Lab Manual: Department of Electronics and Communication Engineering

LAB MANUAL
EC1002 -ELECTRONICS ENGINEERING

PRACTICES
Prepared By
Dr. P. Eswaran
Department of Electronics and Communication

Engineering
Faculty of Engineering and Technology,
SRM University,
Kattankulathur 603203.
2014-2015
Department of Electronics and Communication Engineering

Program: B. Tech. Electronics and Communication Engineering
Expected learning outcome of
EC1002 Electronics Engineering Practices

Program
Educational
Objective
Student
Outcomes
a
b
c
k
PEO1:
PEO2:
PEO3:
PEO4:
Graduates will
perform as a
successful
Professional
engineer in related
fields of
Electronics and
Communication
Engineering.
Graduates will
pursue higher
education and/or
engage
themselves in
continuous
professional
development to
meet global
standards.
Graduates will work

as a team in diverse
fields and gradually
move into leadership
positions.
Graduates will
understand current
professional issues,
apply latest
technologies and
come out with
innovative
solutions for the
betterment of the
nation and society.
Mapping
of
instructional
objectives
with
student
INSTRUCTIONAL
STUDENT OUTCOME
JUSTIFICATION
OBJECTIVE
(a) an ability to apply knowledge of
mathematics, science, and engineering
1. To familiarize the
electronic
components and
basic electronic
instruments.
The students will apply knowledge of

to conduct experiments using
standard instrument and equipments.
The students are taught to design and

k) An ability to use the techniques,
skills and modern engineering tools simulate various electronic circuits
using electronic components.
necessary for engineering practice.
Outcomes
2. To make familiar
with PCB design
and various
processes
involved.

engineering to design and conduct
experiments using PCB design
software..
The students will have the ability to
c) an ability to design a system,
identify,
formulate,
and
solve
component, or process to meet desired
needs within realistic constraints such as engineering problems related to PCB
economic, environmental, social,
design and generate manufacturing
political, ethical, health and safety,
files.
manufacturability, and sustainability
simulate various PCB circuits using
skills and modern engineering tools industry standard PCB design
software tools like Orcad, Power PCB
and TINA packages.
INSTRUCTIONAL
STUDENT OUTCOME
JUSTIFICATION
OBJECTIVE
3. To provide indepth core

knowledge in the
fabrication of
Printed

experiments using designed circuits.
b) An ability to design and conduct

experiments as well as to analyze and
interpret data.

conduct experiments using designed and
assembled circuits

needs within realistic constraints such as

identify,
formulate,
and
solve
engineering problems associated with
assembly and testing of electronic
circuits

k) An ability to use the techniques, simulate various electronic PCB
skills and modern engineering tools required for prototyping and testing
using software tools and testing
equipments.
b) An ability to design and conduct
experiments as well as to analyze and
interpret data.
4. To provide the
knowledge in
assembling and
testing of the PCB
based electronic
circuits.

needs within realistic constraints such as

experiments using designed circuits.

identify,
formulate,
and
solve
engineering problems associated with
assembly and testing of electronic
circuits

simulate various electronic PCB
skills and modern engineering tools required for prototyping and testing
using software tools and testing
equipments.
Syllabus
EC1002 Electronic Engineering Practices
UNIT I-INTRODUCTION TO BASICS OF ELECTRONIC COMPONENTS AND
INSTRUMENTS
(4
hours)
Study of electronic components- active & passive, Electronic Instruments: CRO, Function
generator, Power Supply, Multi-meter, IC tester. Solder practice.
UNIT II -SCHEMATIC CAPTURE
(6
hours)
Introduction to OrCAD schematic capture tool, Simulation of simple electronic circuit,
Schematic to layout transfer, Layout Printing.
UNIT III-PCB DESIGN PROCESS
(6
hours)
Conception Level Introduction: Specifying Parts, Packages and Pin Names, Libraries and
Checking foot prints of the components, Partlist, Netlist, Making Netlist Files, Placing Parts,
Routing Traces, Modifying Traces, Mounting Holes, Adding Text, PCB Layout, DRC,
Pattern Transfer.
UNIT IV-PCB FABRICATION PROCESS
hours)
Etching, cleaning, drying and drilling.
(6
UNIT V-ASSEMBLING AND TESTING

(8
hours)
Identifying the components and its location on the PCB, soldering of active and passive
components, Testing the assembled circuit for correct functionality.
REFERENCES
1. Department Laboratory Manual.
2. Orcad User manual.
3. Printed Circuit Boards: Design, Fabrication, and Assembly (McGraw-Hill Electronic
Engineering-2006) by Raghbir Singh Khandpur.
Academic Course Description

SRM University
Faculty of Engineering and Technology
EC1002 - Electronics Engineering Practices

Second Semester, 2014-15
Course Description
To provide hand-on experience in PCB Circuit design using software and to familiarize with PCB
Fabrication process. To provide hands on experience in assembly and Testing of electronics
circuit.
Compulsory/Elective course: Compulsory for ECE students
Credit hours: 1 credits
nd
Venue: Basic Engineering Laboratory 2 Floor BEL307 & BEL308, Electronics Engineering Practices
Laboratory
Course coordinator: Mr. P.Eswaran

Instructor(s)
Name of the
instructor
Mrs. G.Suganthi
Brinda
Mrs. S. Hannah
Pauline
Mrs. Kavitha
Narayanan
Ms. S. Suhashini
Ms. S. Sudarvizhi
Mr. B. Ananda
venkatesan
Mrs.V.PadmaJothi
Ms.A Ramya
Mrs. Rashmitha
Routary
Mr. P.Eswaran
Mrs. C. Vimala
Ms. A. Bhavani
Class
Venue
C
D
E
F
Day order
Class hours
Email
(domain:
@ktr.srmuniv.ac.in)
Day-2
1 and 2nd
suganthibrindha.g
hannahpauline.s
1.00 pm-1.30 pm
Day-1
5 and 6th
kavitha.n
suhasini.s
1.00 pm-1.30 pm
Day-2
3 and 4th
sudarvizhi.s
anandavenkatesan.b
1.00 pm-1.30 pm
Day-2
6 and 7th
padmajothi.v
ramya.a
1.00 pm-1.30 pm
Day-3
3 and 4th
rashmita.r
eswaran.p
1.00 pm-1.30 pm
Day-3
5 and 6th
vimala.c
bhavani.a
1.00 pm-1.30 pm
st
WorkshopElectronics
Engineering
practices
Laboratory
nd
Floor
Basic
Engineering
Workshop
Building
th
rd
th
rd
th
Consultations
Name of the
instructor
Class
Venue
Mrs. S. Murugaveni
Mrs.S. Diana
G
Emarald Aasha
Mr.M. Ramchandran
H
Mrs. S. Latha
Mr.M.
Ramchandran
I
Mr.T. Saminathan
Mr. G. Elavel
Viswanathan
J
Mr.S.
Vijayananth(ITCE)
Mr. S.
Vijayananth(ITCE)
Bio
Mr. B. Ananda
Medical
Venkatesan,
Day order
Class hours
Email
(domain:
@ktr.srmuniv.ac.in)
Consultations
Day-3
3 and 4th
murugaveni.s
dianaemeralaasha.s
1.00 pm-1.30 pm
Day-3
1 and 2nd
ramachandran.md
latha.k
1.00 pm-1.30 pm
Day-5
3rd and 4th
ramachandran.md
saminathan.t
1.00 pm-1.30 pm
Day-3
1st and 2nd
elavelvisuvanathan.g
vijayananth.s
1.00 pm-1.30 pm
Day-1
1st and 2nd
vijayananth.s
anandavenkatesan.b
1.00 pm-1.30 pm
rd
st
Relationship to other courses

Pre-requisites: Nil
Assumed knowledge:
Basic Electronic Components
Tools used for assembly
Procedure to handle equipments and instruments
Basic knowledge to use computer
Following courses:
Text book(s) and/or required materials:
Lab manual; additional materials posted on SRM web.
References
1. Department user Lab manual.
2. ORCAD.PADS software User manual.

3. R S Khandpur, Printed Circuit Boards- Design Fabrication, Assembly and Testing, Tata Mc
Graw Hill Publishing Company Limited, Ist edition 2008.
Computer usage
OrCAD Pspice and Power logic and Power PCB for schematic and CAM File generation
for PCB.
Hardware Laboratory Usage

Each laboratory station is equipped with a Power supply, CRO, Function generator, Digital
Multimeter, Hand tool kit for circuit assembly, soldering station, components and PCBs. Students
work in groups of two, but maintain individual laboratory notebooks and submit individual
reports.
Detailed Session Plan
Ex. No.
Lab Exercises
Lab
Sessions
Study of Electronic Components
Study of Instruments and Equipments (DMM,

