ADC0801/ADC0802/ADC0803/ADC0804/ADC0805

8-Bit mP Compatible A/D Converters

General Description
The ADC0801, ADC0802, ADC0803, ADC0804 and
ADC0805 are CMOS 8-bit successive approximation A/D
converters that use a differential potentiometric ladder
similar to the 256R products. These converters are designed to allow operation with the NSC800 and INS8080A
derivative control bus with TRI-STATE output latches directly driving the data bus. These A/Ds appear like memory
locations or I/O ports to the microprocessor and no interfacing logic is needed.
Differential analog voltage inputs allow increasing the common-mode rejection and offsetting the analog zero input
voltage value. In addition, the voltage reference input can
be adjusted to allow encoding any smaller analog voltage
span to the full 8 bits of resolution.

Features

Compatible with 8080 mP derivativesno interfacing

logic needed - access time - 135 ns
Easy interface to all microprocessors, or operates
stand alone

Y
Y
Y

Y
Y
Y
Y

Differential analog voltage inputs

Logic inputs and outputs meet both MOS and TTL voltage level specifications
Works with 2.5V (LM336) voltage reference
On-chip clock generator
0V to 5V analog input voltage range with single 5V
supply
No zero adjust required
0.3 standard width 20-pin DIP package
20-pin molded chip carrier or small outline package
Operates ratiometrically or with 5 VDC, 2.5 VDC, or analog span adjusted voltage reference

Key Specifications
Y
Y

Resolution
Total error
Conversion time

8 bits
g (/4 LSB, g (/2 LSB and g 1 LSB

100 ms

Typical Applications

TL/H/5671 1

8080 Interface

Error Specification (Includes Full-Scale,

Zero Error, and Non-Linearity)
Part
Number

FullVREF/2 e 2.500 VDC VREF/2 e No Connection

Scale
(No Adjustments)
(No Adjustments)
Adjusted

ADC0801 g (/4 LSB

ADC0802

g (/2 LSB

ADC0803 g (/2 LSB

ADC0804
ADC0805

g 1 LSB
g 1 LSB

TL/H/567131
TRI-STATE is a registered trademark of National Semiconductor Corp.
Z-80 is a registered trademark of Zilog Corp.
C1995 National Semiconductor Corporation

TL/H/5671

RRD-B30M115/Printed in U. S. A.

ADC0801/ADC0802/ADC0803/ADC0804/ADC0805
8-Bit mP Compatible A/D Converters

December 1994

Absolute Maximum Ratings

(Notes 1 & 2)
Storage Temperature Range

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

875 mW

ESD Susceptibility (Note 10)

Supply Voltage (VCC) (Note 3)

6.5V
Voltage
b 0.3V to a 18V
Logic Control Inputs
b 0.3V to (VCC a 0.3V)
At Other Input and Outputs
Lead Temp. (Soldering, 10 seconds)
Dual-In-Line Package (plastic)
260 C
Dual-In-Line Package (ceramic)
300 C
Surface Mount Package
Vapor Phase (60 seconds)
Infrared (15 seconds)

b 65 C to a 150 C

Package Dissipation at TA e 25 C

800V

Operating Ratings (Notes 1 & 2)

Temperature Range
TMINsTAsTMAX
ADC0801/02LJ, ADC0802LJ/883 b55 CsTAs a 125 C
b 40 C s TA s a 85 C
ADC0801/02/03/04LCJ
b 40 C s TA s a 85 C
ADC0801/02/03/05LCN
ADC0804LCN
0 CsTAs a 70 C
ADC0802/03/04LCV
0 CsTAs a 70 C
ADC0802/03/04LCWM
0 CsTAs a 70 C
Range of VCC
4.5 VDC to 6.3 VDC

215 C
220 C

Electrical Characteristics
The following specifications apply for VCC e 5 VDC, TMINsTAsTMAX and fCLK e 640 kHz unless otherwise specified.
Max

Units

ADC0801: Total Adjusted Error (Note 8)

Parameter

With Full-Scale Adj.

(See Section 2.5.2)

Conditions

Min

Typ

g (/4

LSB

ADC0802: Total Unadjusted Error (Note 8)

VREF/2 e 2.500 VDC

g (/2

LSB

ADC0803: Total Adjusted Error (Note 8)

With Full-Scale Adj.

(See Section 2.5.2)

g (/2

LSB

ADC0804: Total Unadjusted Error (Note 8)

VREF/2 e 2.500 VDC

g1

LSB

ADC0805: Total Unadjusted Error (Note 8)

VREF/2-No Connection

g1

LSB

VREF/2 Input Resistance (Pin 9)

ADC0801/02/03/05
ADC0804 (Note 9)

2.5
0.75

8.0
1.1

kX
kX

Analog Input Voltage Range

(Note 4) V( a ) or V(b)

VCC a 0.05

VDC

DC Common-Mode Error

Over Analog Input Voltage

Range

Gnd 0.05
g (/16

g (/8

LSB

Power Supply Sensitivity

VCC e 5 VDC g 10% Over

Allowed VIN( a ) and VIN(b)
Voltage Range (Note 4)

g (/16

g (/8

LSB

AC Electrical Characteristics
The following specifications apply for VCC e 5 VDC and TA e 25 C unless otherwise specified.
Symbol

Parameter

Conditions

Min

Typ

Max

Units

TC

Conversion Time

fCLK e 640 kHz (Note 6)

103

114

ms

TC

Conversion Time

(Note 5, 6)

66

73

1/fCLK

fCLK

Clock Frequency
Clock Duty Cycle

VCC e 5V, (Note 5)

(Note 5)

100
40

1460
60

kHz
%

CR

Conversion Rate in Free-Running

Mode

INTR tied to WR with

CS e 0 VDC, fCLK e 640 kHz

8770

9708

conv/s

tW(WR)L

Width of WR Input (Start Pulse Width)

CS e 0 VDC (Note 7)

100

tACC

Access Time (Delay from Falling

Edge of RD to Output Data Valid)

CL e 100 pF

135

200

ns

t1H, t0H

TRI-STATE Control (Delay

from Rising Edge of RD to
Hi-Z State)

CL e 10 pF, RL e 10k
(See TRI-STATE Test
Circuits)

125

200

ns

tWI, tRI

Delay from Falling Edge

of WR or RD to Reset of INTR

300

450

ns

CIN

Input Capacitance of Logic

Control Inputs

7.5

pF

COUT

TRI-STATE Output
Capacitance (Data Buffers)

7.5

pF

640

ns

CONTROL INPUTS [Note: CLK IN (Pin 4) is the input of a Schmitt trigger circuit and is therefore specified separately]
VIN (1)

Logical 1 Input Voltage

(Except Pin 4 CLK IN)

VCC e 5.25 VDC

2.0

15

VDC

AC Electrical Characteristics (Continued)

The following specifications apply for VCC e 5VDC and TMIN s TA s TMAX, unless otherwise specified.
Symbol

Parameter

Conditions

Min

Typ

Max

Units

CONTROL INPUTS [Note: CLK IN (Pin 4) is the input of a Schmitt trigger circuit and is therefore specified separately]
VIN (0)

Logical 0 Input Voltage

(Except Pin 4 CLK IN)

VCC e 4.75 VDC

IIN (1)

Logical 1 Input Current

(All Inputs)

VIN e 5 VDC

IIN (0)

Logical 0 Input Current

(All Inputs)

VIN e 0 VDC

0.005
b1

b 0.005

0.8

VDC

mADC
mADC

CLOCK IN AND CLOCK R

VT a

CLK IN (Pin 4) Positive Going

Threshold Voltage

2.7

3.1

3.5

VDC

VTb

CLK IN (Pin 4) Negative

Going Threshold Voltage

1.5

1.8

2.1

VDC

VH

CLK IN (Pin 4) Hysteresis

(VT a )b(VTb)

0.6

1.3

2.0

VDC

VOUT (0)

Logical 0 CLK R Output

Voltage

IO e 360 mA
VCC e 4.75 VDC

0.4

VDC

VOUT (1)

Logical 1 CLK R Output

Voltage

IO eb360 mA
VCC e 4.75 VDC

2.4

VDC

DATA OUTPUTS AND INTR

VOUT (0)

Logical 0 Output Voltage

Data Outputs
INTR Output

IOUT e 1.6 mA, VCC e 4.75 VDC

IOUT e 1.0 mA, VCC e 4.75 VDC

VOUT (1)

Logical 1 Output Voltage

IO eb360 mA, VCC e 4.75 VDC

2.4

VOUT (1)

Logical 1 Output Voltage

IO eb10 mA, VCC e 4.75 VDC

4.5

VDC

IOUT

TRI-STATE Disabled Output

Leakage (All Data Buffers)

