Indium
Indium
Indium
Cristian Tudor
Applications Engineer Eastern Europe
Indium Corporation of Europe
Mobile: +40 723 171 398
E-mail: [email protected]
Web: www.indium.com
Indium Corporation is
a premiere materials
supplier to Global
Industries:
Electronics assembly
Semiconductor
Solar
Thin-film
Thermal
management
Specialty chemical
Advanced Materials
POP Materials
Engineered Materials
7 INDIUM CORPORATION CONFIDENTIAL
Our FULL suite of products
High reliability
Server, telecommunication, automotive
Very High Reliability
Military, Aerospace, Medical
Miniaturization
Multi-Functionality
PDA, Cell Phone, IPOD
Board Real Estate is a Premium
Components Continue to Shrink
High Density on Large Boards
0201 on Servers
CSP on Motherboards
9 INDIUM CORPORATION CONFIDENTIAL
Solder Paste
No-Clean or Water Soluble
1 Stencil Material
2 Board Support
3 Gasketing
4 Print Speed
5 Squeegee Pressure
6 Separation Speed
7 Print Alignment
8
Oxidation
Barrier in the
flux is the key to
achieve good
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18 INDIUM CORPORATION CONFIDENTIAL
CORPORATION CONFIDENTIAL
coalescence
Graping Resistance
What is graping?
Automotive
Infotainment Defence
Leisure
Volume of PCBs
Great flux design
> 150mm / Sec
hugely demanding
Low pressure Requires
on the chemistry
Small Apertures
Profile adjustment
will help
Excessively
oxidized flux remnant
SMT Voiding too high in
components viscosity
Mechanisms cooler reflow
Check MSL and
storage conditions profile to allow
of components / more solvents in
change flux remnant
component lot
Linear Ramp
Soak from
of 1-1.5C/sec Peak temp ~
180/190C to No change in
from ambient 255C for
210C for 120 cool down
to 180C 60sec TAL
150sec
190C
Applications: Applications:
Military Hand Held
Defence devices
Security Servers
Oil and Set top boxes
Gas
Decrease of Ag content
from 4% to 1%
decreases the thermal
fatigue life (first failure)
by a factor of about 2
SAC w/ SAC w/
Dopants (Mn Dopants (Mn
& Ti) > SAC & Ti) has good
305 this thermal
alloy was cycling as well
developed by as good drop
Indium Corp performance
BEST ALL
ROUNDER
Water Soluble
Indium
Pb-Free
Solder Paste 3.2HF
No Clean
Sn/Pb Solder Indium NC-
Paste SMQ92J
Water Soluble
Sn/Pb Solder Indium 6.3
Paste
SAC WF-9945,
8.9 CW-807 TAC20B FP-500
0603/0402 WF-7745
8.9HFA,
SAC WF-9942,
8.9HF1, CW-802 TAC20B FP-500
0603/0402 WF-7742
8.9HF
Probe-
Extended No-Clean Halide-Free
testable
open time
residue
Strong initial
High
tack strength Air or N2 Fine Pitch
humidity
and long- Atmosphere Capability
resistance
term stability
Compatibility
with
Clear, benign No-Clean Halide-Free
common
residue
conformal
coatings
Underside
Superior Exceptional Outstanding
Stencil Wipe:
stencil life wetting in print
Once every
>12Hr air reflow characteristic
10-25 prints
Alloy Choices
Indium Based
Alloy considerations
Bismuth Based
Alloy considerations
Complimentary Products
Tacfluxes
INDIUM NC-SMQ80
Exceptional
No-clean
wetting in air
residue
reflow
6 months at
storage
Halide-free temperatures
of -20 to
+5C.
Temperature
Indium 5.7LT
Formulated for
use with the Exceptional
Pb-Free eutectic Clear wetting in
solution 58Bi/42Sn & residue an air
57Bi/42Sn/1Ag
alloys
reflow
Bi based In based
TacFluxes alloys
021 or 055
alloys
012
Types
Acrylic
Epoxy
Polyurethane
Silicon
Combinations of above
50 INDIUM CORPORATION CONFIDENTIAL
Definition of Compatibility
IPC-CC-830B
Conformal Coatings
IPC Test Methods
SIR Conformal Coating
SIR Solder Paste Flux Residue
Peel/Adhesion Test Methods
Conformal Coating
Other Industry Test Methods exist
Industry specific requirements
Humiseal
UK based
Lackwerke Peters
Germany based
Other Companies are available...
Dow Corning
Electrolube
6 Solder Pastes
SnPb
NC-SMQ92H / 8.9HF SnPb
SAC305
5.1AT / 5.8LS / 8.9 / 8.9HF
5 Conformal Coatings
Humiseal
1R32A-2 / UV40-250
Peters
SL 1301 / SL 1307 / 1600 E
30 potential pairings!!
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Summary of Findings
After
Global Applications Engineering co-
operation
Over 100 test coupons prepared &
processed
168 hours under test conditions
We have identified pairings
Acrylic/Acrylate conformal coating
formulations work best
10
9.69 9.74
9.62
9.4
9.17
9
Log Ohms
8.54
6
92H 5.8LS 5.1AT 8.9 8.9HF SAC 8.9HFSn63
Solder paste variant
10 9.91
9.73
9.54
9.32
9.05 9.12
9
Log Ohms
6
92H 5.8LS 5.1AT 8.9 8.9HF SAC 8.9HFSn63
Solder paste variant
Temperature Constraints
What is the max operating temp / reliability testing temp?
End-Reliability Requirements
Au/Sn is the strongest solder (highest tensile & shear
strength)
In-containing alloys are ductile takes care of CTE
mismatch
great for heat transfer
Bi-containing alloys are brittle and are not suitable for
drop / vibration applications
Step Soldering
Multiple Sequential Solder Operations
Cannot re-melt existing solder joints
Alloy Selection - T of 30-50C between melting
point of higher-temp alloy & max reflow temp of
older lower-temp alloy
Example Au/Sn (280C); Sn/Ag (221C);
In/Pb/Ag (154C)
Material Flow
Ingot
Extrusion Punch Preform Packaging
Cast
Punch
Die technology determines the
X-Y dimensional tolerance
Our knowledge of alloy
properties is critical to our
success in punch
Die design
Release mechanism
Handling
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Preforms Manufacturing Process:
Bulk
Stack pack
Layer pack
Tape and reel
Waffle pack
Custom packaging
Without
Preform
Comparison
With Preform
Solder Fortification
in Tape and Reel
Without
Preform Without
Preform
With
Preform
With
Preform
Preform RF Shield Attach
Depending on the paste
outline, preforms can
be engineered to sit in
the gaps or on the
sides of the shield on
top of solder paste
- 0.015 cubes
- Horse-shoe
- Longer preform
strips
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Fuse for Automotive Blower Motor
Special Shape Horse Shoe
Integrated Preform
Integrated Preform
Soldering a fiber
optic wire to the
housing using
flux-coated
preforms
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Flux Coated Preform Void
Reduction for RF Power Amp
Challenge: Void (>30%) &
variability when using paste in
convection reflow
Goal: Voiding under PA < 20%
Flux-Coated preform
Void reduced from
Way lesser flux
when compared to
40% to under 20%
solder paste
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Thank you!