Power supply, CRO, FG)
Introduction to PCB Design software

Generation of CAM Files for single side PCB
(Measuring voltage Drop)
(Full wave Rectifier)
Introduction to soldering practice
PCB Assembly and Testing
Study of single side PCB Fabrication process
a,k
2,4
a,b,c,k
8
1,3,4
9
a,c,k
10
11
12
3,4
13
15
University Practical Exam
16
5 Marks
15 Marks
15 Marks
10 Marks
15 Marks
40 Marks
Repeat class
SOs
14
Attendance
In-lab experiment
Lab Report
Viva voce
Model exam
Final exam
IOs
Evaluation methods
Correlation of lab exercises

with
Objectives
a,b,c,k
Laboratory Policies and Report Format

Reports are due at the beginning of the lab period. The reports are intended to be a complete
documentation of the work done in preparation for and during the lab. The report should be
complete so that someone else familiar with digital design could use it to verify your work. The
prelab and postlab report format is as follows:
1. A neat thorough prelab must be presented to your faculty incharge at the beginning of your
scheduled lab period. Lab reports should be submitted on A4 paper. Your report is a
professional presentation of your work in the lab. Neatness, organization, and
completeness will be rewarded. Points will be deducted for any part that is not clear.
2. In this laboratory students will work in teams of three. However, the lab reports will be
written individually. Please use the following format for your lab reports.
a. Cover Page: Include your name, Subject Code, Section No., Experiment No. and
Date.
b. Objectives: Enumerate 3 or 4 of the topics that you think the lab will teach you.
DO NOT REPEAT the wording in the lab manual procedures. There should be one
or two sentences per objective. Remember, you should write about what you will
learn, not what you will do.
c. Design: This part contains all the steps required to arrive at your final circuit. This
should include diagrams, tables, equations, K-maps, explanations, etc. Be sure to
reproduce any tables you completed for the lab. This section should also include a
clear written description of your design process. Simply including a circuit
schematic is not sufficient.
d. Questions: Specific questions (Prelab and Postlab) asked in the lab should be
answered here. Retype the questions presented in the lab and then formally
answer them.
3. Your
work must be original and prepared independently. However, if you need any
guidance or have any questions or problems, please do not hesitate to approach your
faculty incharge during office hours. Copying any prelab/postlab will result in a grade of 0.
The incident will be formally reported to the University and the students should follow the
dress code in the Lab session.
4. Each laboratory exercise (circuit) must be completed and demonstrated to your faculty
incharge in order to receive working circuit credit. This is the procedure to follow:
a. Circuit works: If the circuit works during the lab period (3 hours), call your faculty
incharge, and he/she will sign and date it.. This is the end of this lab, and you will
get a complete grade for this portion of the lab.
b. Circuit does not work: If the circuit does not work, you must make use of the open
times for the lab room to complete your circuit. When your circuit is ready, contact
your faculty incharge to set up a time when the two of you can meet to check your
circuit.
5. Attendance at your regularly scheduled lab period is required. An unexpected absence will
result in loss of credit for your lab. If for valid reason a student misses a lab, or makes a
reasonable request in advance of the class meeting, it is permissible for the student to do
the lab in a different section later in the week if approved by the faculty incharge of both
the sections. Habitually late students (i.e., students late more than 15 minutes more than
once) will receive 10 point reductions in their grades for each occurrence following the
first. Student attendance less than 75% is detention.
6. Final grade in this course will be based on laboratory assignments. All labs have an equal
weight in the final grade. Grading will be based on pre-lab work, laboratory reports, postlab and in-lab performance (i.e., completing lab, answering laboratory related questions,
etc.,).The faculty Incharge will ask pertinent questions to individual members of a team at
random. Labs will be graded as per the following grading policy:
Attendance
In-lab experiment
Lab Report
Viva voce
Model exam
Final exam
5 Marks
15 Marks
15 Marks
10 Marks
15 Marks
40 Marks
7. Reports Due Dates: Reports are due one week after completion of the corresponding lab.
8. Systems of Tests: Regular laboratory class work over the full semester will carry a weightage of
60%. The remaining 40% weightage will be given by conducting an end semester practical
examination for every individual student if possible or by conducting a 1 to 1 hours duration
common written test for all students, based on all the experiment carried out in the semester.
9. General Procedures
a. Handout: Class representatives are advised to collect the relevant handout from their
faculty. b. Tools: Students has to borrow the required tools and components from store.
c. Attendance: Minimum of 75% to be
maintained d. Punctuality: Late entry to the
lab Not permitted.
e. Dress Code: Should wear lab coat and shoe, No slippers, sandals or footwear that exposes
the foot is allowed. Students with long hair should have it tied up.
f. Conduct: No eating or drinking is allowed. Unnecessary roaming around the lab to be avoided.
Noise level is to be kept to the absolute
minimum.
g. Safety: Students are to observe safety regulations at all times.
h. Equipment Usage: All mains and electrical equipment are to be switched off when not in use
or when the lab session ends.
i. General House Keeping: Students should keep their work station neat and clean.
Prepared by : Dr. P. Eswaran
Dated: 05/01/2015
Revision No.: 00
Date of revision: NA
Revised by:
Program Educational Objectives
(i)
To prepare students to compete for a successful career in Electronics and Communication

Engineering profession through global education standards.
(ii)
To enable the students to aptly apply their acquired knowledge in basic sciences and
mathematics in solving Electronics and Communication Engineering problems.
(iii)
To produce skillful graduates to analyze, design and develop a system/component/ process

for the required needs under the realistic constraints.
(iv)
To train the students to approach ethically any multidisciplinary engineering challenges with
economic, environmental and social contexts
(v)
To create awareness among the students about the need for life long learning to succeed in
their professional career as Electronics and Communication Engineers.
Program Outcomes
a. an ability to apply knowledge of mathematics, science, and engineering
b. an ability to design and conduct experiments, as well as to analyze and interpret data
c. an ability to design a system, component, or process to meet desired needs within realistic constraints
such as economic, environmental, social, political, ethical, health and safety, manufacturability, and
sustainability
d. an ability to function on multidisciplinary teams
e. an ability to identify, formulate, and solve engineering problems
f. an understanding of professional and ethical responsibility
g. an ability to communicate effectively
h. the broad education necessary to understand the impact of engineering solutions in a global,
economic, environmental, and societal context
i. a recognition of the need for, and an ability to engage in life-long learning
j. a knowledge of contemporary issues
k. an ability to use the techniques, skills, and modern engineering tools necessary for engineering
practice.
Name of the
instructor
Class/
Section
Email
(domain:
@ktr.srmuniv.ac.in)
Mrs. G.Suganthi
Brinda
ECE -A
suganthibrindha.g
Ms. S. Suhashini
ECE-B
suhasini.s
Ms. S. Sudarvizhi
ECE-C
sudarvizhi.s
Mrs.V.PadmaJothi
ECE-D
padmajothi.v
Mr. P.Eswaran
ECE-E
eswaran.p
Ms. A. Bhavani
ECE-F
bhavani.a
Mrs. S. Murugaveni
ECE-G
murugaveni.s
Mr.M. Ramchandran
ECE-H
ramachandran.md
Mr.M. Ramchandran
ECE-I
ramachandran.md
Mr. G. Elavel
Viswanathan
ECE-J
elavelvisuvanathan.g
Bio
Medical
anandavenkatesan.b
Mr. B. Ananda
Venkatesan,
Course Coordinator
(Dr. P. Eswaran)
Academic Coordinator
(Mrs. R. Monahari)
Signature
Professor In-Charge
(Dr. Shanthi Prince)
HOD/ECE
(Dr. S. Malarvizhi)
List of Experiments
1. Study of Electronic Components
2. Study of Instruments and Equipments (DMM, Power supply, CRO, FG)
3. Generation of CAM Files for single side PCB (Measuring voltage Drop)
4. Generation of CAM Files for single side PCB (Full wave Rectifier)
5. PCB Assembly and Testing (Measuring voltage Drop)
6. PCB Assembly and Testing (Full wave Rectifier)
7. Study of single side PCB Fabrication process by photo resist Method
ii
Laboratory Report Cover Sheet

SRM University
EC1002 Workshop- Electronics Engineering Practices

First Semester, 2014-15 (Even semester)
Name
Register No.
Day / Session
Venue
: 2th Floor, BEL307 & BEL308, Engineering Basic Lab
Building.
Title of Experiment
Date of Conduction
Date of Submission
:
Particulars
Design / Assembly /
Max.
Marks
Marks
Obtained
15
Testing/ Fabrication
Lab Performance and Lab
15
report
Viva voce
10
Total
40
REPORT VERIFICATION
Date
Staff Name
Signature
:
1
EXERCISE NO 1
STUDY OF ELECTRONIC COMPONENTS

OBJECTIVES
a.
b.
To get familiar with basic electronic components such as Resistor, capacitors,