VOUT e 0 VDC
VOUT e 5 VDC

b3

mADC
mADC

ISOURCE

VOUT Short to Gnd, TA e 25 C

4.5

mADC

ISINK

VOUT Short to VCC, TA e 25 C

9.0

16

mADC

0.4
0.4

VDC
VDC
VDC

POWER SUPPLY
ICC

Supply Current (Includes

Ladder Current)

fCLK e 640 kHz,

VREF/2 e NC, TA e 25 C
and CS e 5V

ADC0801/02/03/04LCJ/05
ADC0804LCN/LCV/LCWM

1.1
1.9

1.8
2.5

mA
mA

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its specified operating conditions.
Note 2: All voltages are measured with respect to Gnd, unless otherwise specified. The separate A Gnd point should always be wired to the D Gnd.
Note 3: A zener diode exists, internally, from VCC to Gnd and has a typical breakdown voltage of 7 VDC.
Note 4: For VIN( b ) t VIN( a ) the digital output code will be 0000 0000. Two on-chip diodes are tied to each analog input (see block diagram) which will forward
conduct for analog input voltages one diode drop below ground or one diode drop greater than the VCC supply. Be careful, during testing at low VCC levels (4.5V),
as high level analog inputs (5V) can cause this input diode to conductespecially at elevated temperatures, and cause errors for analog inputs near full-scale. The
spec allows 50 mV forward bias of either diode. This means that as long as the analog VIN does not exceed the supply voltage by more than 50 mV, the output
code will be correct. To achieve an absolute 0 VDC to 5 VDC input voltage range will therefore require a minimum supply voltage of 4.950 VDC over temperature
variations, initial tolerance and loading.
Note 5: Accuracy is guaranteed at fCLK e 640 kHz. At higher clock frequencies accuracy can degrade. For lower clock frequencies, the duty cycle limits can be
extended so long as the minimum clock high time interval or minimum clock low time interval is no less than 275 ns.
Note 6: With an asynchronous start pulse, up to 8 clock periods may be required before the internal clock phases are proper to start the conversion process. The
start request is internally latched, see Figure 2 and section 2.0.
Note 7: The CS input is assumed to bracket the WR strobe input and therefore timing is dependent on the WR pulse width. An arbitrarily wide pulse width will hold
the converter in a reset mode and the start of conversion is initiated by the low to high transition of the WR pulse (see timing diagrams).
Note 8: None of these A/Ds requires a zero adjust (see section 2.5.1). To obtain zero code at other analog input voltages see section 2.5 and Figure 5 .
Note 9: The VREF/2 pin is the center point of a two-resistor divider connected from VCC to ground. In all versions of the ADC0801, ADC0802, ADC0803, and
ADC0805, and in the ADC0804LCJ, each resistor is typically 16 kX. In all versions of the ADC0804 except the ADC0804LCJ, each resistor is typically 2.2 kX.
Note 10: Human body model, 100 pF discharged through a 1.5 kX resistor.

Typical Performance Characteristics

Logic Input Threshold Voltage

vs. Supply Voltage

Delay From Falling Edge of

RD to Output Data Valid
vs. Load Capacitance

CLK IN Schmitt Trip Levels

vs. Supply Voltage

fCLK vs. Clock Capacitor

Full-Scale Error vs
Conversion Time

Effect of Unadjusted Offset Error

vs. VREF/2 Voltage

Output Current vs
Temperature

Power Supply Current

vs Temperature (Note 9)

Linearity Error at Low

VREF/2 Voltages

TL/H/5671 2

TRI-STATE Test Circuits and Waveforms

t1H

t1H, CL e 10 pF

t0H

tr e 20 ns

t0H, CL e 10 pF

tr e 20 ns

TL/H/5671 3

Timing Diagrams (All timing is measured from the 50% voltage points)

Output Enable and Reset INTR

Note: Read strobe must occur 8 clock periods (8/fCLK) after assertion of interrupt to guarantee reset of INTR.

TL/H/5671 4

Typical Applications (Continued)

6800 Interface

Ratiometric with Full-Scale Adjust

Note: before using caps at VIN or VREF/2,

see section 2.3.2 Input Bypass Capacitors.

Absolute with a 2.500V Reference

Absolute with a 5V Reference

*For low power, see also LM385-2.5

Zero-Shift and Span Adjust: 2VsVINs5V

Span Adjust: 0VsVINs3V

TL/H/5671 5

Typical Applications (Continued)

A mP Interfaced Comparator

Directly Converting a Low-Level Signal

For: VIN( a ) l VIN( b )

Output e FFHEX
VREF/2 e 256 mV

For: VIN( a ) k VIN( b )

Output e 00HEX

1 mV Resolution with mP Controlled Range

VREF/2 e 128 mV
1 LSB e 1 mV
VDAC s VIN s (VDAC a 256 mV)

Digitizing a Current Flow

TL/H/5671 6

Typical Applications (Continued)

External Clocking

Self-Clocking Multiple A/Ds

100 kHz s fCLK s 1460 kHz

*Use a large R value

to reduce loading
at CLK R output.

mP Interface for Free-Running A/D

Self-Clocking in Free-Running Mode

*After power-up, a momentary grounding

of the WR input is needed to guarantee operation.

Operating with Automotive Ratiometric Transducers

Ratiometric with VREF/2 Forced

*VIN( b ) e 0.15 VCC

15% of VCC s VXDR s 85% of VCC
TL/H/5671 7

Typical Applications (Continued)

mP Compatible Differential-Input Comparator with Pre-Set VOS (with or without Hysteresis)

*See Figure 5 to select R value

DB7 e 1 for VIN( a ) l VIN( b ) a (VREF/2)
Omit circuitry within the dotted area if
hysteresis is not needed

Handling g 10V Analog Inputs

Low-Cost, mP Interfaced, Temperature-to-Digital Converter

*Beckman Instruments 694-3-R10K resistor array

mP Interfaced Temperature-to-Digital Converter

*Circuit values shown are for 0 C s TA s a 128 C

**Can calibrate each sensor to allow easy replacement, then
A/D can be calibrated with a pre-set input voltage.

TL/H/5671 8

Typical Applications (Continued)

Handling g 5V Analog Inputs

Read-Only Interface

TL/H/5671 34

TL/H/567133

*Beckman Instruments 694-3-R10K resistor array

mP Interfaced Comparator with Hysteresis

Protecting the Input

Diodes are 1N914

TL/H/5671 9

A Low-Cost, 3-Decade Logarithmic Converter

TL/H/567135

Analog Self-Test for a System

TL/H/567136

*LM389 transistors
A, B, C, D e LM324A quad op amp

10

TL/H/5671 37

Typical Applications (Continued)

3-Decade Logarithmic A/D Converter

Multiplexing Differential Inputs

Noise Filtering the Analog Input

fC e 20 Hz
Uses Chebyshev implementation for steeper roll-off
unity-gain, 2nd order, low-pass filter
Adding a separate filter for each channel increases
system response time if an analog multiplexer
is used

Increasing Bus Drive and/or Reducing Time on Bus

Output Buffers with A/D Data Enabled

TL/H/5671 10

*A/D output data is updated 1 CLK period

prior to assertion of INTR

*Allows output data to set-up at falling edge of CS

11

Typical Applications (Continued)

Sampling an AC Input Signal

Note 1: Oversample whenever possible [keep fs l 2f( b 60)] to eliminate input frequency folding
(aliasing) and to allow for the skirt response of the filter.
Note 2: Consider the amplitude errors which are introduced within the passband of the filter.

70% Power Savings by Clock Gating

(Complete shutdown takes & 30 seconds.)

Power Savings by A/D and VREF Shutdown

TL/H/5671 11

*Use ADC0801, 02, 03 or 05 for lowest power consumption.

Note: Logic inputs can be driven to VCC with A/D supply at zero volts.
Buffer prevents data bus from overdriving output of A/D when in shutdown mode.

12

Functional Description

other words, if we apply an analog input equal to the centervalue g (/4 LSB, we guarantee that the A/D will produce the
correct digital code. The maximum range of the position of
the code transition is indicated by the horizontal arrow and it
is guaranteed to be no more than (/2 LSB.
The error curve of Figure 1c shows a worst case error plot
for the ADC0802. Here we guarantee that if we apply an
analog input equal to the LSB analog voltage center-value
the A/D will produce the correct digital code.
Next to each transfer function is shown the corresponding
error plot. Many people may be more familiar with error plots
than transfer functions. The analog input voltage to the A/D
is provided by either a linear ramp or by the discrete output
steps of a high resolution DAC. Notice that the error is continuously displayed and includes the quantization uncertainty of the A/D. For example the error at point 1 of Figure 1a
is a (/2 LSB because the digital code appeared (/2 LSB in
advance of the center-value of the tread. The error plots
always have a constant negative slope and the abrupt upside steps are always 1 LSB in magnitude.

1.0 UNDERSTANDING A/D ERROR SPECS

A perfect A/D transfer characteristic (staircase waveform) is
shown in Figure 1a . The horizontal scale is analog input
voltage and the particular points labeled are in steps of 1
LSB (19.53 mV with 2.5V tied to the VREF/2 pin). The digital
output codes that correspond to these inputs are shown as
Db1, D, and D a 1. For the perfect A/D, not only will centervalue (Ab1, A, A a 1, . . . . ) analog inputs produce the correct output ditigal codes, but also each riser (the transitions
between adjacent output codes) will be located g (/2 LSB
away from each center-value. As shown, the risers are ideal
and have no width. Correct digital output codes will be provided for a range of analog input voltages that extend g (/2
LSB from the ideal center-values. Each tread (the range of
analog input voltage that provides the same digital output
code) is therefore 1 LSB wide.

