely or partially match the names of components.
50
TO
Transistor outline packages
50.1
TO
TO
Type
1) Model
18
1
30
31
TO
Type
202
1
4
2
1) Model
2) Number of pads
TO
Type
202
1
H
2
1) Model
2) Direction and style of the package:
H - horizontal
R - mirror
FP - fully isolated plastic package
V - similar package of the same name
D - diameter of the package
S - straight leads
AA, AB - Style of the package
TO
Type
99
1
D13.3
2
1) Model
2) D - diameter of the package = 13.3 (mm)
TO
Type
72
1
x5.08
2
1) Model
2) Distance between pads (X-axis, Y-axis, Diameter), (mm)
TO
Type
252
1
3
2
(4)
3
10
4
6.6
5
2.28
6
1) Model
2) Total number of pads
3) Imaginary number of pads
4) Size by X-axis (From edge of the lead to the edge of the package)
5) Package width (Y-axis)
6) Pitch, (mm).
TO
50.2
DPAK
DPAK
Type
3
1
16 x 14.2 x 10.14
2
3
4
1) Number of pads
2) Size (X-axis), (from the edge of the pad to the edge of the package), (mm)
3) Size of the package (Y-axis), (mm)
4) Pitch, (mm).
50.3
LFPAK
LFPAK
Type
5
1
6
2
4.9
3
1.27
4
50.4
MT
MT
Type
3
1
200
1
H
2
1) Model
2) H - horizontal.
50.5
SMD
SMD
Type
10.2x7.5
2
3.81
3
51
Transformers
Description:
Names of the packages completely or partially match the names of components.
52
Varistors
32
33
52.1
VAR
VAR
Type
02
1
01
2
VAR
Type
5
1
1.5
2
7x3.6
3
VAR
Type
1x1.4
1
53
ZIP
Zig-zag in-line packages
53.1
ZIP
ZIP
Type
11
1
(38)
2
52.8x6.5
3
1.27
4
54
Reference Designators
RefDes
A
B
C
D
Component Type
Antenna
Battery
Capacitor, Capacitor Network
Diode,Thyristor, Varacter, LED,
Novarm Limited 2014
Reference Designators
DS
F
G
J
K
L
LS
M
MK
MR
VO
P
PH
PS
Q
R
S
T
TP
U
V
X
Y
34