Inductor, diodes, transistors, integrated circuits (IC), light emitter diode (LED),
switches, fuses, batteries, power plugs, connectors, wires and cables.
To test and understand the function of various electronic components.
RESISTORS
A resistor is a passive two-terminal electrical component that implements electrical
resistance as a circuit element. The current through a resistor is in direct proportion to the
voltage across the resistor's terminals. This relationship is represented by Ohm's law. A
device used in electrical circuits to maintain a constant relation between current flow and
voltage. Resistors are used to step up or lower the voltage at different points in a circuit and
to transform a current signal into a voltage signal or vice versa, among other uses. The
electrical behaviour of a resistor obeys Ohm's law for a constant resistance; however, some
resistors are sensitive to heat, light, or other variables.
Resistors are one of the most used components in a circuit. Most are color coded, but
some have their value in Ohms and their tolerance printed on them. A multimeter that can
check resistance can also be helpful, providing the resistor is already removed from the board
(measuring it while still soldered in can give inaccurate results, due to connections with the
rest of the circuit). They are typically marked with an R on a circuit board.
POTENTIOMETERS
Potentiometers are variable resistors. They normally have their value marked with the
maximum value in Ohms. Smaller trimpots may use a 3-digit code where the first 2 digits are
significant, and the 3rd is the multiplier (basically the number of 0s after the first 2 digits).
For example, code 104 = 10 followed by four 0s = 100000 Ohms = 100K Ohms. They may
also have a letter code on them indicating the taper (which is how resistance changes in
relation to how far the potentiometer is turned). They are typically marked with an VR on a
circuit board.
2
CAPACITORS
A capacitor (originally known as a condenser) is a passive two-terminal electrical
component used to store energy electrostatically in an electric field. By contrast, batteries
store energy via chemical reactions. The forms of practical capacitors vary widely, but all
contain at least two electrical conductors separated by a dielectric (insulator); for example,
one common construction consists of metal foils separated by a thin layer of insulating film.
Capacitors are widely used as parts of electrical circuits in many common electrical devices.
Capacitors are also very commonly used. A lot have their values printed on them,
some are marked with 3-digit codes, and a few are color coded. The same resources listed
above for resistors can also help you identify capacitor values. They are typically marked
with an C on a circuit board.
INDUCTORS
An inductor, also called a coil or reactor, is a passive two-terminal electrical
component which resists changes in electric current passing through it. It consists of a
conductor such as a wire, usually wound into a coil. When a current flows through it, energy
is stored in a magnetic field in the coil. When the current flowing through an inductor
changes, the time-varying magnetic field induces a voltage in the conductor, according to
Faradays law of electromagnetic induction, which by Lenz's law opposes the change in
current that created it.
3
Inductors, also called coils, can be a bit harder to figure out their values. If they are color
coded, the resources listed for resistors can help, otherwise a good meter that can measure
inductance will be needed. They are typically marked with an L on a circuit board.
TRANSFORMERS
A transformer is a static electrical device that transfers energy by inductive coupling
between its winding circuits. A varying current in the primary winding creates a varying
magnetic flux in the transformer's core and thus a varying magnetic flux through the
secondary winding. This varying magnetic flux induces a varying electromotive force (emf)
or voltage in the secondary winding.
Transformers are normally pretty easy to identify by sight, and many have their specs printed
on them. They are typically marked with an T on a circuit board.
FUSES
In electronics and electrical engineering, a fuse is a type of low resistance resistor that
acts as a sacrificial device to provide overcurrent protection, of either the load or source
circuit. Its essential component is a metal wire or strip that melts when too much current
flows, which interrupts the circuit in which it is connected. Short circuit, overloading,
mismatched loads or device failure are the prime reasons for excessive current. A fuse
interrupts excessive current (blows) so that further damage by overheating or fire is
prevented.
Fuses can be easy to identify, and typically have their voltage and amperage rating marked on them.
SEMICONDUCTORS
DIODES
In electronics, a diode is a two-terminal electronic component with asymmetric
conductance, it has low (ideally zero) resistance to current flow in one direction, and high
(ideally infinite) resistance in the other.
Semiconductors, such as Diodes (typically marked with an D on a circuit board).
TRANSISTORS
A transistor is a semiconductor device used to amplify and switch electronic signals
and electrical power. It is composed of semiconductor material with at least three terminals
for connection to an external circuit. A voltage or current applied to one pair of the
transistor's terminals changes the current through another pair of terminals. Because the
controlled (output) power can be higher than the controlling (input) power, a transistor can
amplify a signal. Today, some transistors are packaged individually, but many more are
found embedded in integrated circuits.
Transistors (typically marked with an Q on a circuit board).
BRIDGE RECTIFIERS
A diode bridge is an arrangement of four (or more) diodes in a bridge circuit
configuration that provides the same polarity of output for either polarity of input. When used
in its most common application, for conversion of an alternating current (AC) input into a
direct current (DC) output, it is known as a bridge rectifier. A bridge rectifier provides fullwave rectification from a two-wire AC input, resulting in lower cost and weight as compared
to a rectifier with a 3-wire input from a transformer with a center-tapped secondary winding.
Bridge Rectifiers (typically marked with an BR on a circuit board)
INTEGRATED CIRCUITS
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip,
or a microchip) is a set of electronic circuits on one small plate ("chip") of semiconductor
material, normally silicon. This can be made much smaller than a discrete circuit made from
independent components. Integrated circuits are used in virtually all electronic equipment
today and have revolutionized the world of electronics. Computers, mobile phones, and other
digital home appliances are now inextricable parts of the structure of modern societies, made
possible by the low cost of producing integrated circuits.
Integrated Circuits (typically marked with an U or IC on a circuit board)
LED AND LED DISPLAY

A light-emitting diode (LED) is a semiconductor light source. LEDs are used as
indicator lamps in many devices and are increasingly used for other lighting. LEDs emitted
low-intensity red light, but modern versions are available across the visible, ultraviolet, and
infrared wavelengths, with very high brightness.
SWITCHES
In electrical engineering, a switch is an electrical component that can break an
electrical circuit, interrupting the current or diverting it from one conductor to another. The
most familiar form of switch is a manually operated electromechanical device with one or
more sets of electrical contacts, which are connected to external circuits. Each set of contacts
can be in one of two states: either "closed" meaning the contacts are touching and electricity
can flow between them, or "open", meaning the contacts are separated and the switch is
nonconducting.
BATTERIES
In electricity, a battery is a device consisting of one or more electrochemical cells that
convert stored chemical energy into electrical energy.
Batteries are also pretty easy to identify, and are well marked with their specification.
RELAYS
A relay is an electrically operated switch. Many relays use an electromagnet to
operate a switching mechanism mechanically, but other operating principles are also used.
Relays are used where it is necessary to control a circuit by a low-power signal (with
complete electrical isolation between control and controlled circuits), or where several
circuits must be controlled by one signal.
Relays are typically enclosed in plastic, and many have their specs printed on them. They are
typically marked with a K on a circuit board.
LAB ACTIVITY
EQUIPMENT REQUIRED
Electronic components (Resistor, capacitors, diode, Transistor)
Digital multimeter (DMM)
A1.
Determining Resistor values
Resistor Colour Codes
1st digit
Tolerance
Multiplier (no. of zeros,
following 2nd digit)
2nd digit
Colour-code bands on a
resistor.
Colour
Band 1
Band 2
Band 3
Band 4
Black
(Tolerance)
Brown
10
1%
Red
100
2%
Orange
1000
Yellow
10000
Green
100000
0.5%
Blue
1000000
0.25%
Violet
10000000
0.1%
Grey
White
Gold
0.1
5%
Silver
0.01
10%
Resistance measurement
Procedure
1. Connect probes: black probe to COM terminal and red probe to terminal marked with
2. Set function to resistance measurement
3. Set to the appropriate range (refer to above)
4. Connect the two probes crocodile clips to the resistor (or to the resistor circuit via jumper
wires) to make measurement
5. Note the reading, adjust range if necessary
6. Take the more accurate reading.
Determine the value for the given data

No.
Colour code
Red, red, black
Red, black, orange
Blue, gray, green
Actual Value
10M
33K
A2. Determining capacitor values
Code
C
J
K
M
D
Z
Tolerance
0.25pF
5%
10%
20%
0.5pF
80% / -20%
10
Measured Value
(DMM)
Determine the value of the ceramic capacitors

No.
Code Number
104
223
68
Actual Value
0.47
A3.
33nF
Diode Testing
Draw the schematic symbol of a 1N4001 diode and identify the leads (Anode and Cathode) in
the box below.
a. Set the Lab DMM to Diode Testing mode.

b. Measure the forward and reverse bias voltages of the given diodes and record them
i. Forward bias voltage:
Place the RED probe on the Anode. Touch the BLACK probe to the Cathode and
record the reading
ii.
Reverse bias voltage:
Place the RED probe on the Cathode. Touch the BLACK probe to the Anode and
record the reading
11
No.
Diode Number
Forward Bias Voltage
1N4001
1N914
Result:
12
Reverse Bias Voltage

SRM University

Name
Register No.
Day / Session
Venue
Building.
Title of Experiment
Date of Conduction
Date of Submission
Particulars
Design / Assembly /
Max.
Marks
Marks
Obtained
15
15
report
Viva voce
10
Total
40
REPORT VERIFICATION
Date
Staff Name
Signature
:
13
EXPERIMENT NO 2
2A DIGITAL MULTI METER

INTRODUCTION
A Multimeter is an electronic device that is used to make various electrical
measurements, such as AC and DC voltage, AC and DC current, and resistance. It is
called a Multimeter because it combines the functions of a voltmeter, ammeter, and
ohmmeter. Multimeter may also have other functions, such as diode test, continuity test,
transistor test, TTL logic test and frequency test.
PARTS OF MULTIMETER
A Multimeter has three parts:
Display
Selection Knob
Ports
The display usually has four digits and the ability to display a negative sign. A
few multimeters have illuminated displays for better viewing in low light situations.
The selection knob allows the user to set the multimeter to read different things
such as milliamps (mA) of current, voltage (V) and resistance ().
Two probes are plugged into two of the ports on the front of the
unit. COM stands for common and is almost always connected to Ground or - of a
circuit. The COM probe is conventionally black but there is no difference between the
red probe and black probe other than color. 10A is the special port used when measuring
large currents (greater than 200mA). mAV is the port that the red probe is
conventionally plugged in to. This port allows the measurement of current (up to 200mA),
voltage (V), and resistance (). The probes have a banana type connector on the end that
plugs into the multimeter. Any probe with a banana plug will work with this meter.
14
SAFETY MEASURES
Be sure the test leads and rotary switch are in the correct position for the desired
measurement.
Never use the meter if the meter or the test leads look damaged.
Never measure resistance in a circuit when power is applied.
Never touch the probes to a voltage source when a test lead is plugged into the 10
A or 300 mA input jack.
To avoid damage or injury, never use the meter on circuits that exceed 4800 watts.
Never apply more than the rated voltage between any input jack and earth ground.
Be careful when working with voltages above 60 V DC or 30 V AC rms. Such
voltages pose a shock hazard.
Keep your fingers behind the finger guards on the test probes when making
measurements.
To avoid false readings, which could lead to possible electric shock or personal
injury, replace the battery as soon as the battery indicator appears.
INPUT JACKS
The black lead is always plugged into the common terminal. The red lead is
plugged into the 10 A jack when measuring currents greater than 300 mA, the 300 mA
jack when measuring currents less than 300 mA, and the remaining jack (V-ohms-diode)
for all other measurements.
15
RANGE FIXING
The meter defaults to autorange when first turned on. You can choose a manual
range in V AC, V DC, A AC, and A DC by pressing the button in the middle of the rotary
dial. To return to autorange, press the button for one second.
PROCEDURE FOR MEASUREMENT