Figure 1b shows a worst case error plot for the ADC0801.

All center-valued inputs are guaranteed to produce the correct output codes and the adjacent risers are guaranteed to
be no closer to the center-value points than g (/4 LSB. In

Error Plot

Transfer Function

a) Accuracy e g 0 LSB: A Perfect A/D

Transfer Function

Error Plot

b) Accuracy e g (/4 LSB

Transfer Function

Error Plot

c) Accuracy e g (/2 LSB

FIGURE 1. Clarifying the Error Specs of an A/D Converter
13

TL/H/5671 12

Functional Description (Continued)

A functional diagram of the A/D converter is shown in Figure 2 . All of the package pinouts are shown and the major
logic control paths are drawn in heavier weight lines.
The converter is started by having CS and WR simultaneously low. This sets the start flip-flop (F/F) and the resulting 1 level resets the 8-bit shift register, resets the Interrupt (INTR) F/F and inputs a 1 to the D flop, F/F1, which
is at the input end of the 8-bit shift register. Internal clock
signals then transfer this 1 to the Q output of F/F1. The
AND gate, G1, combines this 1 output with a clock signal
to provide a reset signal to the start F/F. If the set signal is
no longer present (either WR or CS is a 1) the start F/F is
reset and the 8-bit shift register then can have the 1
clocked in, which starts the conversion process. If the set
signal were to still be present, this reset pulse would have
no effect (both outputs of the start F/F would momentarily
be at a 1 level) and the 8-bit shift register would continue
to be held in the reset mode. This logic therefore allows for
wide CS and WR signals and the converter will start after at
least one of these signals returns high and the internal
clocks again provide a reset signal for the start F/F.

2.0 FUNCTIONAL DESCRIPTION

The ADC0801 series contains a circuit equivalent of the
256R network. Analog switches are sequenced by successive approximation logic to match the analog difference input voltage [VIN( a ) b VIN(b)] to a corresponding tap on
the R network. The most significant bit is tested first and
after 8 comparisons (64 clock cycles) a digital 8-bit binary
code (1111 1111 e full-scale) is transferred to an output
latch and then an interrupt is asserted (INTR makes a highto-low transition). A conversion in process can be interrupted by issuing a second start command. The device may be
operated in the free-running mode by connecting INTR to
the WR input with CS e 0. To ensure start-up under all possible conditions, an external WR pulse is required during the
first power-up cycle.
On the high-to-low transition of the WR input the internal
SAR latches and the shift register stages are reset. As long
as the CS input and WR input remain low, the A/D will remain in a reset state. Conversion will start from 1 to 8 clock
periods after at least one of these inputs makes a low-tohigh transition .

TL/H/5671 13

Note 1: CS shown twice for clarity.

Note 2: SAR e Successive Approximation Register.

FIGURE 2. Block Diagram

14

Functional Description (Continued)

slight time difference between the input voltage samples is
given by:

After the 1 is clocked through the 8-bit shift register

(which completes the SAR search) it appears as the input to
the D-type latch, LATCH 1. As soon as this 1 is output
from the shift register, the AND gate, G2, causes the new
digital word to transfer to the TRI-STATE output latches.
When LATCH 1 is subsequently enabled, the Q output
makes a high-to-low transition which causes the INTR F/F
to set. An inverting buffer then supplies the INTR input signal.
Note that this SET control of the INTR F/F remains low for
8 of the external clock periods (as the internal clocks run at
(/8 of the frequency of the external clock). If the data output
is continuously enabled (CS and RD both held low), the
INTR output will still signal the end of conversion (by a highto-low transition), because the SET input can control the Q
output of the INTR F/F even though the RESET input is
constantly at a 1 level in this operating mode. This INTR
output will therefore stay low for the duration of the SET
signal, which is 8 periods of the external clock frequency
(assuming the A/D is not started during this interval).
When operating in the free-running or continuous conversion mode (INTR pin tied to WR and CS wired lowsee
also section 2.8), the START F/F is SET by the high-to-low
transition of the INTR signal. This resets the SHIFT REGISTER which causes the input to the D-type latch, LATCH 1,
to go low. As the latch enable input is still present, the Q
output will go high, which then allows the INTR F/F to be
RESET. This reduces the width of the resulting INTR output
pulse to only a few propagation delays (approximately 300
ns).
When data is to be read, the combination of both CS and
RD being low will cause the INTR F/F to be reset and the
TRI-STATE output latches will be enabled to provide the 8bit digital outputs.

DVe(MAX) e (VP) (2qfcm)

#f J,
4.5

CLK

where:
DVe is the error voltage due to sampling delay
VP is the peak value of the common-mode voltage
fcm is the common-mode frequency
As an example, to keep this error to (/4 LSB ( E 5 mV) when
operating with a 60 Hz common-mode frequency, fcm, and
using a 640 kHz A/D clock, fCLK, would allow a peak value
of the common-mode voltage, VP, which is given by:
[DVe(MAX) (fCLK)]
VP e
(2qfcm) (4.5)
or
(5 c 10b3) (640 c 103)
(6.28) (60) (4.5)
which gives
VP j 1.9V.
The allowed range of analog input voltages usually places
more severe restrictions on input common-mode noise levels.
An analog input voltage with a reduced span and a relatively
large zero offset can be handled easily by making use of the
differential input (see section 2.4 Reference Voltage).
VP e

2.3 Analog Inputs

2.3.1 Input Current
Normal Mode
Due to the internal switching action, displacement currents
will flow at the analog inputs. This is due to on-chip stray
capacitance to ground as shown in Figure 3 .

2.1 Digital Control Inputs

The digital control inputs (CS, RD, and WR) meet standard
T2L logic voltage levels. These signals have been renamed
when compared to the standard A/D Start and Output Enable labels. In addition, these inputs are active low to allow
an easy interface to microprocessor control busses. For
non-microprocessor based applications, the CS input (pin 1)
can be grounded and the standard A/D Start function is
obtained by an active low pulse applied at the WR input (pin
3) and the Output Enable function is caused by an active
low pulse at the RD input (pin 2).
2.2 Analog Differential Voltage Inputs and
Common-Mode Rejection
This A/D has additional applications flexibility due to the
analog differential voltage input. The VIN(b) input (pin 7)
can be used to automatically subtract a fixed voltage value
from the input reading (tare correction). This is also useful in
4 mA 20 mA current loop conversion. In addition, commonmode noise can be reduced by use of the differential input.
The time interval between sampling VIN( a ) and VIN(b) is 4(/2 clock periods. The maximum error voltage due to this

TL/H/5671 14

rON of SW 1 and SW 2 j 5 kX
r e rON CSTRAY j 5 kX c 12 pF e 60 ns

FIGURE 3. Analog Input Impedance

15

Functional Description (Continued)

resistance and the use of an input bypass capacitor. This
error can be eliminated by doing a full-scale adjustment of
the A/D (adjust VREF/2 for a proper full-scale readingsee
section 2.5.2 on Full-Scale Adjustment) with the source resistance and input bypass capacitor in place.

The voltage on this capacitance is switched and will result in

currents entering the VIN( a ) input pin and leaving the
VIN(b) input which will depend on the analog differential
input voltage levels. These current transients occur at the
leading edge of the internal clocks. They rapidly decay and
do not cause errors as the on-chip comparator is strobed at
the end of the clock period.

2.4 Reference Voltage

2.4.1 Span Adjust
For maximum applications flexibility, these A/Ds have been
designed to accommodate a 5 VDC, 2.5 VDC or an adjusted
voltage reference. This has been achieved in the design of
the IC as shown in Figure 4 .

Fault Mode
If the voltage source applied to the VIN( a ) or VIN(b) pin
exceeds the allowed operating range of VCC a 50 mV, large
input currents can flow through a parasitic diode to the VCC
pin. If these currents can exceed the 1 mA max allowed
spec, an external diode (1N914) should be added to bypass
this current to the VCC pin (with the current bypassed with
this diode, the voltage at the VIN( a ) pin can exceed the
VCC voltage by the forward voltage of this diode).
2.3.2 Input Bypass Capacitors
Bypass capacitors at the inputs will average these charges
and cause a DC current to flow through the output resistances of the analog signal sources. This charge pumping
action is worse for continuous conversions with the VIN( a )
input voltage at full-scale. For continuous conversions with
a 640 kHz clock frequency with the VIN( a ) input at 5V, this
DC current is at a maximum of approximately 5 mA. Therefore, bypass capacitors should not be used at the analog
inputs or the VREF/2 pin for high resistance sources (l 1
kX). If input bypass capacitors are necessary for noise filtering and high source resistance is desirable to minimize capacitor size, the detrimental effects of the voltage drop
across this input resistance, which is due to the average
value of the input current, can be eliminated with a full-scale
adjustment while the given source resistor and input bypass
capacitor are both in place. This is possible because the
average value of the input current is a precise linear function of the differential input voltage.
2.3.3 Input Source Resistance
Large values of source resistance where an input bypass
capacitor is not used, will not cause errors as the input currents settle out prior to the comparison time. If a low pass
filter is required in the system, use a low valued series resistor (s 1 kX) for a passive RC section or add an op amp RC
active low pass filter. For low source resistance applications, (s 1 kX), a 0.1 mF bypass capacitor at the inputs will
prevent noise pickup due to series lead inductance of a long
wire. A 100X series resistor can be used to isolate this capacitorboth the R and C are placed outside the feedback
loopfrom the output of an op amp, if used.

