MPU-6050 Product Specification PDF
MPU-6050 Product Specification PDF
MPU-6050 Product Specification PDF
1 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
CONTENTS
1 REVISION HISTORY ...................................................................................................................................5
2 PURPOSE AND SCOPE .............................................................................................................................6
3 PRODUCT OVERVIEW ...............................................................................................................................6
4 APPLICATIONS...........................................................................................................................................7
5 FEATURES ..................................................................................................................................................8
5.1 GYROSCOPE FEATURES ....................................................................................................................... 8
5.2 ACCELEROMETER FEATURES ...............................................................................................................8
5.3 ADDITIONAL FEATURES ........................................................................................................................8
5.4 MOTION PROCESSING ..........................................................................................................................9
5.5 CLOCKING ...........................................................................................................................................9
6 ELECTRICAL CHARACTERISTICS .........................................................................................................10
6.1 GYROSCOPE SPECIFICATIONS ............................................................................................................10
6.2 ACCELEROMETER SPECIFICATIONS ..................................................................................................... 11
6.3 ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................12
6.4 ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................13
6.5 ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................14
6.6 ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................15
6.7 I2C TIMING CHARACTERIZATION..........................................................................................................16
6.8 SPI TIMING CHARACTERIZATION (MPU-6000 ONLY) ...........................................................................17
6.9 ABSOLUTE MAXIMUM RATINGS ...........................................................................................................18
7 APPLICATIONS INFORMATION ..............................................................................................................19
7.1 PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................19
7.2 TYPICAL OPERATING CIRCUIT.............................................................................................................20
7.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................20
7.4 RECOMMENDED POWER-ON PROCEDURE ...........................................................................................21
7.5 BLOCK DIAGRAM ...............................................................................................................................22
7.6 OVERVIEW ........................................................................................................................................22
7.7 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ................................23
7.8 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................23
7.9 DIGITAL MOTION PROCESSOR ............................................................................................................23
7.10 PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................23
7.11 AUXILIARY I2C SERIAL INTERFACE ......................................................................................................24
7.12 SELF-TEST ........................................................................................................................................24
2 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
7.13 MPU-60X0 SOLUTION FOR 9-AXIS SENSOR FUSION USING I2C INTERFACE ..........................................25
7.14 MPU-6000 USING SPI INTERFACE .....................................................................................................26
8 PROGRAMMABLE INTERRUPTS............................................................................................................27
8.1 FREE FALL, MOTION, AND ZERO MOTION SIGNAL PATHS .....................................................................28
8.2 FREE FALL INTERRUPT ....................................................................................................................... 28
8.3 MOTION INTERRUPT ...........................................................................................................................28
8.4 ZERO MOTION INTERRUPT..................................................................................................................29
9 CLOCKING ................................................................................................................................................30
9.1 INTERNAL CLOCK GENERATION ..........................................................................................................30
9.2 SENSOR DATA REGISTERS .................................................................................................................30
9.3 FIFO ................................................................................................................................................30
9.4 INTERRUPTS ......................................................................................................................................30
9.5 DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................31
9.6 BIAS AND LDO ..................................................................................................................................31
9.7 CHARGE PUMP ..................................................................................................................................31
10 DIGITAL INTERFACE ...............................................................................................................................32