VOLTAGE MEASUREMENT
D.C. / A.C. Voltage Measurment
1. Connect the positive(red) test lead to the V/mA jack socket and the
negative(black) lead to the COM jack socket.
2. Set the selector switch to the desired mV D.C./D.C.V/A.C.V range.
3. Connect the test leads to the circuit to be measured.
4. Turn on the power to the circuit to be measured, the voltage value should appear
on the digital display along with the voltage polarity(if reversed only).
16
CURRENT MEASUREMENT
negative(black) lead to the COM jack socket(for measurements up to 200mA).
For measurements between 200mA and 10A connect the red test lead to the
10mA socket.
2. Set the selector switch to the desired uA/mA/A range.
3. Open the circuit to be measured and connect the test leads in SERIES with the
load in which current is to be measured.
4. To avoid blowing an input fuse, use the 10A jack until you are sure that the
current is less than 300 mA. Turn off power to the circuit. Break the circuit. (For
circuits of more than 10 amps, use a current clamp.) Put the meter in series with
the circuit and turn power on.
17
RESISTANCE MEASUREMENT
2. Set the selector switch to the desired OHM .
3. If the resistance to be measured ia part of a circuit, turn off the power and
discharge all capacitors before measurement.
4. Connect the test leads to the circuit to be measured.
5. The resistance value should now appear on the digital display.
6. If the resistance to be measured is part of a circuit, turn off the power and
CONTINUITY TEST
This mode is used to check if two points are electrically connected. It is often
used to verify connectors. If continuity exists (resistance less than 210 ohms), the beeper
sounds continuously.
2. Set the selector switch to the

position.
3. Connect the test leads to two points of the circuit to be tested. If the resistence is
Ohms the buzzer will sound.
4. If the resistance to be measured is part of a circuit, turn off the power and
18
DIODE TEST
1. Connect the positive (red) test lead to the V/mA jack socket and the
2. Set the selector switch to the
position.
3. Connect the test leads to be measured.
4. Turn on the power to the circuit to be measured and the voltage value should
appear on the digital display.
5.
19
General Operation
Connection of Probes:
All multimeters come with two probes. They are to be connected to the terminals on the meter
itself. The Black probe is to be connected to the COM terminal. Red probe is to be connected to
terminal marked with :
V- for voltage measurement,
mA or 20A for current measurement (there are two terminals, one for 2A range and the
other for 20A range)
V- for resistance measurement.
Setting of function:
The multimeter uses different circuits internally to measure different things. Therefore, you must
select the correct function before using it.
Setting of Range:
You can change the sensitivity of the meter by selecting different range for measurement. Set the
range to the first range that is higher than the maximum value you expect to measure. This will
give a more accurate reading. If you do not know what to expect, use the highest range first.
After a reading is obtained, set the range to the appropriate one to get a better reading.
When the value measured exceeds the existing range, the display will flash. When this happens,
set the multimeter to a higher range until some values are displayed.
Precautions:
1. For current measurement, the maximum input current is 2A (if the RED mA and BLACK
COM terminals are used) or 20A (if the RED 20A and BLACK COM terminals are used).
Excessive current will blow the fuse on the 2A range, which must be replaced. The 20A
range, however, is not protected by the fuse.
2. For voltage measurement (use the RED V- and BLACK COM terminals), the maximum
input voltage on :
all DC ranges is 1200V DC or peak AC
the 20V, 200V and 1000V AC ranges is 1000V rms continuous
the 2V and 200mV AC ranges is 1000V rms for not more than 15 seconds.
3. To avoid electrical shock and/or instrument damage, do not connect the COM input
terminals to any source of more than 500 volts DC or peak AC above earth ground.
Resistance measurement
Procedure
1. Connect probes: black probe to COM terminal and red probe to terminal marked with
2. Set function to resistance measurement
4. Connect the two probes crocodile clips to the resistor (or to the resistor circuit via jumper
wires) to make measurement
20
Voltage measurement
Procedure
7. Connect probes: black probe to COM terminal and red probe to terminal marked with V
8. Set function to voltage measurement
10. Set the AC-DC selection - depends on what type of signal you want to measure
11. Touch the two points where you want to make measurement
Note
Reading obtained is the voltage of where the red probe touch with reference to where the black
probe touches. This may not indicate the voltage level from ground. To find the voltage level of
a point from ground, black probe should be touching a ground point and the red probe on the
point you want to measure.
Current measurement
Procedure
1. Connect probes: black probe to COM terminal and red probe to terminal marked with A
2. Set function to current measurement
3. Set to the appropriate range
4. Set AC-DC selection - depends on what type of signal you want to measure
5. Off the power to the circuit
6. Break the path which we want to make measurement
7. Connect the path with the two probes so that current now flow through the multimeter
8. On the power
9. Note the reading, change range if necessary
Note
Use the 20A range if you are not sure of the current to be measured.
Connection Methods to Measure Voltage and Current
i
Power
Supply
Power
Supply
A
COM
Multimeter
COM
Multimeter
Voltage Measurement
Current Measurement
21
2B DC VARIABLE POWER SUPPLY

Objective
To study the function and operation of regulated power supply.
Equipment required
Multimeter
Dual DC variable regulated Power supply (0-30) Volts
Theory
A power supply is a device that supplies electric power to an electrical load.
The term is most commonly applied to electric power converters that convert one form of
electrical energy to another, though it may also refer to devices that convert another form
of energy (mechanical, chemical, solar) to electrical energy. A regulated power supply is
one that controls the output voltage or current to a specific value; the controlled value is
held nearly constant despite variations in either load current or the voltage supplied by
the power supply's energy source.
A power supply may be implemented as a discrete, stand-alone device or as an
integral device that is hardwired to its load. Examples of the latter case include the low
voltage DC power supplies that are part of desktop computers and consumer
electronics devices.
Commonly specified power supply attributes include:
The amount of voltage and current it can supply to its load.
How stable its output voltage or current is under varying line and load conditions.
POWER SUPPLIES TYPES

Battery
DC power supply
AC power supply
Linear regulated power supply
Switched mode power supply
Programmable power supply
Uninterruptible power supply
High voltage power supply
Voltage multipliers
22
DC POWER SUPPLY
SPECIFICATION
1. Adjustable 0~30V/0~2A
2. The design is limit the voltage overload
The power supply input 220V, 230V, 240V AC
3. Output voltage: 0-30V DC
o
o
4. Work temperature: -10 C-40 C
MAIN FUNCTION
1. Output constant current adjustable.
2. Output constant voltage adjustable.
3. LCD voltage and current display.
4. Constant voltage and current operation in individual.
5. Over current protection.
Adjustable power supply
23
2C CATHODE-RAY OSCILLOSCOPE (CRO)

Objective
To introduce the basic structure of a cathode-ray Oscilloscope.
To get familiar with the use of different control switches of the device.
To visualize an ac signal, measure the amplitude and the frequency.
Equipment Required
Cathode-ray Oscilloscope
Function Generator
BNC connector
Theory
The device consists mainly of a vacuum tube which contains a cathode, anode,
grid, X&Y-plates, and a fluorescent screen (see Figure below). When the cathode is
heated (by applying a small potential difference across its terminals), it emits electrons.
Having a potential difference between the cathode and the anode (electrodes), accelerate
the emitted electrons towards the anode, forming an electron beam, which passes to fall
on the screen.
When the fast electron beam strikes the fluorescent screen, a bright visible spot is
produced. The grid, which is situated between the electrodes, controls the amount of
electrons passing through it thereby controlling the intensity of the electron beam. The
X&Y- plates are responsible for deflecting the electron beam horizontally and vertically.
A sweep generator is connected to the X-plates, which moves the bright spot
Horizontally across the screen and repeats that at a certain frequency as the source of the
signal. The voltage to be studied is applied to the Y-plates. The combined sweep and Y
voltages produce a graph showing the variation of voltage with time.
Experimental Figures
Fig 1. Cathode Ray tube Oscilloscope
Fig 2. Out Line Diagram of CRO
24
Procedure
1. Turn on the Oscilloscope
2. Adjust the intensity and the focus of the trace.
3. Use the X & Y knobs to center the trace horizontally and vertically.
4. Connect the cable from Ch1 of the CRO to Function generator.
5. A signal will appear on the screen.
6. Make sure that the inner red knobs of the Volt/Div and the Time/Div are locked
clockwise.
7. Set the frequency of the generator to 100 Hz.
8. Adjust the Volt/Div and the Time/Div knobs so that you get a suitable size signal
9. Count the number of vertical squares lying within the signal, then calculate the peak
to peak value as:
Vp-p = No. vertical Div *Volt/Divs

10. Count the number of horizontal squares lying within the one Duty Cycle, then
calculate time value as:
Time = No. Horizontal Div *Time/Divs

11.Calculate the Frequency of signal by using the formula:
Freq = 1 /Time
Result:
25
2D FUNCTION GENERATOR
Objective
1. To get familiarization and study the operation of a function generator instrument
2. To identify key function generator specifications
3. To visualize the types of waveforms produced by a function generator
Equipment Required
Oscilloscope
Function generator.
BNC connector cable
Theory
A function generator is electronic test equipment used to generate different types
of waveforms over a wide range of frequencies. Function generators are capable of
producing a variety of repetitive waveforms, generally from the list below
Sine wave: A function generator will normally have the capability to produce a
standard sine wave output. This is the standard waveform that oscillates between
two levels with a standard sinusoidal shape.
Square wave: A square wave is normally relatively easy for a function generator
to produce. It consists of a signal moving directly between high and low levels.
Pulse: A pulse waveform is another type that can be produced by a function

generator. It is effectively the same as a square wave, but with the mark space
ratio very different to 1:1.
Triangular wave: This form of signal produced by the function generator

linearly moves between a high and low point.
26
Saw tooth wave: Again, this is a triangular waveform, but with the rise edge of
the waveform faster or slower than the fall, making a form of shape similar to a
saw tooth.
These waveforms can be either repetitive or single-shot Function generators are used in
the development, test and repair of electronic equipment.
Types of Function Generator
PROCEDURE
1. Turn on the oscilloscope
2. Connect the function generator to one vertical channel of the oscilloscope using BNC
Connector
3. Select the type of wave form by pressing Function control button.
4. Set the waveform at desired frequency by adjusting Frequency variable control button.
5. Now adjust the amplitude control of the function generator to establish a 4 V peak-topeak (p-p) sinusoidal waveform on the screen.
Figure: Function Generator

connected with CRO
27
Function Generator Controls

Knobs
Control Name
Number
1
Power
2
LCD Display
3
Frequency
Function
5
6
7
Modulation
Attenuation
Menu
Duty Cycle
Frequency
Variable
Amplitude
Variable
10
11
DC Offset
12
Output (BNC
connector)
External
Counter (BNC
Connector)
13
14
Modulation
Input
Functions
Push button switch to power ON the instrument.
20 x 4 Character bright back lit Liquid Crystal Display.
Used for selection of frequency range step by step.
Used for selection of Particular waveform. A total number of 6
different waveforms :
Sine
Square
Triangle
Ramp
Pulse
TTL are available.
Used for selection of Frequency Modulation.
Used for Selection of 20dB or 40dB attenuation
Used for selection of Function Generator/Frequency counter
mode.
When pulse output function is selected, this controls the pulse
duty cycle from 15% to 85%.
In conjunction with frequency range, selected by frequency key
on front Panel.
In conjunction with attenuators (6), this varies the level of output.
This control provides DC offset. Approximately 5VDC is
superimposed on the output. Keep the control off if DC offset is
not required.
Output of 10 MHz function generator i.e. 20Vpp (Open Circuit)
Input BNC connector for measuring the frequency of external
signal when External Counter mode is selected by
Menu key on the LCD display.
Maximum modulation Input i.e. 2Vpp.
28
LAB Activity
2A DIGITAL MULTI METER
observation
Description
Measurement of line voltage (ac)
Measurement of resistance
Measurement of continuity
Value
2B DC VARIABLE POWER SUPPLY