TL/H/5671 15

FIGURE 4. The VREFERENCE Design on the IC

Notice that the reference voltage for the IC is either (/2 of
the voltage applied to the VCC supply pin, or is equal to the
voltage that is externally forced at the VREF/2 pin. This allows for a ratiometric voltage reference using the VCC supply, a 5 VDC reference voltage can be used for the VCC
supply or a voltage less than 2.5 VDC can be applied to the
VREF/2 input for increased application flexibility. The internal gain to the VREF/2 input is 2, making the full-scale differential input voltage twice the voltage at pin 9.
An example of the use of an adjusted reference voltage is to
accommodate a reduced spanor dynamic voltage range
of the analog input voltage. If the analog input voltage were
to range from 0.5 VDC to 3.5 VDC, instead of 0V to 5 VDC,
the span would be 3V as shown in Figure 5 . With 0.5 VDC
applied to the VIN(b) pin to absorb the offset, the reference
voltage can be made equal to (/2 of the 3V span or 1.5 VDC.
The A/D now will encode the VIN( a ) signal from 0.5V to 3.5
V with the 0.5V input corresponding to zero and the 3.5 VDC
input corresponding to full-scale. The full 8 bits of resolution
are therefore applied over this reduced analog input voltage
range.

2.3.4 Noise
The leads to the analog inputs (pin 6 and 7) should be kept
as short as possible to minimize input noise coupling. Both
noise and undesired digital clock coupling to these inputs
can cause system errors. The source resistance for these
inputs should, in general, be kept below 5 kX. Larger values
of source resistance can cause undesired system noise
pickup. Input bypass capacitors, placed from the analog inputs to ground, will eliminate system noise pickup but can
create analog scale errors as these capacitors will average
the transient input switching currents of the A/D (see section 2.3.1.). This scale error depends on both a large source

16

Functional Description (Continued)

*Add if VREF/2 s 1 VDC with LM358

to draw 3 mA to ground.

TL/H/5671 16

a) Analog Input Signal Example

b) Accommodating an Analog Input from

0.5V (Digital Out e e 00HEX) to 3.5V
(Digital Out e FFHEX)

FIGURE 5. Adapting the A/D Analog Input Voltages to Match an Arbitrary Input Signal Range
2.5 Errors and Reference Voltage Adjustments

2.4.2 Reference Accuracy Requirements

The converter can be operated in a ratiometric mode or an
absolute mode. In ratiometric converter applications, the
magnitude of the reference voltage is a factor in both the
output of the source transducer and the output of the A/D
converter and therefore cancels out in the final digital output
code. The ADC0805 is specified particularly for use in ratiometric applications with no adjustments required. In absolute conversion applications, both the initial value and the
temperature stability of the reference voltage are important
factors in the accuracy of the A/D converter. For VREF/2
voltages of 2.4 VDC nominal value, initial errors of g 10
mVDC will cause conversion errors of g 1 LSB due to the
gain of 2 of the VREF/2 input. In reduced span applications,
the initial value and the stability of the VREF/2 input voltage
become even more important. For example, if the span is
reduced to 2.5V, the analog input LSB voltage value is correspondingly reduced from 20 mV (5V span) to 10 mV and
1 LSB at the VREF/2 input becomes 5 mV. As can be seen,
this reduces the allowed initial tolerance of the reference
voltage and requires correspondingly less absolute change
with temperature variations. Note that spans smaller than
2.5V place even tighter requirements on the initial accuracy
and stability of the reference source.
In general, the magnitude of the reference voltage will require an initial adjustment. Errors due to an improper value
of reference voltage appear as full-scale errors in the A/D
transfer function. IC voltage regulators may be used for references if the ambient temperature changes are not excessive. The LM336B 2.5V IC reference diode (from National
Semiconductor) has a temperature stability of 1.8 mV typ
(6 mV max) over 0 CsTAs a 70 C. Other temperature
range parts are also available.

2.5.1 Zero Error

The zero of the A/D does not require adjustment. If the
minimum analog input voltage value, VIN(MIN), is not ground,
a zero offset can be done. The converter can be made to
output 0000 0000 digital code for this minimum input voltage
by biasing the A/D VIN(b) input at this VIN(MIN) value (see
Applications section). This utilizes the differential mode operation of the A/D.
The zero error of the A/D converter relates to the location
of the first riser of the transfer function and can be measured by grounding the VIN (b) input and applying a small
magnitude positive voltage to the VIN ( a ) input. Zero error
is the difference between the actual DC input voltage that is
necessary to just cause an output digital code transition
from 0000 0000 to 0000 0001 and the ideal (/2 LSB value
((/2 LSB e 9.8 mV for VREF/2 e 2.500 VDC).
2.5.2 Full-Scale
The full-scale adjustment can be made by applying a differential input voltage that is 1(/2 LSB less than the desired
analog full-scale voltage range and then adjusting the magnitude of the VREF/2 input (pin 9 or the VCC supply if pin 9 is
not used) for a digital output code that is just changing from
1111 1110 to 1111 1111.

17

Functional Description (Continued)

conversion in process is not allowed to be completed, therefore the data of the previous conversion remains in this
latch. The INTR output simply remains at the 1 level.

2.5.3 Adjusting for an Arbitrary Analog Input Voltage

Range
If the analog zero voltage of the A/D is shifted away from
ground (for example, to accommodate an analog input signal that does not go to ground) this new zero reference
should be properly adjusted first. A VIN( a ) voltage that
equals this desired zero reference plus (/2 LSB (where the
LSB is calculated for the desired analog span, 1 LSB e analog span/256) is applied to pin 6 and the zero reference
voltage at pin 7 should then be adjusted to just obtain the
00HEX to 01HEX code transition.
The full-scale adjustment should then be made (with the
proper VIN(b) voltage applied) by forcing a voltage to the
VIN( a ) input which is given by:
(VMAX b VMIN)
,
VIN ( a ) fs adj e VMAXb1.5
256

2.8 Continuous Conversions

For operation in the free-running mode an initializing pulse
should be used, following power-up, to ensure circuit operation. In this application, the CS input is grounded and the
WR input is tied to the INTR output. This WR and INTR
node should be momentarily forced to logic low following a
power-up cycle to guarantee operation.
2.9 Driving the Data Bus
This MOS A/D, like MOS microprocessors and memories,
will require a bus driver when the total capacitance of the
data bus gets large. Other circuitry, which is tied to the data
bus, will add to the total capacitive loading, even in TRISTATE (high impedance mode). Backplane bussing also
greatly adds to the stray capacitance of the data bus.
There are some alternatives available to the designer to
handle this problem. Basically, the capacitive loading of the
data bus slows down the response time, even though DC
specifications are still met. For systems operating with a
relatively slow CPU clock frequency, more time is available
in which to establish proper logic levels on the bus and
therefore higher capacitive loads can be driven (see typical
characteristics curves).
At higher CPU clock frequencies time can be extended for
I/O reads (and/or writes) by inserting wait states (8080) or
using clock extending circuits (6800).
Finally, if time is short and capacitive loading is high, external bus drivers must be used. These can be TRI-STATE
buffers (low power Schottky such as the DM74LS240 series
is recommended) or special higher drive current products
which are designed as bus drivers. High current bipolar bus
drivers with PNP inputs are recommended.

where:
VMAX e The high end of the analog input range
and
VMIN e the low end (the offset zero) of the analog range.
(Both are ground referenced.)
The VREF/2 (or VCC) voltage is then adjusted to provide a
code change from FEHEX to FFHEX. This completes the adjustment procedure.
2.6 Clocking Option
The clock for the A/D can be derived from the CPU clock or
an external RC can be added to provide self-clocking. The
CLK IN (pin 4) makes use of a Schmitt trigger as shown in
Figure 6 .

1
1.1 RC
R j 10 kX
fCLK j

FIGURE 6. Self-Clocking the A/D

2.10 Power Supplies

Noise spikes on the VCC supply line can cause conversion
errors as the comparator will respond to this noise. A low
inductance tantalum filter capacitor should be used close to
the converter VCC pin and values of 1 mF or greater are
recommended. If an unregulated voltage is available in the
system, a separate LM340LAZ-5.0, TO-92, 5V voltage regulator for the converter (and other analog circuitry) will greatly
reduce digital noise on the VCC supply.