10.1 I2C AND SPI (MPU-6000 ONLY) SERIAL INTERFACES ..........................................................................32
10.2 I2C INTERFACE ..................................................................................................................................32
10.3 I2C COMMUNICATIONS PROTOCOL ......................................................................................................32
10.4 I2C TERMS ........................................................................................................................................35
10.5 SPI INTERFACE (MPU-6000 ONLY) ....................................................................................................36
11 SERIAL INTERFACE CONSIDERATIONS (MPU-6050) ..........................................................................37
11.1 MPU-6050 SUPPORTED INTERFACES ................................................................................................. 37
11.2 LOGIC LEVELS ...................................................................................................................................37
11.3 LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 0 ..................................................................................38
11.4 LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 1 ..................................................................................39
12 ASSEMBLY ...............................................................................................................................................40
12.1 ORIENTATION OF AXES ......................................................................................................................40
12.2 PACKAGE DIMENSIONS ......................................................................................................................41
12.3 PCB DESIGN GUIDELINES: .................................................................................................................42
12.4 ASSEMBLY PRECAUTIONS ..................................................................................................................43
12.4.1 GYROSCOPE SURFACE MOUNT GUIDELINES ...................................................................................43
12.4.2 EXPOSED DIE PAD PRECAUTIONS ..................................................................................................43
12.4.3 TRACE ROUTING ...........................................................................................................................44
3 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
4 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
1 Revision History
Revision
Date Revision Description
5 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
3 Product Overview
The MPU-60X0 Motion Processing Unit (MPU) is the worlds first motion processing solution with
integrated 9-axis sensor fusion for handset and tablet applications, game controllers, motion pointer remote
controls, and other consumer devices. The MPU-60X0 has an embedded 3-axis MEMS gyroscope, 3-axis
MEMS accelerometer and Digital Motion Processor (DMP) hardware accelerator engine with an auxiliary
I2C port that interfaces to third party digital sensors, such as magnetometers. Interfacing with a 3-axis
magnetometer delivers a complete 9-axis sensor fusion output to the MPUs primary I2C or SPI port. (SPI is
available on MPU-6000 only). This combines acceleration and rotational motion plus heading information into
a single data stream for the application. This motion processing technology integration provides a smaller
footprint and has inherent cost advantages compared to discrete gyroscope plus accelerometer solutions.
The MPU-60X0 is also designed to interface with multiple non-inertial digital sensors, such as pressure
sensors, on its auxiliary I2C port. The MPU-60X0 is a second generation motion processor and is footprint
compatible with the MPU-30X0 family.
The MPU-60X0 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs
and three 16-bit ADCs for digitizing the accelerometer outputs. For precision tracking of both fast and slow
motions, the parts feature a user-programmable gyroscope full-scale range of 250, 500, 1000, and
2000/sec (dps) and a user-programmable accelerometer full-scale range of 2g, 4g, 8g, and 16g.
An on-chip 1024 Byte FIFO helps lower system power consumption by allowing the system processor to
read the sensor data in bursts and then enter a low-power mode as the FIFO collects more data. With all the
necessary on-chip processing and sensor components required to support many motion-based use cases,
the MPU-60X0 uniquely supports a variety of advanced motion-based applications entirely on-chip and
therefore is instrumental in enabling low-power motion processing in portable applications with reduced
processing requirements for the system processor. By providing an integrated sensor fusion output, the DMP
in the MPU-60X0 offloads the intensive motion processing computation requirements from the system
processor, minimizing the need for frequent polling of the motion sensor output.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz
(MPU-6000 only). For applications requiring faster communications, reading of the sensor and interrupt
registers may be performed using SPI at 20MHz (MPU-6000 only). Additional features include an embedded
temperature sensor and an on-chip oscillator with 1% variation over the operating temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-60X0
package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest
performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer
electronic devices. The part features a robust 10,000g shock tolerance, and has programmable low-pass
filters for the gyroscopes, accelerometers, and the on-chip temperature sensor.
For power supply flexibility, the MPU-60X0 operates from VDD power supply voltages of 2.5V5%, 3.0V5%,
or 3.3V5%. Additionally, the MPU-6050 provides a VLOGIC reference pin (in addition to its analog supply
pin, VDD), which sets the logic levels of its I2C interface. The VLOGIC voltage may be 1.8V5% or VDD.
6 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
The MPU-6000 and MPU-6050 are identical, except that the MPU-6050 supports the I2C serial interface only,
and has a separate VLOGIC reference pin. The MPU-6000 supports both I2C and SPI interfaces and has a
single supply pin, VDD, which is both the devices logic reference supply and the analog supply for the part.