Set 5V in both channel
2C CATHODE-RAY OSCILLOSCOPE (CRO)
Self test of CRO
Description
Measurement of voltage
Measurement of Time
Calculated frequency
Value
2D FUNCTION GENERATOR
Set sine wave _____Hz and display in CRO
Set Triangle/ Square wave and display in CRO
observation
Description
Measurement of voltage
Measurement of Time
Calculated frequency
Sine wave
Result
29
Square Wave
General Instructions to Create Schematic Design

OBJECTIVES:
Learn to create a schematic drawing with PADS Logic
PART 1 PADS LOGIC

Launch PADS Logic: Move your cursor to the Toolbar and tips will appear as you move
from one icon to another. Spend a few minutes to familiarize yourself with the Menu bar,
Toolbars and Icons.
At the top of the window, other than the Menu Bar, there are 3 Toolbars:
(i) Standard Toolbar
(ii) Selection Filter Toolbar
(iii) Schematic Editing ToolbarThere is also a Status Bar at the bottom of the
screen.
30
Default
width
Grid Size
X, Y Cursor
location
General Design Settings

Set up Drawing Environment
To start, GotoTools>>Options
Set Sheet Size and Tie Dot Diameter

Select Design and change at the Sheet area: Size and Sheet to A3.
Also change the Tie Dot Diameter to 80.
31
Set Display and Design Grid

Next, select General. Set the Display Grid to 100and Design Grid to 50as shown.
Display Grids appear as dots on the screen. Design Grid are not shown but can be snapped to.
Click OK to make changes.

Zoom In/Out
To see the whole schematic on the screen, click on the Sheet icon
To Zoom-In or Out of the drawing, use the PgeUp or PageDown buttons on the
keyboard or press the CTRL key and roll the mouse-wheel.
CAPTURE THE SCHEMATIC
To Add a Part
To add a Resistor to the schematic, from Schematic Editing Toolbar, select the Add part
icon
A window for part selection will appear.
32
In the Filter section, we want to search through All Libraries.

In Items edit box enter RES*(The Asterisk *is a wildcard character). Then click the
Applybutton.
Look for misc: RES-1/4W. Click Add Buttonto add the part.
Alternate Symbols
Click the right-mouse button and select Alternate. Do this several times.
Finally, click the left-mouse-button to drop the part onto your schematic. However,
only a few commonly used parts have alternate symbols.
Depending on how you would like the part to appear, you may also carry out the
following operations on the part: Rotate 90, X Mirror and Y Mirror.
Search and add the other parts given in the Appendix to your schematic.
33
Change Part Properties

To see or change properties of the part, Select the part (click the Part once and it will turn
White), click the Right-Mouse Button and then choose Properties from the drop down
menu shown below.
The Part Properties window will pop-up and you can:

change values or set colors in Attributes
view the part decal using PCB Decal
change power connection of ICs using SigPins
You can also double-click on the part to get to the Part Properties window:
34
Deleting Parts
To delete a part, select the part and press Delete Key or select the Delete icon
Add Connection
Select the Add Connection icon
. Click near to the tip of the pins to start the
connection.
Add a Power/ Ground Connection
To add a ground symbol:
Add and extend a connection from a pin of a part.
Move the cursor to the location that you want the ground symbol to be.
Right-mouse-click and select Ground
To display the GND symbol text, Double-click on the GND Symbol and the Net Properties
window will appear. Scroll to GND and Tick the Net Name Label box.
Do likewise for the other Power Nets: VIN &VCC. Type-in VIN and VCC if they are not
listed.
Delete Connection
To delete a connection, choose the Delete icon
35
and then select the connections to delete.
Power the IC (Take Note, Especially if your design has ICs)

Some ICs can be powered at different voltages. Select SigPins button and specify the Net that
the Power or GND pins are connected to.
Eg.
Add Info to Title Block

Double-Click on the Company Field in the Title Block. A Field Properties window will
appear. Type in your Name / Login ID / Date. Then Type Exercise A in Company
Field
To add other Text in the schematic, select Add Text icon
36
Save your File

Save your work regularly.
From Menu bar, Choose File / Save As. The File Save As dialog box will
appear.
Type the file name and then press Save or Save As
Note the file extension is .sch for schematic capture. The file will be saved in the
server in your default directory.
BOM (Bill of Material)
Bill of Material (also known as part list) is a document which provides information on the
quantities, values, and part type etc of the components used on the printed circuit board.
.
Designers generate the BOM to list the parts required to assemble the boards.
1. Choose File>>Report from the main menu.
2. Tick Bill of Materials and click on the Setup button.
3. Use Add button to add in the Reports menu and notepad will display the BOM as
indicated below.
4. The file will be saved in your folder.
Creating Net-List
A net list contains a list of parts, their part types and all the nets (connections). The PADS
Logic software passes data to the PADS Layout via the net list.
To create a net list:

1. From the menu, select Tools>>Layout Netlist. The Netlist dialog box appears.
2. In the output edit box, make sure the directory is current directory. The filename
should be *.asc. This is an ASCII file with file extension (.asc). Click on the OK
button to generate the Netlist file.
37
3. Study the contents of the netlist file. DO NOT PRINT. Save your work.
38
General Instructions to design PCB Layout using PADS

Layout
OBJECTIVES:
Learn to design a PCB layout using PADS Layout
Launch the PADS Layout. Other than the Menu Barand the Standard Toolbar, there are 5
other Toolbars. Enable them by selecting one of the icons
The 5 toolbars, as suggested by their names, are for:

(i) Drafting
(ii) Design
(iii) Dimensioning
(iv) ECO
(v) BGA
If you are using the program for the first time, go to File>>set Start-up File
Select default.stp. This file will determine the colors used for the various drawing elements.
You can check the colors setting by going to Setup>> Display Colors.
Select the other startup file and see what happens to the color set.
Set Units of Measure.
As usual, setup the design environment before working on it.
39
From Main Menu, select Tools>>Options or select the Options icon
, which can be
found in the Drafting, Design and Dimensioning Toolbar.

Go to
Global>>General.
Change the Design
units to Mils.
Next, go to Grids.
Change the Display
grid to 100 and the
Design grid to 25 (for
both X and Y)
Zoom-in or Zoomout till you can see
the display grids and
till you feel that the
screen can fit your
PCB board outline.
Set Origin
Before drawing the PCB outline, set the Origin first.
From the menu select Setup>>Set Origin. Click (precisely) on a display grid. The origin of
the workspace, or (0, 0) coordinate location, is represented by a large white datum (cross).
Create a Board Outline
Before drawing the outline of the board, identify the co-ordinates of all the corners.
From the Drafting Toolbar, select the Board Outline and Cutout icon
Click on the Origin and then extend the board outline to the next co-ordinate point.
Modifying the Board Outline
Double-click on a board outline and a Drafting Edge Properties window will appear.
Adjustments to the board outline can be changed by entering the correct co-ordinates.
40
Import Netlist File - ASCII (.asc)

A Netlist typically contains a list of all the parts and their connections.
Choose File>>Import. Click on the Yes button when prompted to save old file before
loading
The File Import box appears. Open the Netlist file *.asc you generated in PADS Logic.
Disperse Components
All the imported parts are now all cluttered at the origin. Use Tools>>Disperse Components
to disperse the components.
Define Design Rules

Design rules can be set for clearance, routing, high speed constraints and others. They can be
assigned for all (default) or for specific nets, layers, classes, pin pairs and etc. You will set 2
sets of design rules here:
Default Clearance Rules
Net Clearance Rules

Set Default Clearance Rules
From Main Menu select Setup>>Design Rules. The Rules dialog box will appear.
41
Choose the Default icon.

The Clearance Rules: Default Rules dialog box will appear.
Set the default Trace Width and the Clearance as shown above (make use of the All button
at the upper left corner of the matrixes). Click OK to save changes and to close the window.
Set Net Clearance Rules
To set rules for specific nets, click on the NET icon in the Rules dialog box.
Press CTRL key and select the nets VIN, VCC and GND. In the same way, set the trace
width and the Clearance required for these nets.
Click the OK button to save the changes.

Component Placement
To move the components, select the component, then drag and drop it at the desired location.
Alternatively, select the move icon
in the Design toolbar and then choose the part to
move.
You can also Rotate and Spin the part. ButDo Not FLIP!
42
Schematic-Driven Placement
PADS Logic and PADS Layout allow Cross-Probing.
Display the Schematic and the Layout side-by-side.
Click on a part in your schematic and the part will appear highlighted in your PCB layout.
This allows you to place the components in the LOGICAL way that they appear in the
schematic.
If you are not able to cross-probe, in PADS Logic, go to Tools>>PADS Layout
(Link)>>Document Open (browser and select the correct document).
ROUTING
Routing is to lay wire/traces/tracks between pins. Depending on the components and board
used, the matrix below shows some of the possibilities.
Component Type
Single-sided Board
Through-Hole Components
Components inserted from Top.