Heavy capacitive or DC loading of the clock R pin should be

avoided as this will disturb normal converter operation.
Loads less than 50 pF, such as driving up to 7 A/D converter clock inputs from a single clock R pin of 1 converter, are
allowed. For larger clock line loading, a CMOS or low power
TTL buffer or PNP input logic should be used to minimize
the loading on the clock R pin (do not use a standard TTL
buffer).

2.11 Wiring and Hook-Up Precautions

Standard digital wire wrap sockets are not satisfactory for
breadboarding this A/D converter. Sockets on PC boards
can be used and all logic signal wires and leads should be
grouped and kept as far away as possible from the analog
signal leads. Exposed leads to the analog inputs can cause
undesired digital noise and hum pickup, therefore shielded
leads may be necessary in many applications.

TL/H/567117

2.7 Restart During a Conversion

If the A/D is restarted (CS and WR go low and return high)
during a conversion, the converter is reset and a new conversion is started. The output data latch is not updated if the

18

Functional Description (Continued)

VREF/2 e 2.560V) can be determined. For example, for an
output LED display of 1011 0110 or B6 (in hex), the voltage
values from the table are 3.520 a 0.120 or 3.640 VDC.
These voltage values represent the center-values of a perfect A/D converter. The effects of quantization error have to
be accounted for in the interpretation of the test results.
For a higher speed test system, or to obtain plotted data, a
digital-to-analog converter is needed for the test set-up. An
accurate 10-bit DAC can serve as the precision voltage
source for the A/D. Errors of the A/D under test can be
expressed as either analog voltages or differences in 2 digital words.
A basic A/D tester that uses a DAC and provides the error
as an analog output voltage is shown in Figure 8 . The 2 op
amps can be eliminated if a lab DVM with a numerical subtraction feature is available to read the difference voltage,
A C, directly. The analog input voltage can be supplied
by a low frequency ramp generator and an X-Y plotter can
be used to provide analog error (Y axis) versus analog input
(X axis).
For operation with a microprocessor or a computer-based
test system, it is more convenient to present the errors digitally. This can be done with the circuit of Figure 9 , where the
output code transitions can be detected as the 10-bit DAC is
incremented. This provides (/4 LSB steps for the 8-bit A/D
under test. If the results of this test are automatically plotted
with the analog input on the X axis and the error (in LSBs)
as the Y axis, a useful transfer function of the A/D under
test results. For acceptance testing, the plot is not necessary and the testing speed can be increased by establishing
internal limits on the allowed error for each code.

A single point analog ground that is separate from the logic

ground points should be used. The power supply bypass
capacitor and the self-clocking capacitor (if used) should
both be returned to digital ground. Any VREF/2 bypass capacitors, analog input filter capacitors, or input signal shielding should be returned to the analog ground point. A test for
proper grounding is to measure the zero error of the A/D
converter. Zero errors in excess of (/4 LSB can usually be
traced to improper board layout and wiring (see section
2.5.1 for measuring the zero error).
3.0 TESTING THE A/D CONVERTER
There are many degrees of complexity associated with testing an A/D converter. One of the simplest tests is to apply a
known analog input voltage to the converter and use LEDs
to display the resulting digital output code as shown in Figure 7 .
For ease of testing, the VREF/2 (pin 9) should be supplied
with 2.560 VDC and a VCC supply voltage of 5.12 VDC
should be used. This provides an LSB value of 20 mV.
If a full-scale adjustment is to be made, an analog input
voltage of 5.090 VDC (5.1201(/2 LSB) should be applied to
the VIN( a ) pin with the VIN(b) pin grounded. The value of
the VREF/2 input voltage should then be adjusted until the
digital output code is just changing from 1111 1110 to 1111
1111. This value of VREF/2 should then be used for all the
tests.
The digital output LED display can be decoded by dividing
the 8 bits into 2 hex characters, the 4 most significant (MS)
and the 4 least significant (LS). Table I shows the fractional
binary equivalent of these two 4-bit groups. By adding the
voltages obtained from the VMS and VLS columns in
Table I, the nominal value of the digital display (when

4.0 MICROPROCESSOR INTERFACING

To dicuss the interface with 8080A and 6800 microprocessors, a common sample subroutine structure is used. The
microprocessor starts the A/D, reads and stores the results
of 16 successive conversions, then returns to the users
program. The 16 data bytes are stored in 16 successive
memory locations. All Data and Addresses will be given in
hexadecimal form. Software and hardware details are provided separately for each type of microprocessor.
4.1 Interfacing 8080 Microprocessor Derivatives (8048,
8085)
This converter has been designed to directly interface with
derivatives of the 8080 microprocessor. The A/D can be
mapped into memory space (using standard memory address decoding for CS and the MEMR and MEMW strobes)
or it can be controlled as an I/O device by using the I/O R
and I/O W strobes and decoding the address bits A0 x
A7 (or address bits A8 x A15 as they will contain the
same 8-bit address information) to obtain the CS input. Using the I/O space provides 256 additional addresses and
may allow a simpler 8-bit address decoder but the data can
only be input to the accumulator. To make use of the additional memory reference instructions, the A/D should be
mapped into memory space. An example of an A/D in I/O
space is shown in Figure 10 .

TL/H/5671 18

FIGURE 7. Basic A/D Tester

19

Functional Description (Continued)

FIGURE 8. A/D Tester with Analog Error Output

TL/H/5671 19

FIGURE 9. Basic Digital A/D Tester

TABLE I. DECODING THE DIGITAL OUTPUT LEDs

HEX

OUTPUT VOLTAGE
CENTER VALUES
WITH
VREF/2 e 2.560 VDC

FRACTIONAL BINARY VALUE FOR

BINARY

MS GROUP
F
E
D
C

1
1
1
1

1
1
1
1

1
1
0
0

1
0
1
0

B
A
9
8

1
1
1
1

0
0
0
0

1
1
0
0

1
0
1
0

7
6
5
4

0
0
0
0

1
1
1
1

1
1
0
0

1
0
1
0

3
2
1
0

0
0
0
0

0
0
0
0

1
1
0
0

1
0
1
0

LS GROUP
15/16

15/256

7/8

7/128
13/16

13/256

3/4

3/64
11/16

11/256

5/8

5/128
9/16

1/2

9/256
1/32

7/16

7/256

3/8

3/128
5/16

2/256

1/4

1/64
3/16

3/256

1/8

1/128
1/16

1/256

*Display Output e VMS Group a VLS Group

20

VMS GROUP*

VLS GROUP*

4.800
4.480
4.160
3.840

0.300
0.280
0.260
0.240

3.520
3.200
2/880
2/560

0.220
0.200
0.180
0.160

2.240
1.920
1.600
1/280

0.140
0.120
0.100
0.080

0.960
0.640
0.320
0

0.060
0.040
0.020
0

Functional Description (Continued)

TL/H/5671 20

Note 1: *Pin numbers for the DP8228 system controller, others are INS8080A.
Note 2: Pin 23 of the INS8228 must be tied to a 12V through a 1 kX resistor to generate the RST 7
instruction when an interrupt is acknowledged as required by the accompanying sample program.

FIGURE 10. ADC0801 INS8080A CPU Interface

0038

#
#

SAMPLE PROGRAM FOR FIGURE 10 ADC0801 INS8080A CPU INTERFACE

C3 00 03
RST 7:
JMP
LD DATA

#
#

#
#

0100

21 00 02

START:

LXI H 0200H

0103
0106
0107
0109
010C
010E
010F
0110
0113

31 00 04
7D
FE OF
CA 13 01
D3 E0
FB
00
C3 OF 01

RETURN:

LXI SP 0400H
MOV A, L
CPI OF H
JZ CONT
OUT E0 H
EI
NOP
JMP LOOP

#
#
#
#
#
0300
0302
0303
0304

#
#
#
#
#
#
DB E0
77
23
C3 03 01

LOOP:
CONT:

#
(User program to
process data)

#
#
LD DATA:

; HL pair will point to

; data storage locations
; Initialize stack pointer (Note 1)
; Test # of bytes entered
; If # 4 16. JMP to
; user program
; Start A/D
; Enable interrupt
; Loop until end of
; conversion

#
#
#
#
#
#
IN E0 H
MOV M, A
INX H
JMP RETURN

; Load data into accumulator

; Store data
; Increment storage pointer

Note 1: The stack pointer must be dimensioned because a RST 7 instruction pushes the PC onto the stack.
Note 2: All address used were arbitrarily chosen.

21

Functional Description (Continued)

It is important to note that in systems where the A/D converter is 1-of-8 or less I/O mapped devices, no address
decoding circuitry is necessary. Each of the 8 address bits
(A0 to A7) can be directly used as CS inputsone for each
I/O device.

The standard control bus signals of the 8080 CS, RD and

WR) can be directly wired to the digital control inputs of the
A/D and the bus timing requirements are met to allow both
starting the converter and outputting the data onto the data
bus. A bus driver should be used for larger microprocessor
systems where the data bus leaves the PC board and/or
must drive capacitive loads larger than 100 pF.