The table below outlines these differences:
4 Applications
x BlurFree technology (for Video/Still Image Stabilization)
x AirSign technology (for Security/Authentication)
x TouchAnywhere technology (for no touch UI Application Control/Navigation)
x MotionCommand technology (for Gesture Short-cuts)
x Motion-enabled game and application framework
x InstantGesture iG gesture recognition
x Location based services, points of interest, and dead reckoning
x Handset and portable gaming
x Motion-based game controllers
x 3D remote controls for Internet connected DTVs and set top boxes, 3D mice
x Wearable sensors for health, fitness and sports
x Toys
7 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
5 Features
5.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-60X0 includes a wide range of features:
x Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of 250, 500, 1000, and 2000/sec
x External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
x Integrated 16-bit ADCs provide simultaneous sampling of gyros
x Enhanced bias and sensitivity temperature stability reduces the need for user calibration
x Improved low-frequency noise performance
x Digitally-programmable low-pass filter
x Gyroscope operating current: 5mA
x Standby current: 5A
x Factory calibrated sensitivity scale factor
x User self-test
8 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
x 1MHz SPI serial interface for communicating with all registers (MPU-6000 only)
x 20MHz SPI serial interface for reading of sensor and interrupt registers (MPU-6000 only)
x MEMS structure hermetically sealed and bonded at wafer level
x RoHS and Green compliant
5.5 Clocking
x On-chip timing generator 1% frequency variation over full temperature range
x Optional external clock inputs of 32.768kHz or 19.2MHz
9 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
6 Electrical Characteristics
6.1 Gyroscope Specifications
VDD = 2.5V5%, 3.0V5%, or 3.3V5%, VLOGIC (MPU-6050 only) = 1.8V5% or VDD, TA = 25C
PARAMETER CONDITIONS MIN TYP MAX UNITS NOTES
GYROSCOPE SENSITIVITY
Full-Scale Range FS_SEL=3 2000 /s
FS_SEL=2 1000 /s
FS_SEL=1 500 /s
FS_SEL=0 250 /s
Gyroscope ADC Word Length 16 Bits
Sensitivity Scale Factor FS_SEL=0 131 LSB/(/s)
FS_SEL=1 65.5 LSB/(/s)
FS_SEL=2 32.8 LSB/(/s)
FS_SEL=3 16.4 LSB/(/s)
Sensitivity Scale Factor Tolerance 25C -3 +3 %
Sensitivity Scale Factor Variation Over 2 %
Temperature
Nonlinearity Best fit straight line; 25C 0.2 %
Cross-Axis Sensitivity 2 %
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance 25C 20 /s
ZRO Variation Over Temperature -40C to +85C 20 /s
Power-Supply Sensitivity (1-10Hz) Sine wave, 100mVpp; VDD=2.5V 0.2 /s
Power-Supply Sensitivity (10 - 250Hz) Sine wave, 100mVpp; VDD=2.5V 0.2 /s
Power-Supply Sensitivity (250Hz - 100kHz) Sine wave, 100mVpp; VDD=2.5V 4 /s
Linear Acceleration Sensitivity Static 0.1 /s/g
GYROSCOPE NOISE PERFORMANCE FS_SEL=0
Total RMS Noise DLPFCFG=2 (100Hz) 0.05 /s-rms
Low-frequency RMS noise Bandwidth 1Hz to10Hz 0.033 /s-rms
Rate Noise Spectral Density At 10Hz 0.005 /s/ Hz
GYROSCOPE MECHANICAL
FREQUENCIES
X-Axis 30 33 36 kHz
Y-Axis 27 30 33 kHz
Z-Axis 24 27 30 kHz
SELF TEST RESPONSE
X, Y, and Z axes 50 /s
OUTPUT DATA RATE
Programmable 4 8,000 Hz
GYROSCOPE START-UP TIME DLPFCFG=0
ZRO Settling to 1/s of Final 30 ms
10 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
11 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
12 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
13 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
14 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
15 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
16 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
17 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
Parameter Rating
Supply Voltage, VDD -0.5V to +6V
VLOGIC Input Voltage Level (MPU-6050) -0.5V to VDD + 0.5V
REGOUT -0.5V to 2V
Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT, -0.5V to VDD + 0.5V
SCL, SDA)
CPOUT (2.5V VDD 3.6V ) -0.5V to 30V
Acceleration (Any Axis, unpowered) 10,000g for 0.3ms
Operating Temperature Range -40C to +105C
Storage Temperature Range -40C to +125C
Electrostatic Discharge (ESD) Protection 2kV (HBM);
200V (MM)