Tracks run on bottom/solder side.
Surface-Mounted
Components mounted on Top.
Components
Tracks on Top side
Change Grid Size

Before you route, reduce the Grids further: Eg. Display Grid to 50&Design Grid to 10
Routing Layers
Change to the correct layer before you route. Use the Drop down List Box to switch layers.
Dynamic Routing
Before you route, go to Tools>>Options>>Design and select:
i)
Length minimize>> During move
ii)
Line/trace Angle>>Diagonal
iii)
On-line DRC>>Prevent errors this is essential if Dynamic Routing is

used. For all your exercises use Dynamic Routing.
43
To lay a trace, select the Top or Bottom layer. Click on 2 pads connected by a Ratnest
/Airwire and the trace will be laid! Notice how dynamic route chooses a shortest path around
obstacles. You can also control the route by clicking on intermediate points. Complete all the
routing. The Dynamic Route Editor also offers dynamic bus routing. You can bus route a
group of address and data busses.
Deleting Routes
Select the segment of a completed/unwanted route and press the Delete key.
Verifying your Design - Perform Clearance/Conductivity Check
When the board is fully routed, use Tools>>Verify Design. Select clearance or connectivity
and then press the Start button
If there is a design violation, an error message will be appear. Double click on the error
message (if any) and the error will be highlighted on your drawing.
Clearance checks on the in-between spacing whereas connectivity checks whether
everything had been connected.
Board Dimensioning
In PowerPCB, auto-dimensioning feature allows designers to dimension the board easily. A
few preferences can be set via Tools>>Options>>Dimensioning.
44
Select the Dimensioning Toolbar. Select the Pointer
icon then Right-Mouse click and
ensure that the Select Board Outline is selected.
Select the Horizontal or Vertical
icons, and with the mouse, pick the respective
segment of the board to dimension, then Drag-and-Drop the dimensioning lines.
45
General Instructions to generate CAM Files

OBJECTIVES:
Learn to generate CAM files for PCB fabrication
Creating CAM documents

From Menu Bar, choose File>>CAM. The Define
CAM Document dialog box appears.
Click Add button.
The Add Document dialog will appear.
In the Document Name text box, type

Routing, Bottom.
Select Routing from the Document Type drop
down list.
The Layer Association dialog box appears.
Select Bottom and click OK.
Next, select Layers from the Customize
Document area.
46
The Select Items dialog box will appear.

Select Board Outline from the Other area.
Check that for the Selected layers (Bottom in
this case), the required Items on Primary have
all been correctly selected.
The items are information extracted to produce

the CAM file.
Choose Preview to and see how the artwork

would look like as a photo plot.
Close to exit the Preview window.
Return to the Add Document window.

Select Device Setup
A Photo Plotter Setup dialog box would
appear.
Select Advanced
The Photo Plotter Advanced Setup is required

once only.
Ensure that the Gerber Output format is RS274X and all other settings as shown in the
picture.
Click OK to go back to Define CAM
Document window and ensure that you press
Save.
47
For a Single-Sided Board:

Document
Name
Document
Type
Output file
Layer Selection
Items on Primary
(for Corresponding Layer
Selection)
Routing,
Bottom
Routing
art002.pho
1. Bottom
1. Pads, Traces, 2D Lines, Vias,

Copper, Text
Silkscreen,
Top
Silkscreen
sst001026.pho
1. Top
1. Ref Des, Outlines
2. Silkscreen Top
2. Text, Outlines
Soldermask,
Bottom
Soldermask
1. Bottom
1. Pads, Test Points
2. Soldermask
Bottom
2. Lines, Copper, Text, Test

Points
N.A
(Note: This file is required for

NC drilling)
Drill Data
NC Drill
sm002028.pho
drl001.drl
RUN Generate CAM output files

To generate and save all your CAM files,
1. Go to Define CAM Document dialog box.
Highlight all documents in Document Name edit box.
2. Click Run button, and answer Yes in response to the prompt. This will output all
your CAM files (artwork and its aperture table) to the D:\CAM\default folder in your
home directory. Check your folder to verify that the files are all there.
Useful Shortcut Keys
Other Key Shortcuts
Esc
Spacebar
PgUp
PgDn
Insert
Home
End
Del
Cancel command
Left mouse button click
Zoom in at cursor
Zoom out at cursor
Centre at cursor
View extents
Redraw
Delete selected
48

SRM University

Name
Register No.
Day / Session
Venue
Building.
Title of Experiment
Date of Conduction
Date of Submission
:
Particulars
Design / Assembly /
Max.
Marks
Marks
Obtained
15
15
report
Viva voce
10
Total
40
REPORT VERIFICATION
Date
Staff Name
Signature
49
EXERCISE NO 3
MEASURING VOLTAGE DROP
Objective:
1. To create a schematic with PADS Logic
2. To create a PCB Layout with PADS Layout
3. To use Copper Pour to create Power and GND planes
PART 1 Schematic Capture
With the help of the parts list given, draw the schematic as shown in the Appendix.
Save your schematic as Exercise1.sch. For your schematic, check the following:
1. Sheet Size is set to A3. Tie Dot Diameter is set to 80. Title Block is filled.
2. The component values are all correctly entered.
3. The pin numbers of the resistors are not displayed
4. Reference Designators are all upright and easy to read.
5. The netlist is named Exercise1.asc.
PART 2 PCB Layout
1. Draw the Board Outline.
2. Set the Origin at the bottom-left corner of the board.
3. Import the Netlist and disperse the components.
4. Set the design rules as shown in the table below:
Trace width
Net Name
Minimum
Recommended
Maximum
All clearance
Default
10
12
15
12
+5V
15
20
30
20
GND
15
20
30
20
5. Place the components at your own discretion. Place them logically refer to the
schematic.
6
Before you route, read through the entire Part 3 below on Copper Pouring.
For routing, ensure that Prevent Error is turned on. Route using Dynamic Route.
Check that the line/trace Angle Mode is set to Diagonal.
50
PART 3 Copper Pouring

In order to reduce noise in a design, copper planes are often added to a PCB. Other than to
reduce noise in the power and ground supply, copper pour can also be used for thermal (heat)
dissipation. The steps to add copper pour planes for a typical 2 layered board are:
1. Route all the GND signal trace on the Bottom layer - Use Find>>Highlight>> GND
net to find all the GND nets and route them on Bottom Layer.
2. Route all the +5V signal trace on the Top Layer - Use Find>>Highlight>>+5V net
to find all the +5V nets and route them on the TOP layer.
3. Route ALL the other signal connections The other signal lines can be routed either
on the top or bottom layers.
4. Create the outline for the GND Copper Pour area at the Bottom Layer and associate
it to GND.
5. Similarly, create the outline for the +5V Copper Pour area and associate it to the
+5V.
6. Finally Flood the areas.
Read on to learn how to create the Copper Pour Outlines and how to associate them to the
correct nets.
Draw the Copper Pour Outline
To create a copper pour outline on the bottom layer, 25 mils within the board outline:
1. Set the design grid to 25 (both X an Y) .
2. Set the current layer to the Bottom layer by selecting it from the Layer drop-down list
box in the toolbar.
3. Turn on the Drafting Toolbar using the drafting icon
4. Choose the Copper Pour icon
from the Drafting
5. Click on Right-mouse-button and choose Polygon from the pop-up menu.

6. Position the cursor at X25,Y25 and click to start drawing a polygon which is 25 mils
offset from the board outline (polygon must be within the board outline)
7. Select Complete from the pop-up menu to complete or close the polygon.
Assign the Copper Pour Outline

1. Choose the Select Model icon
from the Drafting toolbox to exit Copper Pour mode.
2. Press the Shift key and click on any section of the outline to select the whole outline.
3. Next double-click the left mouse button and a Drafting Properties window will appear.
51
4. Select the Layer and assign the outline to the correct Net, as shown above.
Flood the Copper Plane
With the Copper Pour Outline still selected, select the Flood icon
The message Proceed with Flood? will appear. Answer Yes to the prompt.
Flooding creates a hatch pattern that fills the area enclosed by the pour outline.
Copper Pour Top Layer for the +5V Plane

Repeat the above steps, but this time for the +5V plane on the top layer. Create a copper pour
outline, 50 mils within the board outline. Make sure that you associate the pour outline on the
TOP layer to +5V before you flood.
PART 4 Post Processing
1. Dimension the board outline.
2. Generate the following CAM files:
Routing Bottom
Silkscreen Top
52
Solder mask Bottom

NC Drill File
3. If available, use GC-Prevue (Graphics code Gerber Viewer) to view your CAM files.
Make sure that your artwork is neat and tidy.
Exercise 1 Measuring Voltage drop across resistive circuit
Part List
Library Part-type Ref Designator Components
RES - 1/4 W
R1 R6
Resistor, size 1/4 Watt
CON-SIP-2P
J1
2 pins connector
BOM
|-------------------------------------------------------------------------------|
|Bill Of Materials for default.sch on Thu Jul 04 15:00:37 2013
|
|-------------------------------------------------------------------------------|
|Item|Qty |Reference|Part Name |Manufacturer |Description
|
|----+----+---------+--------------+--------------+-----------------------------|
|1 |1 |J1
|CON-SIP-2P |
|GENERIC 2 PIN SIP HEADER .100|
| | |
|
|
|CENTERS
|
|2 |1 |R3
|RES-1/4W,10K |
|RES BODY:100 CENTERS:500 |
|3 |1 |R1
|RES-1/4W,1K |
|4 |1 |R5
|RES-1/4W,2.2K |
|5 |1 |R6
|RES-1/4W,22K |
|6 |1 |R4
|RES-1/4W,4.7K |
|7 |1 |R2
|RES-1/4W,560 |
|-------------------------------------------------------------------------------|
Schematic Diagram
53
Output Files
Routing bottom
Silkscreen top
Silkscreen bottom
Drill data
54

SRM University

Name
Register No.
Day / Session
Venue
: 2th Floor, BEL307 & BEL308, Engineering Basic Lab Building.
Title of Experiment
Date of Conduction
Date of Submission
:
Particulars
Design / Assembly /
Max.
Marks
Marks
Obtained
15
15
report
Viva voce
10
Total
40
REPORT VERIFICATION
Date
Staff Name
Signature
55
EXERCISE 4
Full Wave Rectifier Circuit
Objective:
1. To create a schematic with PADS Logic
2. To create a PCB Layout with PADS Layout
3. To use Copper Pour to create Power and GND planes