4.1.2 INS8048 Interface

The INS8048 interface technique with the ADC0801 series
(see Figure 11 ) is simpler than the 8080A CPU interface.
There are 24 I/O lines and three test input lines in the 8048.
With these extra I/O lines available, one of the I/O lines (bit
0 of port 1) is used as the chip select signal to the A/D, thus
eliminating the use of an external address decoder. Bus
control signals RD, WR and INT of the 8048 are tied directly
to the A/D. The 16 converted data words are stored at onchip RAM locations from 20 to 2F (Hex). The RD and WR
signals are generated by reading from and writing into a
dummy address, respectively. A sample interface program
is shown below.

4.1.1 Sample 8080A CPU Interfacing Circuitry and

Program
The following sample program and associated hardware
shown in Figure 10 may be used to input data from the
converter to the INS8080A CPU chip set (comprised of the
INS8080A microprocessor, the INS8228 system controller
and the INS8224 clock generator). For simplicity, the A/D is
controlled as an I/O device, specifically an 8-bit bi-directional port located at an arbitrarily chosen port address, E0. The
TRI-STATE output capability of the A/D eliminates the need
for a peripheral interface device, however address decoding
is still required to generate the appropriate CS for the converter.

TL/H/5671 21

FIGURE 11. INS8048 Interface

SAMPLE PROGRAM FOR FIGURE 11 INS8048 INTERFACE
04 10
04 50
99 FE
81
89 01
B8 20
B9 FF
BA 10
23 FF
99 FE
91
05
96 21
EA 1B
00
00
81
A0
18
89 01
27
93

START:

AGAIN:

LOOP:

INDATA:

JMP
ORG
JMP
ORG
ANL
MOVX

10H
3H
50H
10H
P1, #0FEH
A, @R1

ORL
MOV
MOV
MOV
MOV
ANL
MOVX
EN
JNZ
DJNZ
NOP
NOP
ORG
MOVX
MOV
INC
ORL
CLR
RETR

P1, 1
R0, #20H
R1, #0FFH
R2, #10H
A, #0FFH
P1, #0FEH
@R1, A
I
LOOP
R2, AGAIN

50H
A, @R1
@R0, A
R0
P1, #1
A
22

: Program starts at addr 10

; Interrupt jump vector
; Main program
; Chip select
; Read in the 1st data
; to reset the intr
; Set port pin high
; Data address
; Dummy address
; Counter for 16 bytes
; Set ACC for intr loop
; Send CS (bit 0 of P1)
; Send WR out
; Enable interrupt
; Wait for interrupt
; If 16 bytes are read
; go to users program

; Input data, CS still low

; Store in memory
; Increment storage counter
; Reset CS signal
; Clear ACC to get out of
; the interrupt loop

ready decoded 4/5 line is brought out to the common bus at

pin 21. This can be tied directly to the CS pin of the A/D,
provided that no other devices are addressed at HX ADDR:
4XXX or 5XXX.

Functional Description (Continued)

4.2 Interfacing the Z-80
The Z-80 control bus is slightly different from that of the
8080. General RD and WR strobes are provided and separate memory request, MREQ, and I/O request, IORQ, signals are used which have to be combined with the generalized strobes to provide the equivalent 8080 signals. An advantage of operating the A/D in I/O space with the Z-80 is
that the CPU will automatically insert one wait state (the RD
and WR strobes are extended one clock period) to allow
more time for the I/O devices to respond. Logic to map the
A/D in I/O space is shown in Figure 13 .

The following subroutine performs essentially the same

function as in the case of the 8080A interface and it can be
called from anywhere in the users program.
In Figure 15 the ADC0801 series is interfaced to the M6800
microprocessor through (the arbitrarily chosen) Port B of the
MC6820 or MC6821 Peripheral Interface Adapter, (PIA).
Here the CS pin of the A/D is grounded since the PIA is
already memory mapped in the M6800 system and no CS
decoding is necessary. Also notice that the A/D output data
lines are connected to the microprocessor bus under program control through the PIA and therefore the A/D RD pin
can be grounded.
A sample interface program equivalent to the previous one
is shown below Figure 15 . The PIA Data and Control Registers of Port B are located at HEX addresses 8006 and 8007,
respectively.

TL/H/5671 23

FIGURE 13. Mapping the A/D as an I/O Device

for Use with the Z-80 CPU
Additional I/O advantages exist as software DMA routines
are available and use can be made of the output data transfer which exists on the upper 8 address lines (A8 to A15)
during I/O input instructions. For example, MUX channel
selection for the A/D can be accomplished with this operating mode.

5.0 GENERAL APPLICATIONS

The following applications show some interesting uses for
the A/D. The fact that one particular microprocessor is used
is not meant to be restrictive. Each of these application circuits would have its counterpart using any microprocessor
that is desired.
5.1 Multiple ADC0801 Series to MC6800 CPU Interface
To transfer analog data from several channels to a single
microprocessor system, a multiple converter scheme presents several advantages over the conventional multiplexer
single-converter approach. With the ADC0801 series, the
differential inputs allow individual span adjustment for each
channel. Furthermore, all analog input channels are sensed
simultaneously, which essentially divides the microprocessors total system servicing time by the number of channels,
since all conversions occur simultaneously. This scheme is
shown in Figure 16 .

4.3 Interfacing 6800 Microprocessor Derivatives

(6502, etc.)
The control bus for the 6800 microprocessor derivatives
does not use the RD and WR strobe signals. Instead it employs a single R/W line and additional timing, if needed, can
be derived fom the w2 clock. All I/O devices are memory
mapped in the 6800 system, and a special signal, VMA,
indicates that the current address is valid. Figure 14 shows
an interface schematic where the A/D is memory mapped in
the 6800 system. For simplicity, the CS decoding is shown
using (/2 DM8092. Note that in many 6800 systems, an al-

Note 1: Numbers in parentheses refer to MC6800 CPU pin out.

Note 2: Number or letters in brackets refer to standard M6800 system common bus code.

FIGURE 14. ADC0801-MC6800 CPU Interface

23

TL/H/5671 24

Functional Description (Continued)

0010
0012
0015
0018
001B
001C
001D
001F
0022
0024
0027
0028
002A
002C
002E
0031
0033
0034
0036
0038
003B
003D
003F

SAMPLE PROGRAM FOR FIGURE 14 ADC0801-MC6800 CPU INTERFACE

DF 36
DATAIN
STX
TEMP2
; Save contents of X
CE 00 2C
LDX
#$002C
; Upon IRQ low CPU
FF FF F8
STX
$FFF8
; jumps to 002C
B7 50 00
STAA
$5000
; Start ADC0801
0E
CLI
3E
CONVRT
WAI
; Wait for interrupt
DE 34
LDX
TEMP1
8C 02 0F
CPX
#$020F
; Is final data stored?
27 14
BEQ
ENDP
B7 50 00
STAA
$5000
; Restarts ADC0801
08
INX
DF 34
STX
TEMP1
20 F0
BRA
CONVRT
DE 34
INTRPT
LDX
TEMP1
B6 50 00
LDAA
$5000
; Read data
A7 00
STAA
X
; Store it at X
3B
RTI
02 00
TEMP1
FDB
$0200
; Starting address for
; data storage
00 00
TEMP2
FDB
$0000
CE 02 00
ENDP
LDX
#$0200
; Reinitialize TEMP1
DF 34
STX
TEMP1
DE 36
LDX
TEMP2
39
RTS
; Return from subroutine
; To users program

Note 1: In order for the microprocessor to service subroutines and interrupts, the stack pointer must be dimensioned in the users program.

TL/H/5671 25

FIGURE 15. ADC0801 MC6820 PIA Interface

24

Functional Description (Continued)

SAMPLE PROGRAM FOR FIGURE 15 ADC0801 MC6820 PIA INTERFACE
0010
0013
0016
0019
001A
001D
0020
0021
0023
0025
0028
002B
002C
002E
0031
0033
0034
0036
0038
003A
003D
003F
0040

CE 00 38
FF FF F8
B6 80 06
4F
B7 80 07
B7 80 06
0E
C6 34
86 3D
F7 80 07
B7 80 07
3E
DE 40
8C 02 0F
27 0F
08
DF 40
20 ED
DE 40
B6 80 06
A7 00
3B
02 00

0042
0045
0047

CE 02 00
DF 40
39

DATAIN

CONVRT

INTRPT

TEMP1
ENDP

PIAORB
PIACRB

LDX
STX
LDAA
CLRA
STAA
STAA
CLI
LDAB
LDAA
STAB
STAA
WAI
LDX
CPX
BEQ
INX
STX
BRA
LDX
LDAA
STAA
RTI
FDB

#$0038
$FFF8
PIAORB

; Upon IRQ low CPU

; jumps to 0038
; Clear possible IRQ flags

PIACRB
PIAORB

; Set Port B as input

#$34
#$3D
PIACRB
PIACRB

; Starts ADC0801
; Wait for interrupt

TEMP1
#$020F
ENDP
TEMP1
CONVRT
TEMP1
PIAORB
X
$0200
#$0200
TEMP1

LDX
STX
RTS
EQU
EQU

$8006
$8007

The following schematic and sample subroutine (DATA IN)

may be used to interface (up to) 8 ADC0801s directly to the
MC6800 CPU. This scheme can easily be extended to allow
the interface of more converters. In this configuration the
converters are (arbitrarily) located at HEX address 5000 in
the MC6800 memory space. To save components, the
clock signal is derived from just one RC pair on the first
converter. This output drives the other A/Ds.
All the converters are started simultaneously with a STORE
instruction at HEX address 5000. Note that any other HEX
address of the form 5XXX will be decoded by the circuit,
pulling all the CS inputs low. This can easily be avoided by
using a more definitive address decoding scheme. All the
interrupts are ORed together to insure that all A/Ds have
completed their conversion before the microprocessor is interrupted.
The subroutine, DATA IN, may be called from anywhere in
the users program. Once called, this routine initializes the

; Is final data stored?