Latch-up 60mA @ 125C
JEDEC Condition B
18 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
7 Applications Information
7.1 Pin Out and Signal Description
MPU- MPU-
Pin Number Pin Name Pin Description
6000 6050
1 Y Y CLKIN Optional external reference clock input. Connect to GND if unused.
2
6 Y Y AUX_DA I C master serial data, for connecting to external sensors
2
7 Y Y AUX_CL I C Master serial clock, for connecting to external sensors
8 Y /CS SPI chip select (0=SPI mode)
8 Y VLOGIC Digital I/O supply voltage
2
9 Y AD0 / SDO I C Slave Address LSB (AD0); SPI serial data output (SDO)
2
9 Y AD0 I C Slave Address LSB (AD0)
10 Y Y REGOUT Regulator filter capacitor connection
11 Y Y FSYNC Frame synchronization digital input
12 Y Y INT Interrupt digital output (totem pole or open-drain)
13 Y Y VDD Power supply voltage and Digital I/O supply voltage
18 Y Y GND Power supply ground
19, 21, 22 Y Y RESV Reserved. Do not connect.
20 Y Y CPOUT Charge pump capacitor connection
2
23 Y SCL / SCLK I C serial clock (SCL); SPI serial clock (SCLK)
2
23 Y SCL I C serial clock (SCL)
2
24 Y SDA / SDI I C serial data (SDA); SPI serial data input (SDI)
2
24 Y SDA I C serial data (SDA)
2, 3, 4, 5, 14, Y Y NC Not internally connected. May be used for PCB trace routing.
15, 16, 17
SCL/SCLK
SDA/SDI
CPOUT
CPOUT
RESV
RESV
RESV
RESV
RESV
RESV
SDA
SCL
M
MP PU-
U- 600
60
50 0
AUX_CL
/CS
AD0/SDO
REGOUT
FSYNC
INT
AUX_CL
VLOGIC
AD0
REGOUT
FSYNC
INT
19 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
* MPU-6050 Only.
** Currently, the part has been characterized only with 10nF capacitor. Characterization with a 2.2nF value is pending.
20 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
21 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
7.6 Overview
The MPU-60X0 is comprised of the following key blocks and functions:
x Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
x Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
x Digital Motion Processor (DMP) engine
x Primary I2C and SPI (MPU-6000 only) serial communications interfaces
x Auxiliary I2C serial interface for 3rd party magnetometer & other sensors
x Clocking
x Sensor Data Registers
x FIFO
x Interrupts
x Digital-Output Temperature Sensor
x Self-test
x Bias and LDO
x Charge Pump
22 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
7.7 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-60X0 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X, Y, and Z axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a
vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to 250, 500, 1000, or 2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable
low-pass filters enable a wide range of cut-off frequencies.
7.8 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The tri-axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis
induces displacement on the respective proof mass, and capacitive sensors detect the displacement
differentially. The architecture reduces the susceptibility to fabrication variations as well as to thermal drift.
When the device sits on a flat surface, it will measure 0g on the X- and Y-axes and +1g on the Z-axis.
Accelerometer scale factor is calibrated at the factory and is nominally independent of supply voltage. Each
sensor has a dedicated sigma-delta ADC for providing digital outputs. The full scale range of the digital
output can be adjusted to 2g, 4g, 8g, or 16g.
23 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
The I2C master can be configured to read up to 24 bytes from up to 5 auxiliary sensors.
x Pass-Through Mode: allows an external system processor to act as master and directly
communicate to the external sensor connected to the auxiliary I2C bus pins (AUX_DA and AUX_CL).
This is useful for configuring the external sensor, or for keeping the MPU-60X0 in a low-power mode,
when only the external sensor is to be used. In this mode, the auxiliary I2C bus control logic (third-
party sensor interface block) of the MPU-60X0 is disabled, and the auxiliary I2C pins AUX_DA and
AUX_CL (Pins 6 and 7) are connected to the main I2C bus (Pins 23 and 24) through analog
switches.
7.12 Self-Test
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each
measurement axis can be activated by controlling the bits of the GYRO_CONFIG and ACCEL_CONFIG
control registers. When self-test is activated, the electronics cause the sensors to be actuated and produce
an output signal. The sensor reading is determined by the sum of the sensor output and the self-test
response. The self-test response for each accelerometer axis is defined in the specification table to be
nominally 0.5g. Similarly, for the gyro axes, self test allows the proof masses to be moved equivalent to a
pre-defined Coriolis force, resulting in a change in sensor output. The self-test response for each gyroscope
axis is defined in the specification table to be nominally 50/s.