PART 1 Schematic Capture
With the help of the parts list given, draw the schematic as shown in the General instructions. Save
your schematic as Exercise2.sch. For your schematic, check the following:
1.
Sheet Size is set to A3. Tie Dot Diameter is set to 80. Title Block is filled.
2.
The component values are all correctly entered.
3.
The pin numbers of the resistors are not displayed
4.
Reference Designators are all upright and easy to read.
5.
The netlist is named Exercise2.asc.
PART 2 PCB Layout

1. Draw the Board Outline.
2. Set the Origin at the bottom-left corner of the board.
3. Import the Netlist and disperse the components.
4. Set the design rules as shown in the table below:
Trace width
Net Name
Minimum
Recommended
Maximum
All clearance
Default
10
12
15
12
+5V
15
20
30
20
GND
15
20
30
20
5. Place the components at your own discretion. Place them logically refer to the schematic.
6.
Before you route, read through the entire Part 3 below on Copper Pouring.
7.
For routing, ensure that Prevent Error is turned on. Route using Dynamic Route. Check that the
line/trace Angle Mode is set to Diagonal.
PART 3 Copper Pouring

In order to reduce noise in a design, copper planes are often added to a PCB. Other than to reduce noise in the
power and ground supply, copper pour can also be used for thermal (heat) dissipation. The steps to add
copper pour planes for a typical 2 layered board are:
56
1. Route all the GND signal trace on the Bottom layer - Use Find>>Highlight>> GND net to find all the
GND nets and route them on Bottom Layer.
2. Route all the +5V signal trace on the Top Layer - Use Find>>Highlight>>+5V net to find all the +5V
nets and route them on the TOP layer.
3. Route ALL the other signal connections The other signal lines can be routed either on the top or bottom
layers.
4. Create the outline for the GND Copper Pour area at the Bottom Layer and associate it to GND.
5. Similarly, create the outline for the +5V Copper Pour area and associate it to the +5V.
6. Finally Flood the areas.
Read on to learn how to create the Copper Pour Outlines and how to associate them to the correct nets.
Draw the Copper Pour Outline
To create a copper pour outline on the bottom layer, 25 mils within the board outline:
1. Set the design grid to 25 (both X an Y) .
2. Set the current layer to the Bottom layer by selecting it from the Layer drop-down list box in the toolbar.
3. Turn on the Drafting Toolbar using the drafting icon
4. Choose the Copper Pour icon
from the Drafting
5. Click on Right-mouse-button and choose Polygon from the pop-up menu.

6. Position the cursor at X25,Y25 and click to start drawing a polygon which is 25 mils offset from the board
outline (polygon must be within the board outline)
7. Select Complete from the pop-up menu to complete or close the polygon.
Assign the Copper Pour Outline

1. Choose the Select Model icon
from the Drafting toolbox to exit Copper Pour mode.
2. Press the Shift key and click on any section of the outline to select the whole outline.
3. Next double-click the left mouse button and a Drafting Properties window will appear.
57
4. Select the Layer and assign the outline to the correct Net, as shown above.
Flood the Copper Plane
With the Copper Pour Outline still selected, select the Flood icon
The message Proceed with Flood? will appear. Answer Yes to the prompt.
Flooding creates a hatch pattern that fills the area enclosed by the pour outline.
Copper Pour Top Layer for the +5V Plane

Repeat the above steps, but this time for the +5V plane on the top layer. Create a copper pour outline, 50
mils within the board outline. Make sure that you associate the pour outline on the TOP layer to +5V
before you flood.
PART 4 Post Processing

1. Dimension the board outline.
2. Generate the following CAM files:
Routing Bottom
Silkscreen Top
Solder mask Bottom
NC Drill File
Measuring Voltage drop across resistive circuit

Part List
Library Part-type
Ref Designator
Components
RES - 1/4 W
R1 R6
Resistor, size 1/4 Watt
CON-SIP-2P
J1
2 pins connector
BOM
|Bill Of Materials for schematic diagramt.sch on Thu Jul 04 14:58:36 2013
|-------------------------------------------------------------------------------|
|Item|Qty |Reference|Part Name
|Manufacturer |Description
|
|----+----+---------+--------------+--------------+-----------------------------|
|1
|1
|C2
|CAP-CX12-A,
|KEMET
|POL. DIPPED SOLID TANT. CAP. |
|
|
|
|???,10uF
|
|MIL-SPEC SIZE CX12 CASE 'A' |
|2
|1
|C1
|CAP-CX12-B,
|KEMET
|POL. DIPPED SOLID TANT. CAP. |
|
|
|
|???,1000uF
|
|MIL-SPEC SIZE CX12 CASE 'B' |
|3
|1
|OUT
|CON-SIP-2P
|
|
|
|
|
|
|CENTERS
|
|4
|1
|IN
|CON-SIP-3P
|
|
|
|
|
|
|CENTERS
|
|5
|2
|D1-2
|DIODE
|
|GENERIC DIODE W ALTERNATE
|
|6
|1
|7805
|LM7805CT
|NATIONAL
|5 VOLT, VOLTAGE REGULATOR
|
|
|
|
|
|SEMICONDUCTOR |
|
|7
|1
|R1
|RES-1/8W,10K |
58
Schematic Diagram
OUTPUT FILES
Figure 5 Drill Data

Figure 1 Bottom Routing
Figure 2 Silkscreen Top
Figure 3 Bottom Routing
Figure 4 Solder mask

bottom
59

SRM University

Name
Register No.
Day / Session
Venue
Title of Experiment
Date of Conduction
Date of Submission
:
Particulars
Design / Assembly /
Max.
Marks
Marks
Obtained
15
15
report
Viva voce
10
Total
40
REPORT VERIFICATION
Date
Staff Name
Signature
:
63
EXERCISE 6
FULL WAVE RECTIFIER
OBJECTIVE:
To assemble and testing of full wave rectifier circuit.
COMPONENTS REQUIRED:
S.NO
1.
2.
COMPONENTS NAME
VALUE
PCB for full wave rectifier circuit
Digital multimeter(DMM)-
3.
4.
5.
Step-down transformer
Diode
Capacitor
6.
7.
8.
9.
Voltage regulator IC
Resistor
soldering kit
connecting wires
QUANTITY
1
1
(6-0-6)V
1
IN4007
2 nos
1000 f/25V , 10 Each one
f/12V
IC7805
1
10k
1
1
-
CIRCUIT DIAGRAM
P1
P2
Ground
P1
PROCEDURE:
a.
1.
2.
3.
4.
5.
Components measurement
Connect probes: black probe to COM terminal and red probe to terminal marked with.
Set the functions of resistor or capacitor or diode measurement.
Set the appropriate range.
Connect the two probes to the resistor or capacitor or diode to make measurement.
Note the reading and check the resistor value using colour coding technique.
64
6. Note the reading and check the capacitor or diode values.

b. Assembly procedure:
1. Load the components on to the dedicated component layout printed circuit board.
Components must be placed well in the board.
2. Bend the resistor, capacitor and diode leads to the appropriate size before inserting
them into the board. Make mechanical bend before cutting away the excess leads.
Height of the each resistor or capacitor or diode must be in the same level.
3. Solder the components on the general purpose board using the point to point
soldering as shown in the circuit diagram. Solder two power connection leads and
connect it to the power supply whenever its required.
TESTING OF CIRCUIT:
1. Check point to point continuity test for all the points in the PCB.
2. Measurement of voltage:
a. Connect the power supply with the primary coils of transformer and measure the
voltage across each terminals using digital multimeter.
b. Measure the voltage across the diode P1 and the ground terminal.
c. Measure the voltage across the diode P2 and the ground terminal.
d. Measure the AC input voltage across the diode D1 anode and ground.
e. Measure the AC input voltage across the diode D2 anode and ground.
f. Measure the voltage drop across pin 1 and pin 3 of 7805 (P1 and P2)
Measuring nodes
S. No
1.
2.
3.
4.
5.
Voltage
measurement
P1 and ground
P2 and ground
AC input voltage at D1 anode
and ground
AC input voltage at D1 anode
and ground
voltage drop across pin 1 and
pin 3 of 7805
TROUBLE SHOOTING:
1. If the capacitor is unplugged or the interchanging of positive and negative terminals or
improper soldering of capacitor terminal doesnt produce any kind of output.
2. If the capacitor value differs from the mentioned values then charging and discharging
period of capacitor vary.
65
3.
4.
5.
6.
7.
When the diode is in forward bias (positive terminal of power supply connected with
anode and negative terminal of power supply connected with cathode of diode) condition
it allows the current flow across the diode. If the diode terminals (anode and cathode) are
interchanged i.e., reverse biased then no voltage drop across the diodes.
If the diode is unplugged or not soldered properly then no output occurs.
When the diode is soldered partially then distorted output may occur.
When the resistor value differs from the circuit, the output value can differ.
If no voltage appears across the capacitor 10 f/12V, check the connecting point of diode
D1 and D2 with DMM.
a. If voltage appear across D1 and D2 then check the voltage across the capacitor
1000 f/25V
b. If no voltage drops across D1 and D2 then replace the diodes or look at the continuity
test at that particular point.
c. If no dropping voltage across the capacitor 1000 f/25V then replace the capacitor or
go to continuity test at that point or check the short circuit across the track of PCB.
d. If the voltage drops across the capacitor1000 f/25V then check the continuity test of
voltage regulator.
e. If no voltage appears across voltage regulator terminal then replace the component or
check the short circuit across the track of PCB.
f. If any short circuit at the track of PCB then use the scratch card for open circuit.
g. If no voltage appear across the resistor then go to the continuity test of look the
condition of resistor(broken/burn).
h. If voltage drop across the resistor then the problem with the capacitor 10 f/12V. now
look the continuity test of capacitor and replace it.
RESULT:
66
EXERCISE 7
STUDY OF SINGLE SIDE PCB FABRICATION
AIM
To study the single side PCB fabrication process by photo resist method.
To get familiarize with the materials, precautions to be observed and the fabrication
procedure of NV1800 PCB fabrication machine setup.
EQUIPMENTS REQUIRED
NV1800 PCB FABRICATION MACHINE
1. PCB Art Work Film Maker NV180
2. PCB Art Work Table NV181
3. PCB Shearing Machine NV182
4. Photoresist Dip Coating Machine NV183
5. PCB Curing Machine - NV191
6. UV Exposing Machine NV184
7. Dye Tank NV185
8. Development Tank NV186
9. PCB Etching Machine NV187
10. Drilling Machine NV188
11. Solderable Lacquer Tank NV189
1.
PCB Art Work Film Maker NV180
PCB Layout can be system generated or hand drawn. The PCB artwork film maker is used
to develop art work film. The film development is a dark room process. The lith film developed in
this process is called negative. The negative and positive refers to the way the film represents the
actual art work.
Positive Film
Negative Film
67
PCB Art Work Table NV181
2.
The artwork table is used for inspecting and correcting the film developed by Art work
film maker. A new film can be directly developed with the help of accessories provided in PCB
designer kit (NV190). The direct films can be developed for small circuits and it becomes
complex with increase in circuit complexity.
PCB Shearing Machine NV182
PCB Shearing Machine is used for cutting PCB laminate to the desired dimensions.
3.
Photoresist Dip Coating Machine NV183