; Read data in
; Store it at X
; Starting address for
; data storage
; Reinitialize TEMP1
; Return from subroutine
; To users program

CPU, starts all the converters simultaneously and waits for

the interrupt signal. Upon receiving the interrupt, it reads the
converters (from HEX addresses 5000 through 5007) and
stores the data successively at (arbitrarily chosen) HEX addresses 0200 to 0207, before returning to the users program. All CPU registers then recover the original data they
had before servicing DATA IN.
5.2 Auto-Zeroed Differential Transducer Amplifier
and A/D Converter
The differential inputs of the ADC0801 series eliminate the
need to perform a differential to single ended conversion for
a differential transducer. Thus, one op amp can be eliminated since the differential to single ended conversion is provided by the differential input of the ADC0801 series. In general, a transducer preamp is required to take advantage of
the full A/D converter input dynamic range.

25

Functional Description (Continued)

Note 1: Numbers in parentheses refer to MC6800 CPU pin out.

Note 2: Numbers of letters in brackets refer to standard M6800 system common bus code.

TL/H/5671 26

FIGURE 16. Interfacing Multiple A/Ds in an MC6800 System

SAMPLE PROGRAM FOR FIGURE 16 INTERFACING MULTIPLE A/Ds IN AN MC6800 SYSTEM
ADDRESS
HEX CODE
MNEMONICS
COMMENTS
0010
DF 44
DATAIN
STX
TEMP
; Save Contents of X
0012
CE 00 2A
LDX
#$002A
; Upon IRQ LOW CPU
0015
FF FF F8
STX
$FFF8
; Jumps to 002A
0018
B7 50 00
STAA
$5000
; Starts all A/Ds
001B
0E
CLI
001C
3E
WAI
; Wait for interrupt
001D
CE 50 00
LDX
#$5000
0020
DF 40
STX
INDEX1
; Reset both INDEX
0022
CE 02 00
LDX
#$0200
; 1 and 2 to starting
0025
DF 42
STX
INDEX2
; addresses
0027
DE 44
LDX
TEMP
0029
39
RTS
; Return from subroutine
002A
DE 40
INTRPT
LDX
INDEX1
; INDEX1 x X
002C
A6 00
LDAA
X
; Read data in from A/D at X
002E
08
INX
; Increment X by one
002F
DF 40
STX
INDEX1
; X x INDEX1
0031
DE 42
LDX
INDEX2
; INDEX2 x X
26

Functional Description (Continued)

SAMPLE PROGRAM FOR FIGURE 16 INTERFACING MULTIPLE A/Ds IN AN MC6800 SYSTEM
ADDRESS
HEX CODE
MNEMONICS
COMMENTS
0033
A7 00
STAA
X
; Store data at X
0035
8C 02 07
CPX
#$0207
; Have all A/Ds been read?
0038
27 05
BEQ
RETURN
; Yes: branch to RETURN
003A
08
INX
; No: increment X by one
003B
DF 42
STX
INDEX2
; X x INDEX2
003D
20 EB
BRA
INTRPT
; Branch to 002A
003F
3B
RETURN
RTI
0040
50 00
INDEX1
FDB
$5000
; Starting address for A/D
0042
02 00
INDEX2
FDB
$0200
; Starting address for data storage
0044
00 00
TEMP
FDB
$0000
Note 1: In order for the microprocessor to service subroutines and interrupts, the stack pointer must be dimensioned in the users program.

SW1 is closed to force the preamps differential input to be

zero during the zeroing subroutine and then opened and
SW2 is then closed for conversion of the actual differential
input signal. Using 2 switches in this manner eliminates concern for the ON resistance of the switches as they must
conduct only the input bias current of the input amplifiers.
Output Port B is used as a successive approximation register by the 8080 and the binary scaled resistors in series with
each output bit create a D/A converter. During the zeroing
subroutine, the voltage at Vx increases or decreases as required to make the differential output voltage equal to zero.
This is accomplished by ensuring that the voltage at the
output of A1 is approximately 2.5V so that a logic 1 (5V)
on any output of Port B will source current into node VX thus
raising the voltage at VX and making the output differential
more negative. Conversely, a logic 0 (0V) will pull current
out of node VX and decrease the voltage, causing the differential output to become more positive. For the resistor values shown, VX can move g 12 mV with a resolution of 50
mV, which will null the offset error term to (/4 LSB of fullscale for the ADC0801. It is important that the voltage levels
that drive the auto-zero resistors be constant. Also, for symmetry, a logic swing of 0V to 5V is convenient. To achieve
this, a CMOS buffer is used for the logic output signals of
Port B and this CMOS package is powered with a stable 5V
source. Buffer amplifier A1 is necessary so that it can
source or sink the D/A output current.

For amplification of DC input signals, a major system error is

the input offset voltage of the amplifiers used for the
preamp. Figure 17 is a gain of 100 differential preamp
whose offset voltage errors will be cancelled by a zeroing
subroutine which is performed by the INS8080A microprocessor system. The total allowable input offset voltage error
for this preamp is only 50 mV for (/4 LSB error. This would
obviously require very precise amplifiers. The expression for
the differential output voltage of the preamp is:

VO e [VIN( a )bVIN(b)] 1 a

Y X Y

SIGNAL

GAIN

(VOS2 b VOS1 b VOS3 g IXRX)

2R2
a
R1

#1

2R2
R1

Y X Y

DC ERROR TERM
GAIN
where IX is the current through resistor RX. All of the offset
error terms can be cancelled by making g IXRX e VOS1 a
VOS3 b VOS2. This is the principle of this auto-zeroing
scheme.
The INS8080A uses the 3 I/O ports of an INS8255 Programable Peripheral Interface (PPI) to control the auto zeroing and input data from the ADC0801 as shown in Figure 18 .
The PPI is programmed for basic I/O operation (mode 0)
with Port A being an input port and Ports B and C being
output ports. Two bits of Port C are used to alternately open
or close the 2 switches at the input of the preamp. Switch

27

Functional Description (Continued)

Note 1: R2 e 49.5 R1
Note 2: Switches are LMC13334 CMOS analog switches.
Note 3: The 9 resistors used in the auto-zero section can be g 5% tolerance.

FIGURE 17. Gain of 100 Differential Transducer Preamp

TL/H/5671 27

FIGURE 18. Microprocessor Interface Circuitry for Differential Preamp

28

A flow chart for the zeroing subroutine is shown in Figure

19 . It must be noted that the ADC0801 series will output an
all zero code when it converts a negative input [VIN(b) t
VIN( a )]. Also, a logic inversion exists as all of the I/O ports
are buffered with inverting gates.
Basically, if the data read is zero, the differential output voltage is negative, so a bit in Port B is cleared to pull VX more
negative which will make the output more positive for the
next conversion. If the data read is not zero, the output voltage is positive so a bit in Port B is set to make VX more
positive and the output more negative. This continues for 8
approximations and the differential output eventually converges to within 5 mV of zero.
The actual program is given in Figure 20 . All addresses
used are compatible with the BLC 80/10 microcomputer
system. In particular:
Port A and the ADC0801 are at port address E4
Port B is at port address E5
Port C is at port address E6
PPI control word port is at port address E7
Program Counter automatically goes to ADDR:3C3D upon
acknowledgement of an interrupt from the ADC0801
5.3 Multiple A/D Converters in a Z-80 Interrupt
Driven Mode
In data acquisition systems where more than one A/D converter (or other peripheral device) will be interrupting program execution of a microprocessor, there is obviously a
need for the CPU to determine which device requires servicing. Figure 21 and the accompanying software is a method
of determining which of 7 ADC0801 converters has completed a conversion (INTR asserted) and is requesting an
interrupt. This circuit allows starting the A/D converters in
any sequence, but will input and store valid data from the
converters with a priority sequence of A/D 1 being read first,
A/D 2 second, etc., through A/D 7 which would have the
lowest priority for data being read. Only the converters
whose INT is asserted will be read.
The key to decoding circuitry is the DM74LS373, 8-bit D
type flip-flop. When the Z-80 acknowledges the interrupt,
the program is vectored to a data input Z-80 subroutine.
This subroutine will read a peripheral status word from the
DM74LS373 which contains the logic state of the INTR outputs of all the converters. Each converter which initiates an
interrupt will place a logic 0 in a unique bit position in the
status word and the subroutine will determine the identity of
the converter and execute a data read. An identifier word
(which indicates which A/D the data came from) is stored in
the next sequential memory location above the location of
the data so the program can keep track of the identity of the
data entered.
TL/H/5671 28