24 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
7.13 MPU-60X0 Solution for 9-axis Sensor Fusion Using I2C Interface
In the figure below, the system processor is an I2C master to the MPU-60X0. In addition, the MPU-60X0 is an
I2C master to the optional external compass sensor. The MPU-6000 has limited capabilities as an I2C
Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.
The MPU-6000 has an interface bypass multiplexer, which connects the system processor I2C bus pins 23
and 24 (SDA and SCL) directly to the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
should be disabled so the MPU-6000 auxiliary I2C master can take control of the sensor I2C bus and gather
data from the auxiliary sensors.
I2C master control is discussed in more detail in Section 13 (Register Descriptions).
25 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
In the figure below, the system processor is an SPI master to the MPU-6000. Pins 8, 9, 23, and 24 are used
to support the /CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are
shared with the I2C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I2C bus
through the interface bypass multiplexer, which connects the processor I2C interface pins to the sensor I2C
interface pins.
Since the MPU-6000 has limited capabilities as an I2C Master, and depends on the system processor to
manage the initial configuration of any auxiliary sensors, another method must be used for programming the
sensors on the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
When using SPI communications between the MPU-6000 and the system processor, configuration of
devices on the I2C sensor bus can be achieved by performing single byte read and write transactions on any
device and register on the auxiliary I2C bus by using I2C Slave 4 Control (see Registers 49 to 53). Once the
external sensors are configured, the MPU-6000 has the capability to perform single or multi-byte reads using
the sensor I2C bus. The Slave 0 to Slave 3 controllers may have the read result written to the FIFO buffer as
well as to the sensor registers.
26 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
8 Programmable Interrupts
The MPU-60X0 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources
Interrupt Name Module
Free Fall Detection Free Fall
Motion Detection Motion
Zero Motion Detection Zero Motion
FIFO Overflow FIFO
PLL Ready PLL
DMP Interrupt DMP
Data Ready Sensor Registers
2 2
I C Master errors: Lost Arbitration, NACKs I C Master
2 2
I C Slave 4 I C Master
Interrupts are described in the register description (Section 13) which provides more information about their
enable/disable register and flag register. Some interrupt sources are explained in detail below.
27 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
The plots in the figure above show an example acceleration input signal (simplified to only show one axis),
qualifying sample counter, and Free Fall flag.
28 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
counter threshold, a motion interrupt is triggered. The axis and polarity which caused the interrupt to be
triggered is flagged in the MOT_DETECT_STATUS register.
Like with Free Fall detection, Motion detection has a configurable acceleration threshold MOT_THR specified
in steps of 1 mg. The counter threshold MOT_DUR is specified in steps of 1 ms. The decrement rate has the
same options as Free Fall detection, and is specified in the MOT_DETECT_CTRL register.
8.4 Zero Motion Interrupt
Zero Motion detection capability uses the digital high pass filter (DHPF) and a similar threshold scheme to
Free Fall detection. Each axis of the high passed accelerometer measurement must have an absolute value
less than a threshold specified in the ZRMOT_THR register. This increments a counter, which generates an
interrupt when reaching the threshold specified in ZRMOT_DUR.
Unlike Free Fall or Motion detection, Zero Motion detection triggers an interrupt both when Zero Motion is
first detected and when Zero Motion is no longer detected. While Free Fall and Motion are indicated with a
flag which clears after being read, reading the state of the Zero Motion detected from the
MOT_DETECT_STATUS register does not clear its status.
29 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
9 Clocking
9.1 Internal Clock Generation
The MPU-60X0 has a flexible clocking scheme, allowing for a variety of internal or external clock sources for
the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
x An internal relaxation oscillator
x Any of the X, Y, or Z gyros (MEMS oscillators with a variation of 1% over temperature)
9.3 FIFO
The MPU-60X0 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines what data goes into it, with possible choices being gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
9.4 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) Digital Motion Processor Done (programmable function); (3) new data is available to be read
(from the FIFO and Data registers); (4) accelerometer event interrupts; and (5) the MPU-60X0 did not
30 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
receive an acknowledge from an auxiliary sensor on the secondary I2C bus. The interrupt status can be read
from the Interrupt Status register.