PCB laminate cleaning is very important before photoresist coating. This PCB laminate
coated with photoresist is used for further PCB development. The Photoresist creates a layer on
the PCB laminate.
4.
i.
ii.
iii.
iv.
v.
Take the cut PCB laminate from the shearing machine in previous procedure. Cleaning
with Cleaning Reagent- 1
Dry the PCB laminate in the air first and then in PCB Curing Machine. During drying
process the care should be taken that spots should not occur on PCB laminate.
Photoresist coating is done by mounting the PCB on the dipping assembly.
Dip the PCB laminate slowly in the tank till the photoresist is coated on the PCB laminate.
Take out the PCB dipping assembly from the stand.
5.
PCB Curing Machine (NV191).
Place the PCB laminate in the PCB Curing machine and leave the Laminate for 10 minute.
UV Exposing Machine NV184
i.
Place the negative on the glass of the UV exposure machine such that the solder side is
in contact with the glass plate.
ii. Place the photoresist coated PCB on the negative.
iii. Close the lid of the UV exposure machine.
iv.
The exposing time is about 15 minutes to 20 minutes.
v.
After exposing the PCB is ready for development process.
6.
Development Tank NV186
7.
UV exposed PCB laminate is dipped in the developer quite for few minutes and then
processed for next step which is dye tank process. . Basically developer is used to remove the
extra photoresist coating.
i.
If no tracks are visible dip it again for 5 sec. Repeat the process until tracks are clearly
visible. This process removes unused photoresist from the PCB that is not exposed to the
UV light i.e. the darker side of the Negative Film.
68
ii.
Suitable time for PCB laminate to be dipped in development tank is 1 to 5 minutes. The
time must not be varied as the excess time can damage tracks and time less than the
required time does not allow the developer to remove the extra photoresist.
Dye Tank NV185
8.
Dye tank is used to dip the PCB laminate after development tank process. Role of the dye
tank process is to make the tracks formed in the development tank process visible.
PCB Etching Machine NV187
9.
PCB etching machine is used for the etching process. Actually the tank of the machine is
filled with the ferric chloride solution in water. This solution reacts with the copper of the PCB
laminate when the laminate is dipped in the solution. The uncovered copper of the laminate reacts
with the ferric chloride and is removed from the PCB laminate leaving the copper tracks only
which were protected actually due to the photoresist coating and dye.
i.
ii.
iii.
iv.
v.
vi.
vii.
10.
i.
ii.
iii.
iv.
Mount the PCB Laminate on the Stand provided for PCB etching machine. Dip it in the
PCB etching machine.
The required time duration to pump the PCB etching machine ON is entered using the
push buttons and display provided on the front panel of the PCB etching machine.
As soon as the spray starts functioning the ferric chloride solution goes whirling and the
process of the etching starts for the time duration as entered.
When the time is over and the spray ceases and the etching process is complete.
Open the lid of the PCB etching machine and remove out the PCB laminate from the
etching machine. Check the PCB for complete etching. If the unused copper is not
completely removed then start the process again from step ii.
The etching time depends on the concentration of etching solution and the size of PCB.
Wash the PCB laminate with cleaning reagent 2 and dry it, the process of etching is
complete.
Drilling Machine NV188
The PCB must be drilled as per components used in the design of the PCB
Place the PCB on the base of drilling machine provided for the support of drilling.
Placing will be such that the drill bit will go straight to the place where hole is to be made.
Drill slowly creates holes.
Similarly all the holes are made and thus drilling is complete.
Solderable Lacquer Tank NV189

Lacquer is chemical which creates a protecting layer on PCB for protecting it from
environment reactions like oxidation.
11.
Result
69

SRM University

Name
Register No.
Day / Session
Venue
Title of Experiment
Date of Conduction
Date of Submission
:
Particulars
Design / Assembly /
Max.
Marks
Marks
Obtained
15
15
report
Viva voce
10
Total
40
REPORT VERIFICATION
Date
Staff Name
Signature
:
60
EXERCISE 5
Measuring Voltage drop across resistive circuit
OBJECTIVE:
To assemble and testing of voltage drop across resistive circuit.
COMPONENTS REQUIRED:
S.NO
1.
2
COMPONENTS NAME
VALUE
PCB for voltage drop resistive
circuit
Digital multimeter(DMM)-
Resistors
DC power supply,connecting
wires
soldering kit
QUANTITY
1
1 k ,500 ,10 k,4.7 k,2.2

k,22 k
-
Each 1 no
CIRCUIT DIAGRAM:
P3
P2
P0
P1
P4
PROCEDURE:
1) Resistance measurement using digital multimeter.
a) Connect BLACK probe to COM terminal and RED probe to terminal marked with ohm.
b) Set the functions to resistance measurement
c) Connect the two probes to the resistor to make measurements.
d) Note the reading and also check the value using color coding technique.
2) ASSEMBLY PROCEDURE
a) Load the resistor onto the dedicated component lay out Printed circuit board. Resistors
should be placed well in the board. Bend the resistors lead to the appropriate size before inserting
61
them into the board. Make a mechanical bend before cutting away the excess lead. Height of
each resistor should be in the same level.
b) Solder the resistor on general purpose PCB board using point to point soldering as shown in
circuit diagram
c) Solder two power connection leads and connect a 5v power supply to the constructed circuit.
3) Testing of circuit
a) Set the DC power supply to 5v.
b) Connect the positive terminals to point P1 and negative terminal to P5.
c) Measure the voltage V1 between P0 and P1.
d) Measure the voltage V2 between P1 and P2.
e) Measure the voltage V3 between P2 and P3.
f) Measure the voltage V4 between P3 and P4.
g) Measure the voltage V5 between P2 and P4. Calculate Vb=(v4+v5)
V1
V2
V3
V4
V5
Calculate Vin=(V1+V2+V3+V4)=
Calculate Vin=(V1+V2+V5)=
+
+
+
+
+
+
=-------V
=-------V
4) TROUBLE SHOOTING:
a) Set the digital multimeter the continuity mode. Unplug the device or switch off the circuit
before attempting a continuity test. Check the continuity between all five nodes.
b) Set different voltage (eg:4v, 7v) and check the voltage across each point.
C) When the resistor value differs from the circuit, the output value can differ.
d) When the Specified value of power supply increased or decreased, then the voltage across
each resistor value get increased or decreased.
RESULT:
62

Lab Manual: Department of Electronics and Communication Engineering

Uploaded by

Lab Manual: Department of Electronics and Communication Engineering

Uploaded by

LAB MANUAL

EC1002 -ELECTRONICS ENGINEERING

Department of Electronics and Communication

Department of Electronics and Communication Engineering

Expected learning outcome of

EC1002 Electronics Engineering Practices

Graduates will work

The students will apply knowledge of

The students are taught to design and

The students will apply knowledge of

3. To provide indepth core

The students will apply knowledge of

b) An ability to design and conduct

The students will have the ability to

c) an ability to design a system,

The students will have the ability to

The students are taught to design and

c) an ability to design a system,

The students will apply knowledge of

The students will have the ability to

The students are taught to design and

UNIT V-ASSEMBLING AND TESTING

Academic Course Description

EC1002 - Electronics Engineering Practices

Course coordinator: Mr. P.Eswaran

Relationship to other courses

2. ORCAD.PADS software User manual.

Hardware Laboratory Usage

Study of Electronic Components

Study of Instruments and Equipments (DMM,

Introduction to PCB Design software

University Practical Exam

Study of single side PCB Fabrication process

Correlation of lab exercises

Laboratory Policies and Report Format

Program Educational Objectives

To prepare students to compete for a successful career in Electronics and Communication

To produce skillful graduates to analyze, design and develop a system/component/ process

Laboratory Report Cover Sheet

EC1002 Workshop- Electronics Engineering Practices

: 2th Floor, BEL307 & BEL308, Engineering Basic Lab

STUDY OF ELECTRONIC COMPONENTS

To get familiar with basic electronic components such as Resistor, capacitors,

LED AND LED DISPLAY

Determining Resistor values

Resistor Colour Codes

Determine the value for the given data

Red, red, black

Red, black, orange

Blue, gray, green

A2. Determining capacitor values

Determine the value of the ceramic capacitors

a. Set the Lab DMM to Diode Testing mode.

Forward Bias Voltage

Reverse Bias Voltage

Laboratory Report Cover Sheet

EC1002 Workshop- Electronics Engineering Practices

: 2th Floor, BEL307 & BEL308, Engineering Basic Lab

2A DIGITAL MULTI METER

PROCEDURE FOR MEASUREMENT

2. Set the selector switch to the

Connection Methods to Measure Voltage and Current

2B DC VARIABLE POWER SUPPLY

POWER SUPPLIES TYPES

2C CATHODE-RAY OSCILLOSCOPE (CRO)

Fig 1. Cathode Ray tube Oscilloscope

Fig 2. Out Line Diagram of CRO

Vp-p = No. vertical Div *Volt/Divs

Time = No. Horizontal Div *Time/Divs

Pulse: A pulse waveform is another type that can be produced by a function

Triangular wave: This form of signal produced by the function generator

Figure: Function Generator

Function Generator Controls

Maximum modulation Input i.e. 2Vpp.

2B DC VARIABLE POWER SUPPLY

General Instructions to Create Schematic Design