FIGURE 19. Flow Chart for Auto-Zero Routine

29

3D00
3D02
3D04
3D06
3D07
3D09
3D0B
3D0D
3D0E
3D10
3D13
3D15
3D16
3D17
3D1A
3D1B
3D1D
3D20
3D21
3D23
3D24
3D26
3D29
3D2A
3D2D
3D2E
3D2F
3D30
3D33
3D34
3D37
3D38
3D39
3D3B
3D3D

3C3D
3C3F
3C41
3C42
3C43
3C45
3C48

3E90
D3E7
2601
7C
D3E6
0680
3E7F
4F
D3E5
31AA3D
D3E4
FB
00
C3163D
7A
C600
CA2D3D
78
F600
1F
FE00
CA373D
47
C3333D
79
B0
4F
C3203D
A9
C30D3D
47
7C
EE03
D3E6

MVI 90
Out Control Port
MVI H 01
MOV A,H
OUT C
MVI B 80
MVI A 7F
MOV C,A
OUT B
LXI SP 3DAA
OUT A
IE
NOP
JMP Loop
MOV A,D
ADI 00
JZ Set C
MOV A,B
ORI 00
RAR
CPI 00
JZ Done
MOV B,A
JMP New C
MOV A,C
ORA B
MOV C,A
JMP Shift B
XRA C
JMP Return
MOV B,A
MOV A,H
XRI 03
OUT C

#
#
#
DBE4
EEFF
57
78
E6FF
C21A3D
C33D3D

; Program PPI
Auto-Zero Subroutine
; Close SW1 open SW2
; Initialize SAR bit pointer
; Initialize SAR code
Return
Start

; Port B 4 SAR code

; Dimension stack pointer
; Start A/D

Loop

; Loop until INT asserted

Auto-Zero
; Test A/D output data for zero
Shift B
; Clear carry
; Shift 1 in B right one place
; Is B zero? If yes last
; approximation has been made

Set C
; Set bit in C that is in same
; position as 1 in B
New C

; Clear bit in C that is in

; same position as 1 in B
; then output new SAR code.
; Open SW1, close SW2 then
; proceed with program. Preamp
; is now zeroed.

Done

Normal

Program for processing

proper data values
IN A
XRI FF
MOV D,A
MOV A,B
ANI FF
JNZ Auto-Zero
JMP Normal

Read A/D Subroutine

; Read A/D data

; Invert data
; Is B Reg 4 0? If not stay
; in auto zero subroutine

Note: All numerical values are hexadecimal representations.

FIGURE 20. Software for Auto-Zeroed Differential A/D

5.3 Multiple A/D Converters in a Z-80 Interrupt Driven
Mode (Continued)
The following notes apply:
1) It is assumed that the CPU automatically performs a RST
7 instruction when a valid interrupt is acknowledged (CPU
is in interrupt mode 1). Hence, the subroutine starting address of X0038.
2) The address bus from the Z-80 and the data bus to the Z80 are assumed to be inverted by bus drivers.
3) A/D data and identifying words will be stored in sequential memory locations starting at the arbitrarily chosen address X 3E00.
4) The stack pointer must be dimensioned in the main program as the RST 7 instruction automatically pushes the
PC onto the stack and the subroutine uses an additional
6 stack addresses.

5) The peripherals of concern are mapped into I/O space

with the following port assignments:
HEX PORT ADDRESS
PERIPHERAL
00
MM74C374 8-bit flip-flop
01
A/D 1
02
A/D 2
03
A/D 3
04
A/D 4
05
A/D 5
06
A/D 6
07
A/D 7
This port address also serves as the A/D identifying word in
the program.

30

TL/H/5671 29

FIGURE 21. Multiple A/Ds with Z-80 Type Microprocessor

INTERRUPT SERVICING SUBROUTINE
SOURCE
LOC
OBJ CODE
STATEMENT
COMMENT
0038
E5
PUSH HL
; Save contents of all registers affected by
0039
C5
PUSH BC
; this subroutine.
003A
F5
PUSH AF
; Assumed INT mode 1 earlier set.
003B
21 00 3E
LD (HL),X3E00
; Initialize memory pointer where data will be stored.
003E
0E 01
LD C, X01
; C register will be port ADDR of A/D converters.
0040
D300
OUT X00, A
; Load peripheral status word into 8-bit latch.
0042
DB00
IN A, X00
; Load status word into accumulator.
0044
47
LD B,A
; Save the status word.
0045
79
TEST
LD A,C
; Test to see if the status of all A/Ds have
0046
FE 08
CP, X08
; been checked. If so, exit subroutine
0048
CA 60 00
JPZ, DONE
004B
78
LD A,B
; Test a single bit in status word by looking for
004C
1F
RRA
; a 1 to be rotated into the CARRY (an INT
004D
47
LD B,A
; is loaded as a 1). If CARRY is set then load
004E
DA 5500
JPC, LOAD
; contents of A/D at port ADDR in C register.
0051
0C
NEXT
INC C
; If CARRY is not set, increment C register to point
0052
C3 4500
JP,TEST
; to next A/D, then test next bit in status word.
0055
ED 78
LOAD
IN A, (C)
; Read data from interrupting A/D and invert
0057
EE FF
XOR FF
; the data.
0059
77
LD (HL),A
; Store the data
005A
2C
INC L
005B
71
LD (HL),C
; Store A/D identifier (A/D port ADDR).
005C
2C
INC L
005D
C3 51 00
JP,NEXT
; Test next bit in status word.
0060
F1
DONE
POP AF
; Re-establish all registers as they were
0061
C1
POP BC
; before the interrupt.
0062
E1
POP HL
0063
C9
RET
; Return to original program
31

Ordering Information
0 C TO 70 C

TEMP RANGE

ERROR

g (/4 Bit
Adjusted
g (/2 Bit
Unadjusted
g (/2 Bit
Adjusted
g 1Bit
Unadjusted

0 C TO 70 C

0 C TO 70 C

b 40 C TO a 85 C

ADC0801LCN

PACKAGE OUTLINE

ADC0802LCWM

ADC0802LCV

ADC0802LCN

ADC0803LCWM

ADC0803LCV

ADC0803LCN

ADC0804LCWM

ADC0804LCV

M20BSmall Outline

V20AChip Carrier

TEMP RANGE
g (/4 Bit Adjusted

ERROR

g (/2 Bit Unadjusted

g (/2 Bit Adjusted
g 1Bit Unadjusted

PACKAGE OUTLINE

ADC0804LCN

ADC0805LCN

N20AMolded DIP

b 40 C TO a 85 C

b 55 C TO a 125 C

ADC0801LCJ
ADC0802LCJ
ADC0803LCJ
ADC0804LCJ

ADC0801LJ
ADC0802LJ,
ADC0802LJ/883

J20ACavity DIP

J20ACavity DIP

Connection Diagrams
ADC080X
Dual-In-Line and Small Outline (SO) Packages

ADC080X
Molded Chip Carrier (PCC) Package

TL/H/5671 32

TL/H/567130

See Ordering Information

32

33

Physical Dimensions inches (millimeters)

Dual-In-Line Package (J)

Order Number ADC0801LJ, ADC0802LJ, ADC0801LCJ,
ADC0802LCJ, ADC0803LCJ or ADC0804LCJ
ADC0802LJ/883 or 5962-9096601MRA
NS Package Number J20A

SO Package (M)
Order Number ADC0802LCWM, ADC0803LCWM or ADC0804LCWM
NS Package Number M20B
34

Physical Dimensions inches (millimeters) (Continued)

Molded Dual-In-Line Package (N)

Order Number ADC0801LCN, ADC0802LCN,
ADC0803LCN, ADC0804LCN or ADC0805LCN
NS Package Number N20A

35

ADC0801/ADC0802/ADC0803/ADC0804/ADC0805
8-Bit mP Compatible A/D Converters

Physical Dimensions inches (millimeters) (Continued)

Molded Chip Carrier Package (V)

Order Number ADC0802LCV, ADC0803LCV or ADC0804LCV
NS Package Number V20A

LIFE SUPPORT POLICY

NATIONALS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018

2. A critical component is any component of a life

support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.

National Semiconductor
Europe
Fax: (a49) 0-180-530 85 86
Email: cnjwge @ tevm2.nsc.com
Deutsch Tel: (a49) 0-180-530 85 85
English Tel: (a49) 0-180-532 78 32
Fran3ais Tel: (a49) 0-180-532 93 58
Italiano Tel: (a49) 0-180-534 16 80

National Semiconductor
Hong Kong Ltd.
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960

National Semiconductor
Japan Ltd.
Tel: 81-043-299-2309
Fax: 81-043-299-2408

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.