31 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
10 Digital Interface
2
10.1 I C and SPI (MPU-6000 only) Serial Interfaces
The internal registers and memory of the MPU-6000/MPU-6050 can be accessed using either I2C at 400 kHz
or SPI at 1MHz (MPU-6000 only). SPI operates in four-wire mode.
Serial Interface
Pin Number MPU-6000 MPU-6050 Pin Name Pin Description
8 Y /CS SPI chip select (0=SPI enable)
8 Y VLOGIC Digital I/O supply voltage. VLOGIC must be VDD at all times.
2
9 Y AD0 / SDO I C Slave Address LSB (AD0); SPI serial data output (SDO)
2
9 Y AD0 I C Slave Address LSB
2
23 Y SCL / SCLK I C serial clock (SCL); SPI serial clock (SCLK)
2
23 Y SCL I C serial clock
2
24 Y SDA / SDI I C serial data (SDA); SPI serial data input (SDI)
2
24 Y SDA I C serial data
Note:
To prevent switching into I2C mode when using SPI (MPU-6000), the I2C interface should be disabled by
setting the I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting the
time specified by the Start-Up Time for Register Read/Write in Section 3.2.
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-60X0 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-60X0 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
determined by the logic level on pin AD0. This allows two MPU-60X0s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high).
32 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
33 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
To write the internal MPU-60X0 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-60X0 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-60X0 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-60X0 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
34 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
To read the internal MPU-60X0 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-60X0, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-60X0 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.
Signal Description
S Start Condition: SDA goes from high to low while SCL is high
AD Slave I2C address
W Write bit (0)
R Read bit (1)
ACK Acknowledge: SDA line is low while the SCL line is high at the
9th clock cycle
NACK Not-Acknowledge: SDA line stays high at the 9th clock cycle
RA MPU-60X0 internal register address
DATA Transmit or received data
P Stop condition: SDA going from low to high while SCL is high
35 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
SPI is a 4-wire synchronous serial interface that uses two control and two data lines. The MPU-6000 always
operates as a Slave device during standard Master-Slave SPI operation. With respect to the Master, the
Serial Clock output (SCLK), the Data Output (SDO) and the Data Input (SDI) are shared among the Slave
devices. The Master generates an independent Chip Select (/CS) for each Slave device; /CS goes low at the
start of transmission and goes back high at the end. The Serial Data Output (SDO) line remains in a high-
impedance (high-z) state when the device is not selected so it does not interfere with any active devices.
SPI Operational Features
1. Data is delivered MSB first and LSB last
2. Data is latched on rising edge of SCLK
3. Data should be transitioned on the falling edge of SCLK
4. SCLK frequency is 1MHz max
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB LSB
R/W A6 A5 A4 A3 A2 A1 A0
Each SPI slave requires its own Chip Select (/CS) line. SDO, SDI and SCLK lines are shared. Only one /CS
line is active (low) at a time ensuring that only one slave is selected at a time. The /CS lines of other slaves
are held high which causes their respective SDO pins to be high-Z.
36 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
AUX_VDDIO
MICROPROCESSOR LOGIC LEVELS AUXILLARY LOGIC LEVELS
(Pins: SDA, SCL, AD0, CLKIN, INT) (Pins: AUX_DA, AUX_CL)
0 VLOGIC VLOGIC
1 VLOGIC VDD
37 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
The figure below depicts a sample circuit with a third party magnetometer attached to the auxiliary I2C bus. It
shows logic levels and voltage connections for AUX_VDDIO = 0. Note: Actual configuration will depend on
the auxiliary sensors used.
Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL
(0 = set output levels relative to VLOGIC)
2. Other MPU-6050 logic IO is always referenced to VLOGIC.
38 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
The figure below depicts a sample circuit with a third party magnetometer attached to the auxiliary I2C bus. It
shows logic levels and voltage connections for AUX_VDDIO = 1. This configuration is useful when the
auxiliary sensor has only one supply for logic and power. Note: Actual configuration will depend on the
auxiliary sensors used.
I/O Levels and Connections for Two Example Power Configurations (AUX_VDDIO = 1)
Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL. AUX_VDDIO = 1 sets
output levels relative to VDD.
2. Other MPU-6050 logic IO is always referenced to VLOGIC.
3. Third-party auxiliary device logic levels are referenced to VDD. Setting INT1 and INT2 to open drain
configuration provides voltage compatibility when VDD VLOGIC. When VDD = VLOGIC, INT1 and
INT2 may be set to push-pull outputs, and external pull-up resistors are not needed.
39 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
12 Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
40 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
1 19 24
18 I
18 1
S1
C 0.16
f
b
E E2
13 6
6
13 L1 (12x) 12 7
7 12 A1
D
D2
A L(12x)
S
S
R
SYMBOLS DIMENSIONS IN MILLIMETERS
MIN NOM MAX
A 0.85 0.90 0.95
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
c --- 0.20 REF. ---
D 3.90 4.00 4.10
D2 2.95 3.00 3.05
E 3.90 4.00 4.10
E2 2.75 2.80 2.85
e --- 0.50 ---
f (e-b) 0.20 0.25 0.32
L 0.30 0.35 0.40
L1 0.35 0.40 0.45
I 0.20 0.25 0.30
R 0.05 --- 0.10
s 0.05 --- 0.15
S1 0.15 0.20 0.25
41 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
D3
D
PIN 1 D2
IDENTIFIER
24 19
e 1 18
b c E2 E E3
6 13 L3 L1
7 12
L2
Tout
Tout Tin
L
PCB Lay-out Diagram
42 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
43 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
changes due to package thermo-mechanical stress. There is no electrical connection between the pad and
the CMOS.
The table below shows the cross-axis sensitivity as a percentage of the specified gyroscopes sensitivity for a
given orientation error.
44 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error with
respect to the package.
x Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
x Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
45 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
46 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40C and <90% RH
After opening moisture-sealed bag 168 hours -- Storage conditions: ambient 30C at 60%RH
47 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
Tape Dimensions
48 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
User Direction of
Package Orientation Feed
Cover Tape
(Anti Static)
Label Carrier Tape
Pin 1
(Anti Static)
Terminal Tape
Reel
Reel Specifications
Quantity Per Reel 5,000
Reels per Box 1
Boxes Per Carton (max) 3 full pizza boxes packed in the center of the
carton, buffered by two empty pizza boxes (front
and back).
Pcs/Carton (max) 15,000
49 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
12.7 Label
Location of Label
12.8 Packaging
Anti-static Label
Moisture-Sensitive
Caution Label
Tape & Reel Label
50 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
13 Reliability
13.1 Qualification Test Policy
InvenSenses products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-60X0 followed the JEDEC 47G.01 Standards, Stress-Test-Driven
Qualification of Integrated Circuits, with the individual tests described below.
13.2 Qualification Test Plan
Accelerated Life Tests
TEST Method/Condition Lot Sample Acc /
Quantity / Lot Reject
Criteria
High Temperature JEDEC JESD22-A108C, Dynamic, 3 77 (0/1)
Operating Life 3.63V biased, Tj>125C
(HTOL/LFR) [read-points 168, 500, 1000 hours]
Highly Accelerated Stress JEDEC JESD22-A118 3 77 (0/1)
Test (1) (HAST) Condition A, 130C, 85%RH, 33.3 psia.,
unbiased, [read-point 96 hours]
High Temperature JEDEC JESD22-A103C, Cond. A, 125C, 3 77 (0/1)
Storage Life (HTS) Non-Biased Bake
[read-points 168, 500, 1000 hours]
51 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
14 Environmental Compliance
The MPU-60X0 is RoHS and Green compliant.
The MPU-60X0 is in full environmental compliance as evidenced in report HS-MPU-6000A, Materials
Declaration Data Sheet.
52 of 53
Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 1.0
Release Date: 11/24/2010
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
TM TM TM TM
InvenSense is a registered trademark of InvenSense, Inc. MPU , MPU-6000 , MPU-6050 , MPU-60X0 , Motion Processing Unit
TM TM TM
, Digital Motion Processing , and DMP are trademarks of InvenSense, Inc.
53 of 53